MAX3202E/MAX3203E/MAX3204E/MAX3206E 19-2739 Rev 5 6/11 Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces General Description Features The MAX3202E/MAX3203E/MAX3204E/MAX3206E are High-Speed Data Line ESD Protection low-capacitance 15kV ESD-protection diode arrays 15kVHuman Body Model designed to protect sensitive electronics attached to 8kVIEC 61000-4-2, Contact Discharge communication lines. Each channel consists of a pair of 15kVIEC 61000-4-2, Air-Gap Discharge diodes that steer ESD current pulses to V or GND. CC Tiny WLP Package Available The MAX3202E/MAX3203E/MAX3204E/MAX3206E pro- tect against ESD pulses up to 15kV Human Body Low 5pF Input Capacitance Model, 8kV Contact Discharge, and 15kV Air-Gap Low 1nA (max) Leakage Current Discharge, as specified in IEC 61000-4-2. These devices have a 5pF capacitance per channel, making Low 1nA Supply Current them ideal for use on high-speed data I/O interfaces. +0.9V to +5.5V Supply Voltage Range The MAX3202E is a two-channel device intended for USB 2-, 3-, 4-, or 6-Channel Devices Available and USB 2.0 applications. The MAX3203E is a triple-ESD structure intended for USB On-the-Go (OTG) and video Ordering Information applications. The MAX3204E is a quad-ESD structure designed for Ethernet and FireWire applications, and PART PIN-PACKAGE TOP MARK the MAX3206E is a six-channel device designed for MAX3202EEWS+T 4 WLP +AA cell phone connectors and SVGA video connections. 6 TDFN-EP* +ADQ MAX3202EETT+T All devices are available in tiny 4-bump (1.05mm x MAX3203EEEWT+T 6 WLP +BG 1.05mm) WLP, 6-bump (1.05mm x 1.57mm) WLP, 9-bump (1.52mm x 1.52mm) WLP, 6-pin (3mm x 3mm) MAX3203EETT+T 6 TDFN-EP* +ADO TDFN, and 12-pin (4mm x 4mm) TQFN packages and MAX3204EEWT+T 6 WLP +AL are specified for -40C to +85C operation. MAX3204EETT+T 6 TDFN-EP* +ADP MAX3206EEWL+T 9 WLP +AQ Applications MAX3206EETC+ 12 TQFN-EP* +AACA USB Video *EP = Exposed pad. USB 2.0 Cell Phones Note: All devices operate over -40C to +85C temperature range. Ethernet SVGA Video Connections +Denotes a lead(Pb)-free/RoHS-compliant package. FireWire Selector Guide Typical Operating Circuit ESD-PROTECTED PART V V CC CC I/O PORTS 2 MAX3202EEWS+T 0.1F MAX3202EETT-T 2 MAX3203EEWT+T 3 0.1F MAX3203EETT-T 3 I/0 I/0 PROTECTED MAX3204EEBT-T 4 CIRCUIT MAX3204EETT-T 4 MAX3202E MAX3206EEBL-T 6 MAX3204E MAX3206E MAX3206EETC 6 MAX3208E Pin Configurations appear at end of data sheet. FireWire is a registered trademark of Apple Computer, Inc. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com.Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces ABSOLUTE MAXIMUM RATINGS V to GND...........................................................-0.3V to +7.0V 6-Pin TDFN (derate 24.4mW/C above +70C) ..........1951mW CC I/O to GND................................................-0.3V to (V + 0.3V) 12-Pin TQFN (derate 16.9mW/C above +70C) ........1349mW CC Continuous Power Dissipation (T = +70C) Operating Temperature Range ...........................-40C to +85C A 2 2 WLP (derate 11.5mW/C above +70C)...............920mW Storage Temperature Range .............................-65C to +150C 3 2 WLP (derate 12.3mW/C above +70C)...............984mW Junction Temperature .....................................................+150C 3 3 WLP (derate 14.1mW/C above +70C).............1128mW Lead Temperature (soldering, 10s) .................................+300C Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) 4 WLP 6 TDFN Junction-to-Ambient Thermal Resistance ( )...............87C/W Junction-to-Ambient Thermal Resistance ( )....................42C/W JA JA 6 WLP Junction-to-Case Thermal Resistance ( )...........................9C/W JC Junction-to-Ambient Thermal Resistance ( )...............84C/W 12 TQFN JA 9 WLP Junction-to-Ambient Thermal Resistance ( )....................41C/W JA Junction-to-Ambient Thermal Resistance ( )...............71C/W Junction-to-Case Thermal Resistance ( )...........................6C/W JA JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = +5V 5%, T = T to T , unless otherwise noted. Typical values are at V = +5V and T = +25C.) (Note 2) CC A MIN MAX CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 0.9 5.5 V CC Supply Current I 1 100 nA CC Diode Forward Voltage V I = 10mA 0.65 0.95 V F F T = +25C, 15kV A Positive transients V + 25 CC Human Body Model, Negative transients -25 I = 10A F T = +25C, 8kV A Positive transients V + 60 CC Channel Clamp Voltage V Contact Discharge V C (Note 3) Negative transients -60 (IEC 61000-4-2), I = 24A F T = +25C, 15kV A Positive transients V + 100 CC Air-Gap Discharge Negative transients -100 (IEC 61000-4-2), I = 45A F Channel Leakage Current T = 0C to +50C (Note 4) -1 +1 nA A Channel Input Capacitance V = 5V, bias of V /2 5 7 pF CC CC ESD PROTECTION Human Body Model 15 kV IEC 61000-4-2 8 kV Contact Discharge IEC 61000-4-2 15 kV Air-Gap Discharge Note 2: Limits over temperature are guaranteed by design, not production tested. Note 3: Idealized clamp voltages (L1 = L2 = L3 = 0) (Figure 1 ) see the Applications Information section for more information. Note 4: Guaranteed by design. Not production tested. 2 MAX3202E/MAX3203E/MAX3204E/MAX3206E