MAX2009 19-2929 Rev 0 8/03 1200MHz to 2500MHz Adjustable RF Predistorter General Description Features The MAX2009 adjustable RF predistorter is designed to Up to 12dB ACPR Improvement* improve power amplifier (PA) adjacent-channel power Independent Gain and Phase Expansion Controls rejection (ACPR) by introducing gain and phase expan- Gain Expansion Up to 7dB sion in a PA chain to compensate for the PAs gain and phase compression. With its +23dBm maximum input Phase Expansion Up to 24 power level and wide adjustable range, the MAX2009 1200MHz to 2500MHz Frequency Range can provide up to 12dB of ACPR improvement for Exceptional Gain and Phase Flatness power amplifiers operating in the 1200MHz to 2500MHz Group Delay <1.3ns (Gain and Phase Sections frequency band. Lower frequencies of operation can be achieved with this ICs counterpart, the MAX2010. Combined) 0.04ns Group Delay Ripple Over a 100MHz Band The MAX2009 is unique in that it provides up to 7dB of gain expansion and 24 of phase expansion as the Capable of Handling Input Drives Up to +23dBm input power is increased. The amount of expansion is On-Chip Temperature Variation Compensation configurable through two independent sets of control: Single +5V Supply one set adjusts the gain expansion breakpoint and slope, while the second set controls the same Low Power Consumption: 75mW (typ) parameters for phase. With these settings in place, the Fully Integrated into Small 28-Pin Thin QFN linearization circuit can be run in either a static set-and- Package forget mode, or a more sophisticated closed-loop *Performance dependent on amplifier, bias, and modulation. implementation can be employed with real-time soft- ware-controlled distortion correction. Hybrid correction Ordering Information modes are also possible using simple lookup tables to compensate for factors such as PA temperature drift PART TEMP RANGE PIN-PACKAGE or PA loading. MAX2009ETI-T -40C to +85C 28 Thin QFN-EP* The MAX2009 comes in a 28-pin thin QFN exposed *EP = Exposed paddle. pad (EP) package (5mm x 5mm) and is specified for the extended (-40C to +85C) temperature range. Functional Diagram/ Applications Pin Configuration WCDMA/UMTS, cdma2000, DCS1800, and PCS1900 Base Stations 28 27 26 25 24 23 22 Feed-Forward PA Architectures Digital Baseband Predistortion Architectures GND* 1 21 V CCG Military Applications GAIN GND* 2 CONTROL 20 GND* WLAN Applications ING 3 19 PBRAW GND* 4 18 PBEXP MAX2009 GND* 5 17 PBIN PHASE OUTP 6 16 GND* CONTROL GND* 7 15 V CCP 8 9 10 11 12 13 14 *INTERNALLY CONNECTED TO EXPOSED GROUND PADDLE. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com. EVALUATION KIT AVAILABLE GND* GND* INP OUTG GND* GND* PFS1 GCS PFS2 GFS PDCS1 GBP PDCS2 GND*1200MHz to 2500MHz Adjustable RF Predistorter ABSOLUTE MAXIMUM RATINGS V , V to GND..............................................-0.3V to +5.5V Continuous Power Dissipation (T = +70C) CCG CCP A ING, OUTG, GCS, GFS, GBP to GND......-0.3V to (V + 0.3V) 28-Pin Thin QFN-EP CCG INP, OUTP, PFS , PDCS , PBRAW, (derate 21mW/C above +70C)...............................1667mW PBEXP, PBIN to GND ............................-0.3V to (V + 0.3V) Operating Temperature Range ...........................-40C to +85C CCP Input (ING, INP, OUTP, OUTG) Level ............................+23dBm Junction Temperature......................................................+150C PBEXP Output Current........................................................1mA Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering 10s) ..................................+300C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (MAX2009 EV kit V = V = +4.75V to +5.25V no RF signal applied INP, ING, OUTP, OUTG are AC-coupled and terminated to CCG CCP 50 V = open PBEXP shorted to PBRAW V = V = 0.8V V = V = V = GND V = V T = -40C to PF S1 PDCS1 PDCS2 PBIN GBP GCS GFS CCG A +85C. Typical values are at V = V = +5.0V, T = +25C, unless otherwise noted.) CCG CCP A PARAMETER CONDITIONS MIN TYP MAX UNITS Supply Voltage V , V 4.75 5.25 V CCG CCP V 5.8 7 CCP Supply Current mA V 10 12.1 CCG PBIN, PBRAW 0 V CCP Analog Input Voltage Range V GBP, GFS, GCS 0 V CCG V = V = V = 0V -2 +2 GFS GCS PBRAW Analog Input Current V = 0 to +5V -100 +170 A GBP V = 0 to +5V -100 +220 PBIN Logic-Input High Voltage PDCS1, PDCS2 (Note 1) 2.0 V Logic-Input Low Voltage PDCS1, PDCS2 (Note 1) 0.8 V Logic Input Current -2 +2 A 2 MAX2009