LTM8067 3V to 40V Isolated IN IN Module DC/DC Converter FEATURES DESCRIPTION n 2kVAC Isolated Module Converter The LTM 8067 is a 2kVAC isolated flyback Module n UL60950 Recognized File 464570 (power module) DC/DC converter. Included in the pack- n Wide Input Voltage Range: 3V to 40V age are the switching controller, power switches, trans- n Up to 450mA Output Current (V = 24V V = 5V) former, and all support components. Operating over an IN , OUT Output Adjustable from 2.5V to 24V input voltage range of 3V to 40V, the LTM8067 supports n Current Mode Control an output voltage range of 2.5V to 24V, set by a single n User Configurable Undervoltage Lockout resistor. Only output and input capacitors are needed to n Low Profile (9mm 11.25mm 4.92mm) finish the design. BGA Package The LTM8067 is packaged in a thermally enhanced, com- pact (9mm 11.25mm 4.92mm) overmolded ball grid APPLICATIONS array (BGA) package suitable for automated assembly by standard surface mount equipment. The LTM8067 is n Isolated IGBT Gate Drive available with SnPb or RoHS compliant terminal finish. n Industrial Sensors n All registered trademarks and trademarks are the property of their respective owners. Industrial Switches n Test and Measurement Equipment TYPICAL APPLICATION 2kVAC Isolated Module Regulator Maximum Output Current vs V IN Max Load Current vs V IN V V V IN OUT V 600 IN OUT 3V TO 5V RUN 40V 22F 2.2F V OUTN FB 400 LTM8067 8.25k GND 8067 TA01a 200 0 0 10 20 30 40 V (V) IN 8067 TA01b Rev. D 1 Document Feedback For more information www.analog.com LOAD CURRENT (mA)LTM8067 ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) V , RUN, BIAS ........................................................42V IN TOP VIEW V Relative to V .............................................25V OUT OUTN A V + V (Note 2) ...................................................48V IN OUT B GND to V Isolation (Note 3) ...........................2kVAC OUT BANK 2 BANK 1 Maximum Internal Temperature (Note 4) .............. 125C C V V OUTN OUT Peak Solder Reflow Body Temperature ................. 245C D Storage Temperature.............................. 55C to 125C E BANK 4 GND BANK 5 F V IN RUN G FB H 1 2 3 4 5 6 7 BGA PACKAGE 38-LEAD (11.25mm 9mm 4.92mm) T = 125C, = 20.8C/W, = 5.1C/W, = 18.4C/W, = 5.3C/W JMAX JA JCbottom JCtop JB WEIGHT = 1.1g, VALUES DETERMINED PER JESD 51-9, 51-12 ORDER INFORMATION PART MARKING PACKAGE MSL PART NUMBER PAD OR BALL FINISH DEVICE CODE TYPE RATING TEMPERATURE RANGE (SEE NOTE 4) LTM8067EY PBF SAC305 (RoHS) LTM8067Y e1 BGA 3 40C to 125C LTM8067IY PBF SAC305 (RoHS) LTM8067Y e1 BGA 3 40C to 125C LTM8067IY SnPb (63/37) LTM8067Y e0 BGA 3 40C to 125C Contact the factory for parts specified with wider operating temperature ranges. Recommended LGA and BGA PCB Assembly and Manufacturing Procedures Device temperature grade is indicated by a label on the shipping container. LGA and BGA Package and Tray Drawings Pad or ball finish code is per IPC/JEDEC J-STD-609. Rev. D 2 For more information www.analog.com