EVALUATION KIT AVAILABLE MAX14870/MAX14872 Compact 4.5V to 36V Full-Bridge DC Motor Drivers General Description Benefits and Features Small Package Handles High Power and Reduces The MAX14870/MAX14872 motor drivers provide a small, Footprint Circuit Size low-power and simple solution for driving and controlling Up to 2.5A Peak Motor Current brushed DC motors and relays with voltages between Space-Saving TDFN-EP (3mm x 3mm) Package 4.5V and 36V. Very low driver on-resistance reduces Flexible 4.5V36V Supply Enables Longer Runtime power dissipation. on Batteries These drivers feature a charge-pump-less design for Low Power Consumption Runs Cooler and Longer reduced external components and low supply current. 280mW (typ) Total Bridge On-Resistance Integrated fast-decay current regulation allows user- 1mA (typ) Supply Current at 30kHz/24V adjustable peak startup motor currents and requires mini- 10A (max) Standby Current at 12V mal external components. Simplified Designs Reduces Time to Market A separate voltage-sense input (SNS) reduces current Charge-Pump-Less Architecture sensing errors due to parasitic trace resistance. Current Regulation Only Requires a Sense Resistor The MAX14870/MAX14872 features shoot-through protec- Current-Sense Input Simplifies PCB Layout tion and internal free-wheeling diodes that absorb inductive Integrated Protection Provides Robust Driving Solution motor currents. Driver outputs are short-circuit-protected Short-Circuit-Protected Drivers from shorts to ground, to the supply, and between M1 and Thermal-Shutdown Undervoltage Lockout M2. An active-low FAULT output signals thermal overload Diagnostic FAULT Output and overcurrents during fault conditions. -40C to +85C Temperature Range The MAX14870 has PWM and direction-control inputs, Applications while the MAX14872 has forward and reverse inputs for Printers and Scanners direction control. See the Function Tables. Relay Drivers The MAX14870/MAX14872 are available in a 12-pin Vending and Gaming Machines (3mm x 3mm) TDFN-EP package and operate over the -40C to +85C temperature range. Ordering Information appears at end of data sheet. Typical Application Circuit 24V M 3.3V V DD M1 M2 3.3V MAX14870 MAX14872 FAULT IRQ V DD VDD + DIR C GPO + PWM DRIVER PWM EN DRIVER CURRENT REGULATION SNS COM GND RSENSE + THESE PIN NAMES ARE FOR THE MAX14870. ON THE MAX14872, THESE ARE THE FWD AND REV INPUTS. 19-7062 Rev 1 6/17MAX14870/MAX14872 Compact 4.5V to 36V Full-Bridge DC Motor Drivers Absolute Maximum Ratings (All voltages referenced to GND.) Multilayer Board (derate at 24.4mW/C V ........................................................................-0.3V to +40V above +70C) ..........................................................1951mW DD M1, M2 ..................................................... -0.3V to (V + 0.3V) Operating Temperature Range ........................... -40C to +85C DD PWM, DIR, FWD, REV, FAULT, EN, SNS ..........-0.3V to +6.0V Junction Temperature ......................................................+150C COM .....................................................................-0.3V to +0.3V Storage Temperature Range .............................-65C to +150C Continuous Current Into M1, M2 ..........................................3A Lead Temperature (soldering, 10s) ................................+300C Continuous Power Dissipation (T = +70C) Solder Temperature (reflow) ...........................................+260C A Single-Layer Board (derate at 15.9mW/C above +70C) ..........................................................1270mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics Junction-to-Case Thermal Resistance ( ) Junction-to-Ambient Thermal Resistance ( ) JC JA TDFN-EP (Single-Layer Board) ..................................8.5C/W TDFN-EP (Single-Layer Board) ...................................63C/W TDFN-EP (Multilayer Board) .......................................8.5C/W TDFN-EP (Multilayer Board) ........................................41C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 4.5V to 36V, T = T to T , unless otherwise noted. Typical values are at V = 12V, T = +25C) (Note 2) DD A MIN MAX DD A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY Supply Voltage V 4.5 36 V DD f = PWM/FWD 1 EN = low, M1/M2 50kHz Supply Current I mA DD not connected No switching 0.5 1.2 V = 12V 3.7 10 EN = high, driver DD Shutdown Supply Current I A SHDN is in shutdown V = 36V 10 20 DD Undervoltage Lockout V V rising 3.3 3.8 4.3 V UVLO DD Threshold Undervoltage Lockout V 400 mV UVLO HYST Threshold Hysteresis Maxim Integrated 2 www.maximintegrated.com