Signal and Power Isolated CAN Transceiver with Integrated Isolated DC-to-DC Converter Data Sheet ADM3053 FEATURES GENERAL DESCRIPTION The ADM3053 is an isolated controller area network (CAN) 2.5 kV rms signal and power isolated CAN transceiver physical layer transceiver with an integrated isolated dc-to-dc isoPower integrated isolated dc-to-dc converter converter. The ADM3053 complies with the ISO 11898 standard. 5 V operation on V CC 5 V or 3.3 V operation on V IO The device employs Analog Devices, Inc., iCoupler technology Complies with ISO 11898 standard to combine a 2-channel isolator, a CAN transceiver, and Analog High speed data rates of up to 1 Mbps Devices isoPower dc-to-dc converter into a single SOIC surface Unpowered nodes do not disturb the bus mount package. An on-chip oscillator outputs a pair of square Connect 110 or more nodes on the bus waveforms that drive an internal transformer to provide isolated Slope control for reduced EMI power. The device is powered by a single 5 V supply realizing a Thermal shutdown protection fully isolated CAN solution. High common-mode transient immunity: >25 kV/s The ADM3053 creates a fully isolated interface between the Safety and regulatory approvals CAN protocol controller and the physical layer bus. It is capable UL recognition of running at data rates of up to 1 Mbps. 2500 V rms for 1 minute per UL 1577 The device has current limiting and thermal shutdown features CSA Component Acceptance Notice 5A to protect against output short circuits. The part is fully specified VDE Certificate of Conformity DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01 over the industrial temperature range and is available in a V = 560 V peak 20-lead, wide-body SOIC package. IORM Industrial operating temperature range (40C to +85C) The ADM3053 contains isoPower technology that uses high Available in wide-body, 20-lead SOIC package frequency switching elements to transfer power through the transformer. Special care must be taken during printed circuit APPLICATIONS board (PCB) layout to meet emissions standards. Refer to the CAN data buses AN-0971 Application Note, Recommendations for Control of Industrial field networks Radiated Emissions with isoPower Devices, for details on board layout considerations. FUNCTIONAL BLOCK DIAGRAM V CC isoPower DC-TO-DC CONVERTER ADM3053 V ISOOUT OSCILLATOR RECTIFIER V ISOIN REGULATOR V CC V PROTECTION IO TxD R S DIGITAL ISOLATIONiCoupler DRIVER R S SLOPE/ STANDBY ENCODE DECODE TxD RxD CANH CANL RECEIVER V REF REFERENCE RxD DECODE ENCODE VOLTAGE CAN TRANSCEIVER V REF GND2 GND1 GND2 GND2 ISOLATION PIN 11, PIN 13 PIN 16, PIN 20 BARRIER LOGIC SIDE BUS SIDE Figure 1. Rev. E Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20112017 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. 09293-001ADM3053 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Circuit Description......................................................................... 13 Applications ....................................................................................... 1 CAN Transceiver Operation ..................................................... 13 General Description ......................................................................... 1 Signal Isolation ........................................................................... 13 Functional Block Diagram .............................................................. 1 Power Isolation ........................................................................... 13 Revision History ............................................................................... 2 Truth Tables................................................................................. 13 Specifications ..................................................................................... 3 Thermal Shutdown .................................................................... 13 Timing Specifications .................................................................. 4 DC Correctness and Magnetic Field Immunity ........................... 14 Switching Characteristics ............................................................ 4 Applications Information .............................................................. 15 Regulatory Information ............................................................... 5 PCB Layout ................................................................................. 15 Insulation and Safety-Related Specifications ............................ 5 EMI Considerations ................................................................... 15 VDE 0884 Insulation Characteristics ........................................ 6 RS Pin ............................................................................................ 16 Absolute Maximum Ratings ............................................................ 7 Insulation Lifetime ..................................................................... 16 ESD Caution .................................................................................. 7 Typical Applications ....................................................................... 17 Pin Configuration and Function Descriptions ............................. 8 Outline Dimensions ....................................................................... 18 Typical Performance Characteristics ............................................. 9 Ordering Guide .......................................................................... 18 Test Circuits ..................................................................................... 12 REVISION HISTORY 12/2017Rev. D to Rev. E 11/2016Rev. B to Rev. C Changes to Logic Side isoPower Current, Dominant State Change to Table 4 .............................................................................. 5 Changes to Figure 11 Caption ...................................................... 10 Parameter and TxD/RxD Data Rate 1 Mbps Parameter, Table 1 ................................................................................................ 3 Changes to Ordering Guide .......................................................... 18 Moved Figure 3 ................................................................................. 4 Change to T Junction Temperature, Table 6 ................................ 7 2/2013Rev. A to Rev. B J Changes to Figure 28 ...................................................................... 15 Changes to Features Section ............................................................ 1 Changes to Table 3 ............................................................................. 5 7/2017Rev. C to Rev. D Changes to Table 7 ............................................................................. 7 Moved Figure 1 ................................................................................. 3 Changes to Figure 1 .......................................................................... 3 3/2012Rev. 0 to Rev. A Change to Tracking Resistance (Comparative Tracking Changes to Features Section ............................................................ 1 Index) Parameter, Table 4 ................................................................ 6 Changes to Table 3 ............................................................................. 5 Changes to Table 8 ............................................................................ 9 Changes to VDE 0884 Insulation Characteristics Section ........... 6 Changes to Power Isolation Section ............................................. 14 Changes to Figure 6 ........................................................................... 9 Changes to PCB Layout Section and Figure 28 .......................... 16 Changes to Figure 11 ...................................................................... 10 Changes to Applications Information Section ........................... 15 Added RS Pin Section ..................................................................... 17 Changes to Figure 32 ...................................................................... 18 5/2011Revision 0: Initial Version Rev. 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