Click here for production status of specific part numbers. MAX2077 Octal-Channel Ultrasound Front-End General Description Benefits and Features The MAX2077 octal-channel ultrasound front-end is 8 Full Channels of LNA, VGA, and AAF in a Small, a fully integrated, bipolar, high-density, octal-channel 8mm x 8mm, 56-Pin or 10mm x 10mm, 68-Pin TQFN ultrasound receiver optimized for low-cost, high-channel Package count, high-performance portable and cart-based ultra- Ultra-Low Full-Channel Noise Figure of 2.4dB at sound systems. The easy-to-use IC allows the user to R = R = 200 IN S achieve high-end 2D and PW imaging capability using Low Output-Referred Noise of 23nV/Hz at 5MHz, substantially less space and power. The highly compact 20dB Gain, Yielding a Broadband SNR of 68dB* imaging receiver lineup, including a low-noise amplifier for Excellent Second-Harmonic Imaging (LNA), variable-gain amplifier (VGA), and anti-alias filter High Near-Carrier SNR of 140dBc/Hz at 1kHz (AAF), achieves an ultra-low 2.4dB noise figure at R = S R = 200 at a very low 64.8mW per-channel power Offset from a 5MHz, 1V Output Signal, and IN P-P 20dB of Gain for Excellent Low-Velocity PW and dissipation. The full imaging receiver channel has been optimized for second-harmonic imaging with -64dBFS Color-Flow Doppler Sensitivity in a High-Clutter Environment second-harmonic distortion performance with a 1V P-P 5MHz output signal and broadband SNR of > 68dB* at Ultra-Low Power 64.8mW per Full-Channel (LNA, 20dB gain. The bipolar front-end has also been optimized VGA, and AAF) Normal Imaging Mode for excellent low-velocity PW and color-flow Doppler sen- Selectable Active Input-Impedance Matching of sitivity with an exceptional near-carrier SNR of 140dBc/Hz 50, 100, 200, and 1k at 1kHz offset from a 5MHz 1V output clutter signal. P-P Wide Input-Voltage Range of 330mV in High LNA P-P The MAX2077 octal-channel ultrasound front-end is avail- Gain Mode and 550mV in Low LNA Gain Mode P-P able in a small 8mm x 8mm, 56-pin thin QFN or 10mm x Integrated Selectable 3-Pole 9MHz, 10MHz, 10mm, 68-pin thin QFN package with an exposed pad 15MHz, and 18MHz Butterworth AAF and is specified over a 0C to +70C temperature range. To add CW Doppler capability, replace the MAX2077 with Fast-Recovery, Low-Power Modes (< 2s) the MAX2078. Pin Compatible with the MAX2078 Ultrasound Front-End with CW Doppler (MAX2077 68-Pin Applications Package Variant) Medical Ultrasound Imaging Sonar Ordering Information and Typical Application Circuits appear at end of data sheet. *When coupled with the MAX1437B ADC. 19-4696 Rev 2 5/19MAX2077 Octal-Channel Ultrasound Front-End Absolute Maximum Ratings V to GND ........................................................-0.3V to +5.5V Input Differential Voltage ...............................2.0V differential CC P-P V - V .................................................................... > -0.3V Continuous Power Dissipation (T = +70C) CC2 CC1 A ZF , IN , AG to GND ............................. -0.3V to (V + 0.3V) 56-Pin TQFN (derate 47.6mW/C above +70C) ............3.8W CC INC .............................................................................20mA DC 68-Pin TQFN (derate 40.0mW/C above +70C) ............4.0W V to GND ...........................................................-0.3V to +3V Operating Temperature Range (Note 1) .................0C to +70C REF IN to AG ..............................................................-0.6V to +0.6V Junction Temperature ......................................................+150C OUT , DIN, DOUT, VG , NP, CS, CLK, Storage Temperature Range ............................ -40C to +150C PD to GND.......................................... -0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) .................................+300C CC1 V , V analog and digital control signals must be applied CC REF in this order Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 56 TQFN Package Code T5688+2 Outline Number 21-0135 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) (Notes 2) 21C/W JA Junction to Case ( ) (Note 3) 1C/W JC PACKAGE TYPE: 68 TQFN Package Code T6800+2 Outline Number 21-0142 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) (Note 2) 20C/W JA Junction to Case ( ) (Note 3) 0.3C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Note 1: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Note 2: Junction temperature T = T + ( x V x I ), assuming there is no heat removal from the exposed pad. The junction J A JA CC CC temperature must not exceed 150C. Note 3: Junction temperature T = T + ( x V x I ). This formula can only be used if the component is soldered down to a J C JC CC CC printed circuit board pad containing multiple ground vias to remove the heat. The junction temperature must not exceed 150C. Maxim Integrated 2 www.maximintegrated.com