Tronics Microsystems S.A.
98 rue du Pr de lHorme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50 Fax: +33 (0)4 76 97 29 51
www.tronicsgroup.com
GYPRO3300 Datasheet MCD014-C
Features
Digital angular rate sensor with SPI interface
Angular rate measurement around Z-axis (yaw)
300/sec input range
Ultra low noise
Excellent bias instability
General Description
Low latency
GYPRO product line is a new generation of Micro-Electro-
24 bit angular rate output
Mechanical Systems (MEMS) angular rate sensor specifically
Embedded temperature sensor for on-chip or
designed for demanding applications.
external temperature compensation
Built-in Self-Test
The MEMS transducer is manufactured using Tronics
5V single supply voltage
proprietary vacuum wafer-level packaging technology based
Low operating current consumption: 25mA
on micro-machined thick single crystal silicon.
CLCC 30 package: 19.6 mm x 11.5 mm x 3.7 mm
The integrated circuit (IC) provides a stable primary anti-
Weight : 2 grams
phase vibration of the drive proof masses, thanks to
REACH and RoHS compliant
electrostatic comb drives. When the sensor is subjected to a
rotation, the Coriolis force acts on the sense proof masses
and forces them into a secondary anti-phase movement
perpendicular to the direction of drive vibration, which is itself
Applications
counter-balanced by electrostatic forces. The sense closed
Precision instrumentation loop operates as an electromechanical modulator
Platform stabilization providing a digital output. This output is finally demodulated
Guidance and control using the drive reference signal.
IMU, AHRS and navigation systems
The sensor is factory calibrated and compensated for
Avionics Flight Control and Back-up instruments
temperature effects to provide high-accuracy digital output
Unmanned vehicles and Autonomous systems
over a broad temperature range.
3D mapping
Marine electronics Raw data output can be also chosen to enable customer-
Oil and gas made compensations.
Robotics
GYPRO Product references
Description Vibration range Bandwidth Data Rate Latency
GYPRO2300 Standard configuration 4 grms 100Hz 200Hz 40 ms
GYPRO2300LD Low delay configuration 4 grms >200Hz 1700Hz 2 ms
GYPRO3300 Improved vibration tolerance & 8 grms >200Hz 1800Hz 1 ms
Ultra low delay configuration
Disclaimer
Information furnished by Tronics is believed to be accurate and reliable. However, no responsibility is assumed by Tronics for
its use, nor for any infringements of patents or other rights of third parties that may result from its use.
Specification subject to change without notice.
No license is granted by implication or otherwise under any patent or patent rights of Tronics. Trademarks and
registered trademarks are the property of their respective owners.
Copyright 2017 Tronics Microsystems S.A.. All rights reserved.
Internal ref. : MCD014-C Page 1
Specification subject to change without notice. Tronics Microsystems S.A.
98 rue du Pr de lHorme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50 Fax: +33 (0)4 76 97 29 51
www.tronicsgroup.com
GYPRO3300 Datasheet
Contents
Features ....................................................................................................................................................................................................... 1
Applications ................................................................................................................................................................................................. 1
General Description ..................................................................................................................................................................................... 1
Product reference ........................................................................................................................................................................................ 1
Disclaimer .................................................................................................................................................................................................... 1
Block diagram ............................................................................................................................................................................... 3
Overall Dimensions ....................................................................................................................................................................... 3
1. Specifications ................................................................................................................................................................................... 4
2. Maximum Ratings ............................................................................................................................................................................. 6
3. Typical performances ....................................................................................................................................................................... 7
4. Interface ........................................................................................................................................................................................... 9
4.1. Pinout, sensitive axis identification ................................................................................................................................... 9
4.2. Application circuit .............................................................................................................................................................. 9
4.3. Input/Output Pin Definitions ........................................................................................................................................... 10
5. Soldering Recommendations ........................................................................................................................................................... 11
6. Digital SPI interface ......................................................................................................................................................................... 12
6.1. Electrical and Timing Characteristics ............................................................................................................................... 12
6.2. SPI frames description ..................................................................................................................................................... 13
6.3. Angular rate readings ...................................................................................................................................................... 13
6.4. Temperature readings ..................................................................................................................................................... 13
6.5. Advanced use of SPI registers .......................................................................................................................................... 14
7. Angular rate calibration procedure .................................................................................................................................................. 16
7.1. Algorithm overview ......................................................................................................................................................... 16
7.2. Programming of the new coefficients ............................................................................................................................. 17
7.3. Switch to uncompensated data output ........................................................................................................................... 18
8. Temperature Sensor Calibration Procedure ..................................................................................................................................... 19
8.1. Temperature sensor calibration model ........................................................................................................................... 19
8.2. Recommended Procedure ............................................................................................................................................... 19
9. Device Identification ........................................................................................................................................................................ 19
10. Internal construction and Theory of Operation ................................................................................................................................ 20
11. Available Tools and Resources ......................................................................................................................................................... 21
Copyright 2017 Tronics Microsystems S.A.. All rights reserved.
Page 2 MCD014-C
Specification subject to change without notice.