High Performance, SPI Digital Output, Angular Rate Sensor Data Sheet ADXRS810 FEATURES GENERAL DESCRIPTION Excellent null offset stability over temperature The ADXRS810 is an angular rate sensor (gyroscope) intended High vibration rejection over a wide frequency range for automotive navigation applications. An advanced, differential, 2000 g powered shock survivability quad-sensor design rejects the influence of linear acceleration, SPI digital output with 16-bit data-word enabling the ADXRS810 to operate in exceedingly harsh Low noise environments where shock and vibration are present. Continuous self-test The ADXRS810 uses an internal, continuous self-test archi- Fail-safe functions tecture. The integrity of the electromechanical system is checked Temperature sensor by applying a high frequency electrostatic force to the sense 3.3 V and 5 V operation structure to generate a rate signal that can be differentiated 40C to +105C operation from the baseband rate data and internally analyzed. Small, low profile, industry standard SOIC package provides The ADXRS810 is capable of sensing an angular rate of up to yaw rate (Z-axis) response 300/sec. Angular rate data is presented as a 16-bit word, as Qualified for automotive applications part of a 32-bit SPI message. APPLICATIONS The ADXRS810 is available in a cavity plastic 16-lead SOIC and Car navigation is capable of operating across both a wide voltage range (3.3 V to 5 V) and temperature range (40C to 105C). FUNCTIONAL BLOCK DIAGRAM V CP5 X HIGH VOLTAGE P DD GENERATION ADXRS810 LDO REGULATOR DV DD HV DRIVE AV DD CLOCK ALU PHASE- DIVIDER LOCKED DECIMATION LOOP AMPLITUDE FILTER DETECT MOSI TEMPERATURE CALIBRATION MISO BAND-PASS SPI 12-BIT DEMOD FILTER INTERFACE ADC SCLK CS FAULT Q FILTER Q DAQ DETECTION Z-AXIS ANGULAR RATE SENSOR DV SS ST P DAQ CONTROL P SS AV SS EEPROM Figure 1. Rev. 0 Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 2012 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. REGISTERS/MEMORY 11034-001ADXRS810 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 SPI Communication ProtocolBit Definitions ......................... 15 Applications ....................................................................................... 1 Command/Response Bit Descriptions .................................... 15 General Description ......................................................................... 1 ADXRS810 Fault Register Bit Definitions .............................. 17 Functional Block Diagram .............................................................. 1 CHK Bit Assertion: Recommended Start-Up Routine ......... 19 Revision History ............................................................................... 2 SPI Rate Data Format ..................................................................... 20 Specifications ..................................................................................... 3 ADXRS810 Memory Map ............................................................. 21 Absolute Maximum Ratings ............................................................ 5 Memory Register Definitions ....................................................... 22 Thermal Resistance ...................................................................... 5 0x00 RATE1, 0x01 RATE0 ........................................................ 22 Rate Sensitive Axis ....................................................................... 5 0x02 TEM1, 0x03 TEM0 ........................................................... 22 ESD Caution .................................................................................. 5 0x04 LOCST1, 0x05 LOCST0 ................................................... 22 Pin Configurations and Function Descriptions ........................... 6 0x06 HICST1, 0x07 HICST0 .................................................... 22 Typical Performance Characteristics ............................................. 7 0x08 QUAD1, 0x09 QUAD0 ..................................................... 22 Theory of Operation ........................................................................ 9 0x0A FAULT1, 0x0B FAULT0 .................................................. 23 Continuous Self-Test .................................................................... 9 0x0C PID1, 0x0D PID0 ............................................................. 23 Applications Information .............................................................. 10 0x0E SN3, 0x0F SN2, 0x10 SN1, 0x11 SN0 ............................. 23 Calibrated Performance ............................................................. 10 Suggested PCB Layout ................................................................... 24 Mechanical Considerations for Mounting .............................. 10 Solder Profile............................................................................... 25 Application Circuit ..................................................................... 10 Package Marking Codes ............................................................ 26 ADXRS810 Signal Chain Timing ............................................. 11 Outline Dimensions ....................................................................... 27 SPI Communications Characteristics .......................................... 12 Ordering Guide .......................................................................... 27 SPI Communication ProtocolApplications ............................. 13 Automotive Products ................................................................. 27 Device Data Latching ................................................................. 13 Command/Response .................................................................. 14 REVISION HISTORY 10/12Revision 0: Initial Version Rev. 0 Page 2 of 28