MAX14970 Ruggedized 6Gbps SATA Redriver with High ESD and Extended Temperature Operation General Description Benefits and Features The MAX14970 dual-channel buffer with input equaliza- Robust Solution for Harsh Environments tion and preemphasis is ideal to redrive internal serial-ATA Extended Temp Rating: -40C to +85C (SATA) 1i, 2i, and 3i signals as well as eSATA 1m and 2m High ESD Protection on All Pins: 8kV (HBM) signals. The device features high electrostatic discharge TQFN (4mm x 4mm) Package for Resistance to (ESD), 8kV Human Body Model (HBM) protection. The Vibration/Sho cks device can be placed near a SATA connector on the moth- Unique Power-Saving Design erboard to overcome board losses and guarantee SATA Standby State: <1mW (typ) compliance. The device is SATA specification version 3.0 Dynamic Power-Down State (gold standard) compliant and can also be pin configured for Idle State: 52.8mW (typ) SATA specification version 2.6 (gold standard) compliance. Active State: 231mW (typ) The device features hardware SATA-drive cable detection Design Flexibility that automatically places the device into a standby mode Input Equalization and Selectable Output that consumes less than 20A (typ) standby current when Preemphasis no drive is connected. In addition, the device features an Single 3.3V Supply Operation independent channel dynamic power-down mode where SATA 3i (6.0Gbps), SATA 2i/2m (3.0Gbps), power consumption is reduced when no input signal is and SATA 1i/1m(1.5Gbps) Compatible present. The device maintains output common-mode levels to meet internal SATA version 3.0 standards and Applications prevent delays when coming out of low-power mode. Industrial/Embedded PC The device preserves signal integrity at the receiv er by Portable IPC/HMI reestablishing full output levels and reducing the total sys- Industrial Server tem jitter (T ) by providing equalization. The device fea- J Medical tures channel-independent digital preemphasis controls SATA SSDs or HDDs to drive SATA outputs over longer trace lengths to meet internal SATA specifications. SATA out-of-band (OOB) signaling is supported using high-speed out-of-band Ordering Information appears at end of data sheet. signal detection on the inputs, and squelch on the cor- responding outputs. Inputs and outputs are all internally 50 terminated and must be AC-coupled to the SATA controller IC and SATA device. For related parts and recommended products to use with this part, refer The device operates from a single +3.3V (typ) supply, is to: www.maximintegrated.com/MAX14970.related available in a small, 4mm x 4mm TQFN package with flow- through traces for ease of layout, and is specified over the extended -40C to +85C operating temperature range. 19-6479 Rev 0 3/13MAX14970 Ruggedized 6Gbps SATA Redriver with High ESD and Extended Temperature Operation Absolute Maximum Ratings (All voltages referenced to GND, unless otherwise noted.) Continuous Power Dissipation (T = +70C) A V ...................................................................... -0.3V to +4.0V TQFN (derate 25.6mW/C above +70C) ................. 2051mW CC AINP, AINM, BINP, BINM, EN, CAD, Operating Temperature Range ........................... -40C to +85C MODE, PA, PB (Note 1) ....................... -0.3V to (V + 0.3V) Storage Temperature Range ............................ -55C to +150C CC Short-Circuit Output Current Lead Temperature (soldering, 10s) .................................+300C AOUTP, AOUTM, BOUTP, BOUTM ..............................30mA Soldering Temperature (reflow) .......................................+260C Continuous Current at Inputs AINP, AINM, BINP, BINM ................................................5mA Note 1: All I/O pins are clamped by internal diodes. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 2) TQFN Junction-to-Ambient Thermal Resistance ( ) .......... 39CW JA Junction-to-Case Thermal Resistance ( ) ................ 6C/W JC Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = +3.0V to +3.6V, C = 10nF coupling capacitor on each output, R = 50, T = -40C to +85C, unless otherwise noted. Typical CC CL L A values are at V = +3.3V, T = +25C.) (Note 3) CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Operating Power-Supply Range V 3.0 3.6 V CC PA = PB = V , D10.2 pattern, f = 3GHz, CC 70 100 active state Operating Supply Current I mA CC PA = PB = GND, D10.2 pattern, f = 3GHz, 60 85 active state Standby Supply Current I EN = GND or CAD = V 20 500 A STBY CC Dynamic Power-Down Current I 16 20 mA DYNPD Differential Input Resistance Z (Note 4) 85 100 115 RX-DIFF-DC Differential Output Resistance Z (Note 4) 85 100 115 TX-DIFF-DC AC PERFORMANCE 150MHz f < 300MHz 18 300MHz f < 600MHz 14 Differential Input Return Loss RL 600MHz f < 1200MHz 10 dB RX-DIFF (Notes 4, 5) 1.2GHz f < 2.4GHz 8 2.4GHz f 3.0GHz 3 Maxim Integrated 2 www.maximintegrated.com