Click here to ask about the production status of specific part numbers. DS2485 Advanced 1-Wire Master with Memory General Description Benefits and Features 2 The DS2485 is a 1-Wire master that performs protocol I C Communication, up to 1MHz 2 conversion between the I C master and any attached 1-Wire Standard and Overdrive Timing 1-Wire slaves. For 1-Wire line driving, internal user-ad- Communication Speeds justable timers relieve the system host processor from 1-Wire Command Scripting Capability generating time-critical 1-Wire waveforms, supporting Adjustable 1-Wire Timing for t , t , t , RSTL MSI MSP both standard and overdrive 1-Wire communication t , t , t , t , t , RPUP, and PDSLEW RSTH W0L W1L MSR REC speeds. The 1-Wire master has selectable active or pas- 0.75Kb of EEPROM for User Data sive 1-Wire pullup. Strong pullup features support 1-Wire One Open-Drain GPIO Pin power delivery for 1-Wire devices that require this for Large 1-Wire Block Buffer (126 Bytes) for Efficient EEPROMs and cryptographic computations. Data Transfer Operating Range: 2.97V to 3.63V, -40C to +85C 3mm x 3mm, 6-Pin TDFN-EP Package Applications Medical Instruments Ordering Information appears at end of data sheet. Industrial Sensors and Tools Limited-Use Consumables Printer Cartridge Identification Typical Application Circuit VCC R P3 V CC RP1 RP2 GPIO IO VCC DS2485 2 I C IO SDA PORT SCL C GND IO IO IO GND 1-Wire 1-Wire 1-Wire DEVICE 1 DEVICE 2 DEVICE 3 GND GND GND 19-101137 Rev 0 5/21DS2485 Advanced 1-Wire Master with Memory Absolute Maximum Ratings Voltage Range on Any Pin Relative to GND ........... -0.5V to 4.0V Storage Temperature Range ..............................-40C to +125C Maximum Current into Any Pin............................ -20mA to 20mA Lead Temperature (soldering, 10s)...................................+300C Operating Temperature Range ............................ -40C to +85C Soldering Temperature (reflow) ........................................+260C Junction Temperature ...................................................... +150C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 6 TDFN-EP Package Code T633+2 Outline Number 21-0137 Land Pattern Number 90-0058 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 55C/W JA Junction to Case ( ) 9C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 42C/W JA Junction to Case ( ) 9C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (Limits are 100% production tested at T = +25C and/or T = +85C. Limits over the operating temperature range and relevant supply A A voltage range are guaranteed by design and characterization. Typical values are not guaranteed.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V (Note 1) 2.97 3.3 3.63 V CC Standby 400 A Supply Current I CC Communicating/active (Note 2) 10 mA 0.6 x Low configuration V CC 0.6 x 1-Wire Input High V Medium configuration V IH1 V CC 0.85 x High configuration V CC 0.25 x Low configuration (Note 3, Note 4) V CC Low-to-High Switching 0.4V x V Medium configuration (Note 3, Note 4) V TH Threshold V CC 0.75 x High configuration (Note 3, Note 4) V CC www.maximintegrated.com Maxim Integrated 2