MAX4719 19-2626 Rev 0 10/02 20 , 300MHz Bandwidth, Dual SPDT Analog Switch in UCSP General Description Features The MAX4719 low-voltage, low on-resistance (R ), ON -3dB Bandwidth: >300MHz dual single-pole/double throw (SPDT) analog switch Low 15pF On-Channel Capacitance operates from a single +1.8V to +5.5V supply. The MAX4719 features 20 R (max) with 1.2 flatness Single-Supply Operation from +1.8V to +5.5V ON and 0.4 matching between channels. The switch offers 20 R (max) Switch ON break-before-make switching (1ns) with t <80ns and ON 0.4 (max) R Match (+3.0V Supply) ON t <40ns at +2.7V. The digital logic inputs are +1.8V OFF 1.2 (max) R Flatness (+3.0V Supply) ON logic compatible with a +2.7V to +3.6V supply. Rail-to-Rail Signal Handling The switch is packaged in a chip-scale package (UCSP), significantly reducing the required PC board High Off-Isolation: -55dB (10MHz) area. The chip occupies only a 2.0mm 1.50mm area Low Crosstalk: -80dB (10MHz) and has a 4 3 bump array with a bump pitch of 0.5mm. The MAX4719 is also available in a 10-pin Low Distortion: 0.03% MAX package. +1.8V CMOS-Logic Compatible Applications <0.5nA Leakage Current at +25C Cell Phones Battery-Operated Equipment Audio/Video-Signal Routing Ordering Information Low-Voltage Data-Acquisition Systems PIN/BUMP- TOP PART TEMP RANGE Sample-and-Hold Circuits PACKAGE MARK PDAs MAX4719EUB -40C to +85C 10 MAX MAX4719EBC-T* -40C to +85C 12 UCSP-12 ABJ Note: UCSP package requires special solder temperature pro- file described in the Absolute Maximum Ratings section. *UCSP reliability is integrally linked to the users assembly meth- ods, circuit board material, and environment. See the UCSP reli- UCSP is a trademark of Maxim Integrated Products, Inc. ability notice in the UCSP Reliability section of this data sheet for Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd. more information. Pin Configurations/Functional Diagrams/Truth Table TOP VIEW MAX4719 (BUMP SIDE MAX4719 GND DOWN) MAX4719 NC1 C1 B1 A1 NC2 V+ 1 10 NO2 IN NO NC NO1 2 9 COM2 C2 A2 IN1 IN2 0 OFF ON 1 ON OFF 3 IN2 COM1 8 COM1 C3 A3 COM2 SWITCHES SHOWN FOR LOGIC0 INPUT 7 IN1 4 NC2 NO1 NO2 C4 B4 A4 NC1 5 6 GND V+ MAX UCSP Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.20 , 300MHz Bandwidth, Dual SPDT Analog Switch in UCSP ABSOLUTE MAXIMUM RATINGS (All Voltages Referenced to GND) ESD Method 3015.7 ...............................................................2kV V+, IN ...................................................................-0.3V to +6.0V Operating Temperature Range ...........................-40C to +85C COM , NO , NC (Note 1) ...........................-0.3V to (V+ + 0.3V) Junction Temperature......................................................+150C Continuous Current COM , NO , NC ...........................100mA Storage Temperature Range .............................-65C to +150C Peak Current COM , NO , NC Lead Temperature (soldering, 10s) .................................+300C (pulsed at 1ms, 10% duty cycle)................................200mA Bump Temperature (soldering) (Note 2) Continuous Power Dissipation (T = +70C) Infrared (15s) ...............................................................+220C A 10-Pin MAX (derate 5.6mW/C above +70C) ...........444mW Vapor Phase (60s) .......................................................+215C 12-Bump UCSP (derate 11.4mW/C above +70C) ....909mW Note 1: Signals on COM , NO , or NC exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maxi- mum current rating. Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom- mended in the industry standard specification, JEDEC 020A, paragraph 7.6, table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICSSingle +3V Supply (V+ = +2.7V to +3.6V, V = +1.4V, V = +0.5V, T = T to T , unless otherwise noted. Typical values are at V+ = +3.0V, IH IL A MIN MAX T = +25C, unless otherwise noted.) (Notes 3, 4) A PARAMETER SYMBOL CONDITIONS T MIN TYP MAX UNITS A V , T to COM MIN Analog Signal Range 0V+V V , V T NO NC MAX ANALOG SWITCH +25C1420 V+ = 2.7V, I = 10mA COM On-Resistance (Note 5) R ON T to MIN V or V = 1.5V NO NC 25 T MAX +25C 0.15 0.4 On-Resistance Match Between V+ = 2.7V, I = 10mA COM R ON T to MIN Channels (Notes 5, 6) V or V = 1.5V NO NC 0.5 T MAX +25C 0.6 1.2 On-Resistance Flatness V+ = 2.7V, I = 10mA COM R FLAT(ON) T to MIN (Note 7) V or V = 1.0V, 1.5V, 2.0V NO NC 1.5 T MAX +25C -0.5 0.01 +0.5 NO , NC Off-Leakage Current I V+ = 3.6V, V = 0.3V, 3.3V NO (OFF), COM nA T to MIN (Note 8) I V or V = 3.3V, 0.3V NC (OFF) NO NC -1 +1 T MAX +25C -1 0.01 +1 V+ = 3.6V, V = 0.3V, 3.3V COM COM On-Leakage Current I V or V = 0.3V, 3.3V, or nA COM (ON) NO NC T to MIN (Note 8) -2 +2 floating T MAX DYNAMIC CHARACTERISTICS +25C4080 V , V = 1.5V NO NC Turn-On Time t ns ON T to MIN R = 300 , C = 35pF, Figure 1 L L 100 T MAX 2 MAX4719