0.1 GHz to 13.0 GHz,0.5 dB LSB, 6-Bit, GaAs Digital Attenuator Data Sheet HMC424ACHIPS FEATURES FUNCTIONAL BLOCK DIAGRAM Attenuation range: 0.5 dB (LSB) steps to 31.5 dB 0.5 dB typical step error VEE HMC424ACHIPS Low insertion loss: 2.8 dB typical at 4.0 GHz High linearity at V = 5 V EE RF1 RF2 Input P0.1dB: 25 dBm typical Input IP3: 45 dBm typical High RF input power handling: 25 dBm maximum Low relative phase: 30 at 6.0 GHz Single-supply operation: 3 V to 5 V V6 V5 V4 V3 V2 V1 Die size: 1.390 mm 0.770 mm 0.102 mm APPLICATIONS Figure 1. Cellular infrastructure Microwave radios and very small aperture terminals (VSATs) Test equipment and sensors Intermediate frequency (IF) and RF designs Military and space GENERAL DESCRIPTION The HMC424ACHIPS is a broadband, 6-bit, gallium arsenide The device allows a user to program the attenuation state via six (GaAs), digital attenuator monolithic microwave integrated parallel control inputs toggled between 0 V and V . EE circuit (MMIC) chip with a 31.5 dB attenuation control range in The HMC424ACHIPS operates with a single negative supply 0.5 dB steps. voltage from 3 V to 5 V, and requires an external driver to The HMC424ACHIPS offers excellent attenuation accuracy of interface with a CMOS/transistor to transistor logic (TTL) (0.2 dB + 3% of attenuation state) and high input linearity over interface. the specified frequency range from 0.1 GHz to 13.0 GHz with a The HMC424ACHIPS comes in a RoHS compliant, 9-pad bare die. typical insertion loss of 4.2 dB. The attenuator bit values are 0.5 dB (LSB), 1 dB, 2 dB, 4 dB, 8 dB, and 16 dB for a total attenuation of 31.5 dB with a 0.5 dB of typical step error. Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 2020 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Technical Support www.analog.com 0.5dB 1dB 2dB 4dB 8dB 16dB 13970-001HMC424ACHIPS Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Insertion Loss, Return Loss, State Error, Step Error, and Relative Phase ................................................................................6 Applications ....................................................................................... 1 Input Power Compression and Third-Order Intercept ............8 Functional Block Diagram .............................................................. 1 Theory of Operation .........................................................................9 General Description ......................................................................... 1 Power Supply ..................................................................................9 Revision History ............................................................................... 2 RF Input and Output ....................................................................9 Specifications ..................................................................................... 3 Applications Information .............................................................. 10 Absolute Maximum Ratings ............................................................ 4 Mounting and Bonding Techniques ........................................ 10 Thermal Resistance ...................................................................... 4 Assembly Diagram ..................................................................... 10 ESD Caution .................................................................................. 4 Outline Dimensions ....................................................................... 11 Pin Configuration and Function Descriptions ............................. 5 Ordering Guide .......................................................................... 11 Interface Schematics..................................................................... 5 Typical Performance Characteristics ............................................. 6 REVISION HISTORY 3/2020Rev. 01.1115 to Rev. B Deleted Handling Precautions Section, Mounting Section, and Wire Bonding Section ....................................................................... 7 This Hittite Microwave Products data sheet has been reformatted to Added Input Power Compression and Third-Order Intercept meet the styles and standards of Analog Devices, Inc. Section, Figure 18 to Figure 20, and Figure 22 .............................. 8 Changes to Title, Features Section, Applications Section, and Changes to Figure 17 and Figure 21 ............................................... 8 General Description Section ........................................................... 1 Added Theory of Operation Section, Power Supply Section, and Changes to Table 1 ............................................................................ 3 RF Input and Output Section ........................................................... 9 Added Table 2, Figure 2, Thermal Resistance Section, and Changes to Figure 23 ......................................................................... 9 Table 3 Renumbered Sequentially ................................................. 4 Added Applications Information Section ................................... 10 Changes to Table 2 ............................................................................ 4 Changed Mounting & Bonding Techniques for Millimeterwave Deleted Bias Voltage & Current Table and Control Voltage GaAs MMICs Section to Mounting and Bonding Techniques Table Renumbered Sequentially .................................................... 5 Section .............................................................................................. 10 Added Figure 3, Table 4, and Figure 4 ........................................... 5 Changes to Mounting and Bonding Techniques Section, Changes to Figure 5 .......................................................................... 5 Figure 24, and Figure 25 ................................................................ 10 Added Insertion Loss, Return Loss, State Error, Step Error, and Updated Outline Dimensions ....................................................... 11 Relative Phase Section, Figure 8, Figure 9, and Figure 12 ........... 6 Changes to Ordering Guide .......................................................... 11 Changes to Figure 7, Figure 10, and Figure 11 ............................. 6 Added Figure 13, Figure 14, and Figure 16 ................................... 7 Changes to Figure 15 ........................................................................ 7 Rev. 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