EVALUATION KIT AVAILABLE MAX11165 16-Bit, 250ksps, 0 to 5V SAR ADC with Internal Reference in TDFN General Description Benefits and Features The MAX11165 16-bit, 250ksps, SAR ADC offers High DC/AC Accuracy Improves Measurement excellent AC and DC performance with unipolar input Quality range, small size, and internal reference. The MAX11165 16-Bit Resolution with No Missing Codes integrates an optional internal reference and buffer, 250ksps Throughput Rates Without Pipeline Delay/ saving additional cost and space. Latency This ADC achieves 92.4dB SNR and -104.2dB THD. 92.4dB SNR and -104.2dB THD at 10kHz 0.5 LSB Input-Referred Noise The MAX11165 guarantees 16-bit no-missing codes and RMS 0.6 LSB INL (typ). 0.2 LSB DNL (typ) and 0.6 LSB INL (typ) Highly Integrated ADC Saves Cost and Space The MAX11165 communicates using an SPI-compatible 6ppm/C Internal Reference serial interface at 2.3V, 3V, 3.3V, or 5V logic. The serial interface can be used to daisy-chain multiple ADCs for Internal Reference Buffer Wide Supply Range and Low Power Simplify Power- multichannel applications and provides a busy indicator option for simplified system synchronization and timing. Supply Design 5V Analog Supply The MAX11165 is offered in a 12-pin, 3mm x 3mm, TDFN 2.3V to 5V Digital Supply package and is specified over the -40NC to +85NC 19mW Power Consumption at 250ksps temperature range. 10A in Shutdown Mode Multi-Industry Standard Serial Interface and Small Applications Package Reduce Size Data Acquisition Systems SPI/QSPI /MICROWIRE /DSP-Compatible Serial Industrial Control Systems/Process Control Interface Medical Instrumentation 3mm x 3mm Tiny 12-Pin TDFN Package Automatic Test Equipment QSPI is a trademark of Motorola, Inc. MICROWIRE is a registered trademark of National Selector Guide and Ordering Information appear at end of Semiconductor Corporation. data sheet. Typical Operating Circuit 14-Bit to 18-Bit SAR ADC Family 14-BIT 16-BIT 16-BIT 18-BIT 500ksps 250ksps 500ksps 500ksps OVDD 5V Input 1F VDD 1F (2.3V TO 5V) MAX11167 MAX11166 MAX11156 (5V) Internal MAX11169 MAX11168 MAX11158 SCLK Reference 10 INTERFACE AIN+ DIN AND CONTROL HOST 0 to +5V 16-BIT ADC DOUT AIN- CONTROLLER 4.7nF 0 to 5V Input MAX9632 CNVST C0G MAX11161 MAX11160 MAX11150 CONFIGURATION Ceramic REGISTER Internal MAX11165 MAX11164 MAX11154 REF MAX11165 Reference INTERNAL REFERENCE REF BUF 10F REFIO 0 to 5V Input 0.1F AGNDS GND External MAX11262 MAX11163 MAX11162 MAX11152 Reference 19-6724 Rev 3 11/15MAX11165 16-Bit, 250ksps, 0 to 5V SAR ADC with Internal Reference in TDFN Absolute Maximum Ratings V to GND ............................................................-0.3V to +6V Continuous Power Dissipation (T = +70NC) DD A OVDD to GND ....... -0.3V to the lower of (V + 0.3V) and +6V TDFN (derate 18.2mW/NC above +70NC) ..................1349mW DD AIN+ to GND ...........................................................-0.3V to +6V Operating Temperature Range ........................... -40NC to +85NC AIN-, REF, REFIO, AGNDS Junction Temperature ......................................................+150NC to GND ............... -0.3V to the lower of (V + 0.3V) and +6V Storage Temperature Range ............................ -65NC to +150NC DD SCLK, DIN, DOUT, CNVST Lead Temperature (soldering, 10s) .................................+300NC to GND ............... -0.3V to the lower of (V + 0.3V) and +6V Soldering Temperature (reflow) .......................................+260NC DD Maximum Current into Any Pin...........................................50mA Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TDFN Junction-to-Ambient Thermal Resistance ( q ).......59.3NC/W JA Junction-to-Case Thermal Resistance ( q ) ...........22.5NC/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 4.75V to 5.25V, V = 2.3V to 5.25V, f = 250ksps, Reference Mode 3, V = 4.096V T = T to T , unless DD OVDD SAMPLE REF A MIN MAX otherwise noted. Typical values are at T = +25NC.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ANALOG INPUT (Note 3) 5.000 +K x Input Voltage Range AIN+ to AIN-, K = 0 V V 4.096 REF +(V DD AIN+ to GND -0.1 + 0.1) Absolute Input Voltage Range V AIN- to GND -0.1 +0.1 Input Leakage Current Acquisition phase -10 +0.001 +10 A Input Capacitance 32 pF Input-Clamp Protection Current Both inputs -20 +20 mA STATIC PERFORMANCE (Note 4) Resolution N 16 Bits No Missing Codes 16 Bits Offset Error -4.0 1.0 +4.0 LSB Offset Error Temperature 0.006 LSB/C Coefficient Gain Error -3 1.2 +3.0 LSB Gain Error Temperature 0.004 LSB/C Coefficient Integral Nonlinearity INL -1.4 0.6 +1.4 LSB Differential Nonlinearity DNL Guaranteed by design -0.5 0.2 +0.5 LSB Positive Full-Scale Error -5.5 +5.5 LSB Analog Input CMRR CMRR -1.96 LSB/V Maxim Integrated 2 www.maximintegrated.com