Quad-Channel, 5 kV Isolators with Integrated DC-to-DC Converter Data Sheet ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404 FEATURES FUNCTIONAL BLOCK DIAGRAMS isoPower integrated, isolated dc-to-dc converter Regulated 5 V or 3.3 V output V 1 OSC RECT REG 16 V DD1 ISO Up to 400 mW output power GND 2 15 GND 1 ISO 16-lead SOIC wide body package (RW-16) V /V 3 14 V /V IA OA IA OA 4-CHANNEL iCOUPLER CORE 16-lead SOIC wide body package with enhanced V /V 4 13 V /V IB OB IB OB ADuM6400/ADuM6401/ creepage (RI-16-1) V /V 5 12 V /V IC OC ADuM6402/ADuM6403/ IC OC Quad dc-to-25 Mbps (NRZ) signal isolation channels ADuM6404 V /V 6 11 V /V ID OD ID OD Schmitt triggered inputs V 7 10 V DDL SEL High temperature operation: 105C maximum GND 8 9 GND 1 ISO High common-mode transient immunity: >25 kV/s Safety and regulatory approvals (RI-16-1 package) Figure 1. UL recognition V V IA OA 3 14 5000 V rms for 1 minute per UL 1577 V V IB OB 4 13 CSA Component Acceptance Notice 5A (pending) V ADuM6400 V IC OC 5 12 V V IEC 60601-1: 250 V rms ID OD 6 11 IEC 60950-1: 400 V rms Figure 2. ADuM6400 VDE certificate of conformity V V DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 IA OA 3 14 V V V = 846 V peak IB OB IORM 4 13 V ADuM6401 V IC OC 5 12 APPLICATIONS V V OD ID 6 11 RS-232/RS-422/RS-485 transceivers Figure 3. ADuM6401 Medical isolation V V AC/DC power supply start-up bias and gate drives IA OA 3 14 V V Isolated sensor interfaces IB OB 4 13 V ADuM6402 V OC IC 5 12 GENERAL DESCRIPTION V V OD ID 6 11 The ADuM6400/ADuM6401/ADuM6402/ADuM6403/ 1 Figure 4. ADuM6402 ADuM6404 are quad-channel digital isolators with isoPower, V V an integrated, isolated dc-to-dc converter. Based on the Analog IA OA 3 14 V V OB IB Devices, Inc., iCoupler technology, the dc-to-dc converter provides 4 13 V ADuM6403 V OC IC up to 400 mW of regulated, isolated power at either 5.0 V or 5 12 V V OD ID 3.3 V from a 5.0 V input supply, or at 3.3 V from a 3.3 V supply 6 11 at the power levels shown in Table 1. These devices eliminate Figure 5. ADuM6403 the need for a separate, isolated dc-to-dc converter in low V V OA IA power, isolated designs. 3 14 V V OB IB 4 13 The ADuM6400/ADuM6401/ADuM6402/ADuM6403/ V V ADuM6404 IC OC 5 12 ADuM6404 isolators provide four independent isolation V V OD ID 6 11 channels in a variety of channel configurations and data rates Figure 6. ADuM6404 (see the Ordering Guide for more information). Table 1. Power Levels isoPower uses high frequency switching elements to transfer power Input Voltage Output Voltage Output Power through its transformer. Special care must be taken during printed 5.0 V 5.0 V 400 mW circuit board (PCB) layout to meet emissions standards. See the 5.0 V 3.3 V 330 mW AN-0971 Application Note for board layout recommendations. 3.3 V 3.3 V 132 mW 1 Protected by U.S. Patents 5,952,849 6,873,065 6,903,578 and 7,075,329. Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. Tel: 781.329.4700 20092020 Analog Devices, Inc. All rights reserved. No license is granted by implication or otherwise under any patent or patent rights of Analog Technical Support www.analog.com Devices. Trademarks and registered trademarks are the property of their respective owners. 08141-006 08141-005 08141-004 08141-003 08141-002 08 14 1-00 1ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Pin Configurations and Function Descriptions ......................... 12 Applications ...................................................................................... 1 Truth Table ................................................................................. 16 General Description ......................................................................... 1 Typical Performance Characteristics .......................................... 17 Functional Block Diagrams ............................................................. 1 Terminology .................................................................................... 20 Revision History ............................................................................... 2 Applications Information ............................................................. 21 Specifications .................................................................................... 3 PCB Layout ................................................................................. 21 Electrical Characteristics5 V Primary Input Supply/5 V Start-Up Behavior ...................................................................... 21 Secondary Isolated Supply .......................................................... 3 EMI Considerations ................................................................... 22 Electrical Characteristics3.3 V Primary Input Supply/3.3 V Propagation Delay Parameters ................................................. 22 Secondary Isolated Supply .......................................................... 5 DC Correctness and Magnetic Field Immunity .................... 22 Electrical Characteristics5 V Primary Input Supply/3.3 V Power Consumption .................................................................. 23 Secondary Isolated Supply .......................................................... 6 Current Limit and Thermal Overload Protection ................. 24 Package Characteristics ............................................................... 8 Power Considerations ............................................................... 24 Regulatory Information ............................................................... 9 Thermal Analysis ....................................................................... 25 Insulation and Safety-Related Specifications ........................... 9 Insulation Lifetime ..................................................................... 25 Insulation Characteristics ......................................................... 10 Outline Dimensions ....................................................................... 26 Recommended Operating Conditions .................................... 10 Ordering Guide .......................................................................... 27 Absolute Maximum Ratings ......................................................... 11 ESD Caution................................................................................ 11 REVISION HISTORY 7/2020Rev. A to Rev. B Changes to Table 20 ....................................................................... 11 Changes to Table 15 ......................................................................... 9 Changes to Table 26 ....................................................................... 16 Changes to PCB Layout Section ................................................... 21 Changes to Figure 13, Figure 14, Figure 15, Figure 17, Changes to Start-Up Behavior Section ........................................ 22 and Figure 18 .................................................................................. 17 Updated Outline Dimensions ....................................................... 27 Changes to Figure 19 and Figure 20 ............................................ 18 Added Figure 21 and Figure 22 Renumbered Changes to Ordering Guide .......................................................... 28 Figures Sequentially ....................................................................... 18 4/2012Rev. 0 to Rev. A Added Definition of IISO(LOAD) to Terminology Section ............. 20 Changes to Features Section, General Description Section, Changes to PCB Layout Section ................................................... 21 and Table 1 ........................................................................................ 1 Added Start-Up Behavior Section ................................................ 21 Changes to Table 2 and Table 3...................................................... 3 Changes to EMI Considerations Section .................................... 22 Changes to Endnote 1 in Table 5 ................................................... 4 Moved Propagation Delay Parameters Section ......................... 22 Changes to Table 6 and Table 7...................................................... 5 Changes to Power Consumption Section ................................... 23 Change to Propagation Delay Parameter in Table 8 ................... 5 Added Current Limit and Thermal Overload Protection Changes to Endnote 1 in Table 9 Changes to Table 10 .............. 6 Section .............................................................................................. 24 Changes to Table 11 ......................................................................... 7 Moved Thermal Analysis Section ................................................ 25 Changes to Endnote 1 in Table 13 Changes to Table 14 ........... 8 Changes to Insulation Lifetime Section and Figure 33 ............. 25 Changes to Regulatory Information Section, Table 15, Updated Outline Dimensions ...................................................... 26 and Table 16 ...................................................................................... 9 Changes to Ordering Guide .......................................................... 27 Changes to Insulation Characteristics Section, Table 17, and Table 18 .................................................................................... 10 5/2009Revision 0: Initial Version Rev. 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