EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX14778 Dual 25V Above- and Below-the-Rails 4:1 Analog Multiplexer General Description Benefits and Features The MAX14778 dual 4:1 analog multiplexer supports Wide Signal Range Supported from Single-Supply analog signals up to 25V with a single 3.0 to 5.5V Voltage Eliminates Negative Power Supply supply. Each multiplexer has separate control inputs to 25V Signal Range allow independent switching, making the device ideal for Single 3.0V to 5.5V Supply multiplexing different communications signals with the Two Independent Multiplexers same connector pins. Extended ESD protection of 6kV Break-Before-Make Operation (Human Body Model) enable direct interfacing to cables 1.5 R (max) ON and connectors. 3m R Flatness (typ) ON The MAX14778 features a low 1.5 (max) on-resistance 300mA Maximum Current Through Multiplexer and 3m (typ) flatness to maximize signal integrity over 78pF Input Capacitance the entire common-mode voltage range. Each multiplexer 75MHz Large-Signal Bandwidth can carry up to 300mA of continuous current through the 20-Pin TQFN (5mm x 5mm) Package multiplexer in either direction. Extended ESD Protection on A and B Pins The MAX14778 supports switching of full-speed USB 1.1 6kV Human Body Model (HBM) signals (12Mbps) and RS-485 data rates of up to 20Mbps. The MAX14778 is available in a 20-pin (5mm x 5mm) TQFN package and is specified over the -40C to +125C Functional Diagram industrial temperature range. ENA SA0 SA1 V DD Applications RS-485/RS-232/USB 1.1 Multiplexing V P BIAS CONTROL A V N GENERATION POS Peripherals Handheld Industrial Devices A0 MAX14778 Communication Systems A1 Audio/Data Multiplexing ACOM A2 Connector Sharing A3 Gaming Machines B0 Ordering Information appears at end of data sheet. B1 BCOM B2 B3 CONTROL B ENB SB0 SB1 GND 19-5929 Rev 3 7/20MAX14778 Dual 25V Above- and Below-the-Rails 4:1 Analog Multiplexer Absolute Maximum Ratings (All voltages referenced to GND.) Continuous Current Through Switch ..............................500mA V ..........................................................................-0.3V to +6V Continuous Power Dissipation (T = +70C) DD A TQFN (derate 33.3mW/C above +70C)...............2666.7mW V ...........................-0.3V to the lesser of +52V and (V + 70V) P N Operating Temperature Range ......................... -40C to +125C V ............... The lesser of (V - 40V) and (V - 70V) to +0.3V N DD P Junction Temperature ......................................................+150C V to V ................................................................-0.3V to +70V P N Storage Temperature Range ............................ -65C to +150C ENA, ENB, SA , SB ............................... -0.3V to (V + 0.3V) DD Lead Temperature (soldering, 10s) ................................+300C A , ACOM, B , Soldering Temperature (reflow) .......................................+260C BCOM ..(V - 0.3V) to the lesser of (V + 0.3V) and (V + 52V) N P N Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 20 TQFN Package Code T2055+4 Outline Number 21-0140 Land Pattern Number 90-0009 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 30C/W JA Junction to Case ( ) 2C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com