EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX14930MAX14932, 4-Channel, 1kV and 2.75kV , RMS RMS MAX14130MAX14131 Digital Isolators General Description Benefits and Features Robust Galvanic Isolation of Digital Signals The MAX14930MAX14932 are a family of 4-chan- Withstands up to 2.75kV for 60s (V ) RMS ISO nel 2.75kV digital isolators utilizing Maxims RMS (MAX14930MAX14932) proprietary process technology. The MAX14130 Continuously Withstands 443V (V ) RMS IOWM MAX14131 are 4-channel 1kV digital isolators in RMS (MAX14930MAX14932) smaller footprint QSOP packages. For applications 630V Repetitive Peak Voltage (V ) PK IORM requiring 5kV of isolation, see the MAX14934 RMS (MAX14930MAX14932) MAX14936. The MAX14930MAX14932 family transfers Withstands 10kV Surge per IEC 61000-4-5 digital signals between circuits with different power Interfaces Directly with Most Micros and FPGAs domains at ambient temperatures up to +125C. Accepts 1.71V to 5.5V Supplies The MAX14930MAX14932 family offers all three possible Many Options Support Broad Applications unidirectional channel configurations to accommodate 3 Data Rates (1Mbps, 25Mbps, 150Mbps) any 4-channel design including SPI, RS-232, RS-485, 3 Channel Direction Configuration and digital I/O applications. For applications requiring 2 Output Default States (High or Low) 2 bidirectional channels, such as I C, see the MAX14933. 3 Packages (3.8mm, 4mm, 8mm Creepage and Devices are available with data rates from DC up to Clearance) 1Mbps, 25Mbps, or 150Mbps. Each device is also avail- Low Power Consumption at High Data Rates able in either a default high or default low configuration. At 1.8V: The default is the state an output goes to when its input is 2.5mA per Channel Typical at 1Mbps unpowered. See the Product Selector Guide and Ordering 5.25mA per Channel Typical at 100Mbps Information for the suffixes associated with each option. At 3.3V: 2.6mA per Channel Typical at 1Mbps Independent 1.71V to 5.5V supplies on each side of the 7.1mA per Channel Typical at 100Mbps isolator also make the devices suitable for use as level translators. Safety Regulatory Approvals (see Safety Regulatory Approvals) The MAX14930MAX14932 are available in both a 16-pin UL According to UL1577 wide body (10.3mm x 7.5mm) and narrow body (9.9mm x cUL According to CSA Bulletin 5A 3.9mm) SOIC package. The MAX14130MAX14131 are VDE 0884-11 Basic Insulation available in a 16-pin (6mm x 5mm) QSOP package. All devices are rated for operation at ambient temperatures Applications of -40C to +125C. Fieldbus Communications for Industrial Automation Isolated SPI, RS-232, RS-485/RS-422 Product Selector Guide and Ordering Information appear at General Multichannel Isolation Applications end of data sheet. Battery Management Medical Systems Functional Diagram VDDA VDDB VDDA VDDB VDDA VDDB MAX14930/MAX14130 MAX14931/MAX14131 MAX14932 ENB ENB ENB INA1 OUTB1 INA1 OUTB1 INA1 OUTB1 INA2 OUTB2 INA2 OUTB2 INA2 OUTB2 INA3 OUTB3 INA3 OUTB3 OUTA1 INB1 INA4 OUTB4 OUTA1 INB1 OUTA2 INB2 ENA ENA GNDA GNDB GNDA GNDB GNDA GNDB 19-7066 Rev 9 11/20MAX14930MAX14932, 4-Channel, 1kV and 2.75kV , RMS RMS MAX14130MAX14131 Digital Isolators Absolute Maximum Ratings V to GNDA, V to GNDB .............................-0.3V to +6V Continuous Power Dissipation (T = +70C) DDA DDB A INA , ENA to GNDA ................................................-0.3V to +6V Wide SOIC (derate 14.1mW/C above +70C) ......1126.8mW INB , ENB to GNDB ...............................................-0.3V to +6V Narrow SOIC (derate 20mW/C above +70C) ......1600mW OUTA to GNDA ....................................-0.3V to (V + 0.3V) QSOP (derate 9.6mW/C above +70C) ..................771.5mW DDA OUTB to GNDB ....................................-0.3V to (V + 0.3V) Operating Temperature Range ......................... -40C to +125C DDB Short-Circuit Duration Maximum Junction Temperature .....................................+150C (OUTA to GNDA, OUTB to GNDB) ..................Continuous Storage Temperature Range ............................ -65C to +150C Lead Temperature (soldering, 10s) .................................+300C Soldering Temperature (reflow) ......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 16 Wide SOIC Package Code W16M+8 Outline Number 21-0042 Land Pattern Number 90-0107 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 71C/W JA Junction to Case ( ) 23C/W JC PACKAGE TYPE: 16 Narrow SOIC Package Code S16M+11 Outline Number 21-0041 Land Pattern Number 90-0442 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 50C/W JA Junction to Case ( ) 8C/W JC PACKAGE TYPE: 16 QSOP Package Code E16MS+1F Outline Number 21-0055 Land Pattern Number 90-0167 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 103.7C/W JA Junction to Case ( ) 37C/W JC Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Maxim Integrated 2 www.maximintegrated.com