MAX4889B/MAX4889C 19-4148 Rev 2 8/10 2.5/5.0/8.0Gbps PCIe Passive Switches General Description Features The MAX4889B/MAX4889C high-speed passive switch- Single +3.3V Power-Supply Voltage es route PCI Express (PCIe) data between two possi- Support PCIe Gen I, Gen II, and Gen III Data Rates ble destinations in desktop or notebook PCs. The MAX4889B/MAX4889C are quad double-pole/double- Supports SAS I, SAS II, and SAS 6.0Gbps throw (4 x DPDT) switches ideal for switching four half (MAX4889C) lanes of PCIe data between two destinations. The Superior Return Loss MAX4889B/MAX4889C feature a single digital control input (SEL) to switch signal paths. Better than -10dB (typ) at 5.0GHz The MAX4889C is intended for use in systems (e.g., Small 3.5mm x 9.0mm, 42-Pin TQFN Package SAS) where both the input and output are capacitively Industry-Standard Pinouts coupled, and provides a 10A (typ) source current and a 60k (typ) internal biasing resistor to GND at the OUT terminals. The MAX4889B/MAX4889C are fully specified to oper- ate from a single +3.3V (typ) power supply. Both devices are available in an industry-standard 3.5mm x 9.0mm, 42-pin TQFN package. These devices operate over the -40C to +85C extended temperature range. Applications Ordering Information Desktop PCs PART TEMP RANGE PIN-PACKAGE Notebook PCs MAX4889BETO+ -40C to +85C 42 TQFN-EP* Servers MAX4889CETO+ -40C to +85C 42 TQFN-EP* Video Graphics CardsSLI +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. (Scaled Link Interface) and CrossFire PCI Express is a registered service mark of PCI-SIG Corporation. SLI is a registered trademark of NVIDIA Corporation. Typical Operating Circuit appears at end of data sheet. CrossFire is a trademark of ATI Technologies, Inc. Pin Configuration TOP VIEW 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 39 21 V V CC CC GND 40 20 GND MAX4889B V 41 19 V CC CC MAX4889C *EP GND 42 18 GND + 1 2 3 4 5 6 7 8 9 1011121314151617 TQFN *CONNECT EXPOSED PAD TO GROUND. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLE AIN+ GND AIN- AOUTA+ AOUTB+ AOUTA- AOUTB- GND BIN+ V CC BIN- BOUTA+ BOUTB+ BOUTA- BOUTB- V CC V SEL CC CIN+ GND CIN- COUTA+ COUTB+ COUTA- V COUTB- CC DIN+ GND DOUTA+ DIN- DOUTB+ DOUTA- GND DOUTB-2.5/5.0/8.0Gbps PCIe Passive Switches ABSOLUTE MAXIMUM RATINGS (All voltages referenced to GND, unless otherwise noted.) Continuous Power Dissipation (T = +70C) for multilayer board: A V ...........................................................................-0.3V to +4V 42-Pin TQFN (derate 35.7mW/C above +70C) .......2857mW CC SEL, IN , OUTA , OUTB (Note 1) .......-0.3V to (V + 0.3V) Operating Temperature Range ...........................-40C to +85C CC Continuous Current (AIN to AOUTA /AOUTB , BIN to Junction Temperature......................................................+150C BOUTA /BOUTB , CIN to COUTA /COUTB , DIN to Storage Temperature Range .............................-65C to +150C DOUTA /DOUTB ) .........................................................70mA Package Junction-to-Ambient Thermal Resistance Peak Current (AIN to AOUTA /AOUTB , BIN to ( ) (Note 2) ............................................................28.0C/W JA BOUTA /BOUTB , CIN to COUTA /COUTB , DIN to Package Junction-to-Case Thermal Resistance DOUTA /DOUTB ) ( ) (Note 2) ..............................................................2.0C/W JC (pulsed at 1ms, 10% duty cycle)..............................70mA Lead Temperature (soldering, 10s) .................................+300C Continuous Current (SEL).................................................10mA Soldering Temperature (reflow) .......................................+260C Peak Current (SEL) (pulsed at 1ms, 10% duty cycle)..................................10mA Note 1: Signals on SEL, IN , OUTA , OUTB exceeding V or GND are clamped by internal diodes. Limit forward-diode current CC to maximum current rating. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = +3.3V 10%, T = T to T unless otherwise noted. Typical values are at V = +3.3V, T = +25C, unless otherwise CC A MIN MAX, CC A noted.) (Note 3) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC PERFORMANCE IN , V - CC Analog Signal Range OUTA , -0.3 V 1.8 OUTB V = +3.0V, I = 15mA, V , CC IN OUTA On-Resistance R 6.4 8.4 ON V = 0V, 1.2V OUTB On-Resistance Match Between V = +3.0V, I = 15mA, V , CC IN OUTA R 0.1 0.5 ON Pairs of Same Channel V = 0V (Notes 4, 5) OUTB On-Resistance Match Between V = +3.0V, I = 15mA, V , CC IN OUTA R 0.2 ON Channels V = 0V (Notes 4, 5) OUTB V = +3.0V, I = 15mA, V , CC IN OUTA On-Resistance Flatness R 0.3 FLAT (ON) V = 0V, 1.2V (Notes 5, 6) OUTB OUTA or OUTB Off-Leakage I , V = +3.6V, V = 0V, 1.2V, V OUTA (OFF) CC IN OUTA -1 +1 A Current I or V = 1.2V, 0V (MAX4889B) OUTB (OFF) OUTB V = +3.6V, V = 0V, 1.2V, V CC IN OUTA IN On-Leakage Current I or V = V or unconnected -1 +1 A IN (ON) OUTB IN (MAX4889B) All other ports are unconnected Output Short-Circuit Current 515A (MAX4889C) All other ports are unconnected Output Open-Circuit Voltage 0.2 0.6 0.9 V (MAX4889C) 2 MAX4889B/MAX4889C