Click here for production status of specific part numbers. MAX4800A/MAX4802A Low-Charge-Injection, 8-Channel, High-Voltage Analog Switches with 20MHz Serial Interface General Description Features The MAX4800A/MAX4802A provide high-voltage switch- Fast SPI Interface 20MHz ing on eight channels for ultrasonic imaging and printer Pin-Compatible Replacement for Supertex HV2203 applications. The devices utilize BCDMOS process tech- (MAX4800A) nology to provide eight high-voltage low-charge-injection Pin-Compatible Replacement for Supertex HV2303 SPST switches, controlled by a 20MHz serial interface. (MAX4802A) Data is clocked into an internal 8-bit shift register and retained by a programmable latch with enable and clear Flexible High-Voltage Supplies Up to V - V = PP NN 200V inputs. A power-on reset function ensures that all switches are open on power-up. Low-Charge-Injection, Low-Capacitance 22 The devices operate with a wide range of high-voltage Switches supplies including: V /V = +100V/-100V, +185V/-15V, PP NN DC to 50MHz Analog-Signal Frequency Range and +40V/-160V. The digital interface operates from a -77dB Off-Isolation at 5MHz separate V supply from +2.7V to +6V. Digital inputs DD Low 10A Quiescent Current DIN, CLK, LE, and CLR are +6V tolerant, independent of the V supply voltage. The MAX4802A provides DD Integrated Bleed Resistors (MAX4802A Only) integrated 35k bleed resistors on each switch terminal Available in Standard PLCC, LQFP, and CSBGA to discharge capacitive loads. Packages The devices are drop-in replacements for the Supertex HV2203 and HV2303. They are available in the 48-pin LQFP, 26-bump CSBGA, and 28-pin PLCC packages. All devices are specified for the commercial 0C to +70C temperature range. Applications Ultrasound Imaging Printers SPI is a trademark of Motorola, Inc. 19-4120 Rev 2 4/19MAX4800A/MAX4802A Low-Charge-Injection, 8-Channel, High-Voltage Analog Switches with 20MHz Serial Interface Absolute Maximum Ratings (All voltages referenced to GND.) Continuous Power Dissipation (T = +70C) A V Logic Supply Voltage .......................................-0.3V to +7V 26-Bump CSBGA (derate 11.8mW/C above +70C) .... 941mW DD V - V Supply Voltage ..................................................220V 28-Pin PLCC (derate 10.5mW/C above +70C) ........842mW PP NN V Positive Supply Voltage ................... -0.3V to (V + 220V) 48-Pin LQFP (derate 22.7mW/C above +70C) ......1818mW PP NN V Negative Supply Voltage .............................+0.3V to -220V Operating Temperature Range ...............................0C to +70C NN Logic Inputs LE, CLR, CLK, DIN .............................-0.3V to +7V Storage Temperature Range ............................ -65C to +150C DOUT ....................................................... -0.3V to (V + 0.3V) Junction Temperature ......................................................+150C DD RGND (MAX4802A) .............................................-4.5V to +0.3V Lead Temperature (excluding CSBGA, soldering, 10s) ..+300C COM , NO .............................................................. V to V Soldering Temperature (reflow) NN PP 28 PLCC ......................................................................+245C All other packages .......................................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 26 CSBGA Package Code X07265+1 Outline Number 21-0158 Land Pattern Number 90-0184 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 85C/W JA Junction to Case ( ) 23C/W JC PACKAGE TYPE: 28 PLCC Package Code Q28+13 Outline Number 21-0049 Land Pattern Number 90-0235 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 44C/W JA Junction to Case ( ) 10C/W JC PACKAGE TYPE: 48 LQFP Package Code C48+6 Outline Number 21-0054 Land Pattern Number 90-0093 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 44C/W JA Junction to Case ( ) 10C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com