EVALUATION KIT AVAILABLE MAX11335MAX11340 500ksps, 12-/10-Bit, 4-/8-/16-Channel ADCs with Post-Mux External Signal Conditioning Access General Description Benefits and Features The MAX11335MAX11340 are 12-/10-bit with external S Highly Integrated Precision ADC Saves Space reference and 500kHz, full-linear-bandwidth, high-speed, while Retaining Flexibility low-power, serial-output successive approximation reg- 1 LSB INL, 1 LSB DNL, No Missing Codes ister (SAR) analog-to-digital converters (ADCs). The 70dB SINAD at 100kHz MAX11335MAX11340 provide external access to the 500ksps Conversion Rate with No Pipeline output of the integrated mux and ADC input, to simplify Delay conditioning. The MAX11335MAX11340 include both S Analog Multiplexer with True Differential Track/Hold: internal and external clock modes. These devices feature Any Combination of Single-Ended, Differential and scan mode in both internal and external clock modes. The Pseudo-Differential Input Pin Pairs Allowed internal clock mode features internal averaging to increase 16-/8-/4-Channel Single-Ended SNR. The external clock mode features the SampleSetK 12-/8-/4-Channel Fully-Differential Pairs technology, a user-programmable analog input channel 15-/8-/4-Channel Pseudo-Differential Relative to sequencer. The SampleSet approach provides greater a Common Input sequencing flexibility for multichannel applications while alleviating significant microcontroller or DSP (controlling S Two Software-Selectable Bipolar Input Ranges unit) communication overhead. (V +/2, V +) REF REF External pins provide access to the output of the S External Differential Reference (1V to V ) DD multiplexer and ADC inputs to simplify multichannel sig- S 32-Pin, 5mm x 5mm TQFN Package nal conditioning. The internal clock mode features an inte- S SampleSet Technology Brings Extreme grated FIFO allowing data to be sampled at high speeds Flexibility to Program Input Configurations Per and then held for readout at any time or at a lower clock Channel and Sampling Sequence, Optimizes rate. Internal averaging is also supported in internal clock mode improving SNR for noisy input signals. The devices Interface to the Microcontroller feature analog input channels that can be configured to User-Defined Channel Sequence with Maximum be single-ended inputs, fully differential pairs, or pseudo- Length of 256 differential inputs with respect to one common input. The Scan Modes, Internal Averaging, and Internal Clock MAX11335MAX11340 operate from a 2.35V to 3.6V sup- 16-Entry First-In/First-Out (FIFO) ply and consume only 4.2mW at 500ksps. S Post-Mux Signal Access Allows for External The MAX11335MAX11340 include AutoShutdownK, Signal Conditioning Between the Mux and ADC fast wake-up, and a high-speed 3-wire serial interface. For Differential Signals The devices feature full power-down mode for optimal Externally Accessible Multiplex Output and ADC Input power management. The 8MHz, 3-wire serial interface S Low Power Consumption Extends Battery Life for M directly connects to SPI, QSPIK, and MICROWIRE Portable Applications devices without external logic. 1.5V to 3.6V Digital I/O Supply Voltage Excellent dynamic performance, low voltage, low power, 2.35V to 3.6V Supply Voltage ease of use, and small package size make these convert- 4.2mW at 500ksps with 3V Supplies ers ideal for portable battery-powered data-acquisition 2A Full-Shutdown Current applications, and for other applications that demand low S Easy to Interface with Most Microcontrollers power consumption and small space. 16MHz, 3-Wire SPI-/QSPI-/MICROWIRE-/DSP- The MAX11335MAX11340 are available in 32-pin, 5mm Compatible Serial Interface x 5mm, TQFN packages and operate over the -40NC to +125NC temperature range. Applications High-Speed Data Medical Instrumentation SampleSet and AutoShutdown are trademarks of Maxim Acquisition Systems Integrated Products, Inc. Battery-Powered QSPI is a trademark of Motorola, Inc. High-Speed Closed-Loop Instruments MICROWIRE is a registered trademark of National Semiconductor Systems Corp. Portable Systems Industrial Control Systems Ordering Information appears at end of data sheet. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-6468 Rev 1 12/14MAX11335MAX11340 500ksps, 12-/10-Bit, 4-/8-/16-Channel ADCs with Post-Mux External Signal Conditioning Access ABSOLUTE MAXIMUM RATINGS V to GND .............................................................-0.3V to +4V Continuous Power Dissipation (T = +70NC) DD A AOP, AON, AIP, AIN, OVDD, AIN0AIN13, CNVST/AIN14, REF+, TQFN (derate 34.4mW/NC above +70NC)..................2758mW REF-/AIN15 to GND ....................................... -0.3V to the lower of Operating Temperature Range ........................ -40NC to +125NC Junction Temperature .....................................................+150NC (V + 0.3V) and +4V DD CS, SCLK, DIN, DOUT, EOC TO GND .......-0.3V to the lower of Storage Temperature Range ............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC (V + 0.3V) and +4V OVDD Soldering Temperature (reflow) ......................................+260NC DGND to GND ......................................................-0.3V to +0.3V Input/Output Current (all pins) ...........................................50mA Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) TQFN Junction-to-Ambient Thermal Resistance (B ) ...........29NC/W JA Junction-to-Case Thermal Resistance (B ) ...............1.7NC/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (MAX11335/MAX11336/MAX11337) (V = 2.35V to 3.6V, V = 1.5V to 3.6V, f = 500ksps, f = 8MHz, 50% duty cycle, V = V , T = -40NC to +125NC, DD OVDD SAMPLE SCLK REF+ DD A unless otherwise noted. Typical values are at T = +25NC.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY (Notes 3 and 4) Resolution RES 12 bit 12 Bits Integral Nonlinearity INL Q1.0 LSB Differential Nonlinearity DNL No missing codes Q1.0 LSB Offset Error 1.2 Q3.0 LSB Gain Error (Note 5) -0.02 Q5.5 LSB Offset Error Temperature Coefficient OE Q2 ppm/NC TC Gain Temperature Coefficient GE Q0.8 ppm/NC TC Channel-to-Channel Offset Matching Q0.5 LSB Line Rejection PSR (Note 6) Q0.3 Q2 LSB/V DYNAMIC PERFORMANCE (100kHz, Input Sine Wave) (Notes 3 and 7) Signal-to-Noise Plus Distortion SINAD 70 71.9 dB Signal-to-Noise Ratio SNR 70 72.3 dB Total Harmonic Distortion THD -83 -76 dB (Up to the 5th Harmonic) Spurious-Free Dynamic Range SFDR 77 84 dB Intermodulation Distortion IMD f = 99.2432kHz, f = 69.2139kHz -85 dB 1 2 -3dB 30 Full-Power Bandwidth MHz -0.1dB 5 Full-Linear Bandwidth SINAD 70dB 0.5 MHz Maxim Integrated 2