EVALUATION KIT AVAILABLE MAX11108 Tiny, 2.1mm x 1.6mm, 3Msps, Low-Power, Serial 12-Bit ADC General Description Benefits and Features The MAX11108 is a tiny (2.1mm x 1.6mm), 12-bit, com- Compact ADC Saves Space pact, high-speed, low-power, successive approximation Single-Ended Analog Input 12-Bit Resolution ADC analog-to-digital converter (ADC). This high-performance 3Msps Conversion Rate with No Pipeline Delay ADC includes a high-dynamic range sample-and-hold 73dB SNR and a high-speed serial interface. This ADC accepts a 10-Pin, Ultra-TQFN (DFN), 2.1mm x 1.6mm full-scale input from 0V to the power supply or to the ref- Package erence voltage. Low Power Consumption Extends Battery Life The MAX11108 features a single-ended analog input 6.6mW at 3Msps connected to the ADC core. The device also includes a Very Low Power Consumption at 2.5A/ksps separate supply input for data interface and a dedicated 1.3A Power-Down Current input for reference voltage. 2.2V to 3.6V Supply Voltage The MAX11108communicate from 1.5V to V and Variable I/O Voltage Range of 1.5V to 3.6V Eases DD operates from a 2.2V to 3.6V supply. The device con- Interface to Microcontrollers sumes only 6.6mW at 3Msps and includes full power- SPI-/QSPI-/MICROWIRE-Compatible Serial Interface down mode and fast wake-up for optimal power man- Directly Connects to 1.5V, 1.8V, 2.5V, or 3V Digital agement and a high-speed 3-wire serial interface. The System 3-wire serial interface directly connects to SPI/QSPI/ MICROWIRE devices without external logic. Excellent dynamic performance, low voltage, low power, Functional Diagram ease of use, and extremely small package size make this converter ideal for portable battery-powered data-acquisi- tion applications, and for other applications that demand V V OVDD DD low-power consumption and minimal space. The MAX11108 is available in an ultra-TQFN (2.1mm x 1.6mm) package, and operates over the -40C to +125C CS MAX11108 CONTROL temperature range. SCLK LOGIC Applications Instrument Data Acquisition Mobile DOUT OUTPUT SAR Portable Data Logging BUFFER Medical Instrumentation Battery-Operated Systems Communication Systems AIN CDAC QSPI is a trademark of Motorola, Inc. MICROWIRE is a registered trademark of National V AGND REF Semiconductor Corp. MAX is a registered trademark of Maxim Integrated Products, Inc. 19-6227 Rev 3 3/15MAX11108 Tiny, 2.1mm x 1.6mm, 3Msps, Low-Power, Serial 12-Bit ADC Absolute Maximum Ratings V to AGND ..........................................................-0.3V to +4V Continuous Power Dissipation (T = +70C) DD A REF, OVDD, AIN to AGND ......................... -0.3V to the lower of Ultra TQFN (derate 9mW/C above +70C) ................722mW ............................................................. (V + 0.3V) and +4V Operating Temperature Range .......................-40C to +125C DD CS, SCLK, DOUT TO AGND...................... -0.3V to the lower of Junction Temperature ......................................................+150C (V + 0.3V) and +4V Storage Temperature Range ............................ -65C to +150C OVDD Input/Output Current (all pins) ............................................50mA Lead Temperature (soldering, 10s) .................................+300C Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) Ultra TQFN Junction-to-Ambient Thermal Resistance ( ) .........110.8C/W JA Junction-to-Case Thermal Resistance ( ) ............62.1C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 2.2V to 3.6V, V = V , V = V . f = 48MHz, 50% duty cycle, 3Msps. C = 10pF, T = -40C to +125C, DD REF DD OVDD DD SCLK DOUT A unless otherwise noted. Typical values are at T = +25C.) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY Resolution 12 Bits Integral Nonlinearity INL 1 LSB Differential Nonlinearity DNL No missing codes 1 LSB Offset Error OE 0.3 3 LSB Gain Error GE Excluding offset and reference errors 1 3 LSB Total Unadjusted Error TUE 1.5 LSB DYNAMIC PERFORMANCE (f = 1MHz) AIN Signal-to-Noise and Distortion SINAD 70 72 dB Signal-to-Noise Ratio SNR 70.5 72 dB Total Harmonic Distortion THD -85 -75 dB Spurious-Free Dynamic Range SFDR 76 85 dB Intermodulation Distortion IMD f = 1.0003MHz, f = 0.99955MHz -84 dB 1 2 Full-Power Bandwidth -3dB point 40 MHz Full-Linear Bandwidth SINAD > 68dB 2.5 MHz Small-Signal Bandwidth 45 MHz Maxim Integrated 2 www.maximintegrated.com