MAX4969 19-4810 Rev 0 7/09 PCIe, Single Lane, 2:1/1:2 Multiplexer and Redriver with Equalization General Description Features The MAX4969 active 2:1 and 1:2 multiplexer equalizes S Single +3.3V Supply Operation M and redrives PCIe signals up to 5.0GT/s (Gigatransfers S PCIe Gen 1 (2.5GT/s) and Gen 2 (5.0GT/s) per second) and operates from a single +3.3V supply. Return Loss 8dB (1.25GHz f 2.5GHz) The MAX4969 features PCIe-required electrical idle and S Independent Input Equalization receiver detection on each channel, and improves signal S Independent Output Deemphasis integrity at the receiver through independent program- S Independent Output Level Selection mable input equalization and output deemphasis. Reduced Power and EMI The MAX4969 is available in a small, 42-pin (3.5mm x S On-Chip 50I Input/Output Terminations 9.0mm) TQFN package optimal for simplified layout and space-saving requirements. The MAX4969 is specified S Inline Signal Traces for Simplified Layout over the 0NC to +70NC commercial operating tempera- S Space-Saving, 3.5mm x 9.0mm TQFN Package ture range. Applications Ordering Information Blade Servers PART TEMP RANGE PIN-PACKAGE Workstations MAX4969CTO+ 0NC to +70NC 42 TQFN-EP* Communications Switches +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. Test Equipment Storage Area Network Pin Configuration TOP VIEW 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 ODEB0 39 21 INEQB0 INEQB1 ODEB1 40 20 MAX4969 ODEA0 41 19 INEQA0 ODEA1 42 *EP 18 INEQA1 + 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 TQFN *CONNECT EXPOSED PAD (EP) TO GND. PCIe is a registered trademark of PCI-SIG Corp. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. V V CC CC INEQ1 GND INEQ0 OUTAP GND OUTAM INP GND INM OUTBP GND OUTBM SEL1 GND SEL2 RX DET EN GND GND INAP OUTP INAM OUTM GND GND INBP ODE1 INBM GND ODE0 V V CC CCPCIe, Single Lane, 2:1/1:2 Multiplexer and Redriver with Equalization ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND.) Junction-to-Case Thermal Resistance V .......................................................................-0.3V to +4.0V B (Note 2) ................................................................ +2NC/W CC JC All Other Pins (Note 1) ............................ -0.3V to (V + 0.3V) Junction-to-Ambient Thermal Resistance CC Continuous Current, IN P, IN M, OUT P, OUT M .........Q30mA B (Note 2) .............................................................. +29NC/W JA Peak Current, IN P, IN M, OUT P, Operating Temperature Range ............................. 0NC to +70NC OUT M (for 10kHz, 1% duty cycle) ..........................Q100mA Junction Temperature Range ........................... -40NC to +150NC Continuous Power Dissipation (T = +70NC) Storage Temperature Range ............................ -65NC to +150NC A 42-Pin TQFN (derate 34.5mW/NC above +70NC) ......2758mW Lead Temperature (soldering, 10s) ................................+300NC Note 1: All I/O pins are clamped by internal diodes. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = +3.0V to +3.6V, C = 75nF coupling capacitor on each output, R = 50I on each output, T = 0NC to +70NC, unless other- CC CL L A wise noted. Typical values are at V = +3.3V and T = +25NC.) (Note 3) CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC PERFORMANCE Power-Supply Range V 3.0 3.6 V CC INEQ = ODE = GND 120 150 EN = V CC Supply Current I INEQ = ODE = V 160 200 mA CC CC EN = GND 50 Input Impedance, Differential Z DC 80 100 120 I RX-DIFF-DC Output Impedance, Differential Z DC 80 100 120 I TX-DIFF-DC Z RX-HIGH-IMP- V = V = 0 to 200mV 50 kI IN P IN M Common-Mode Resistance to DC-POS GND, Input Terminations Not Z RX-HIGH-IMP- Powered V = V = -150mV to 0V 1 kI IN P IN M DC-NEG Common-Mode Resistance to GND, Input Terminations Z DC 40 50 60 I RX-DC Powered Output Short-Circuit Current I Single-ended (Note 4) 90 mA TX-SHORT V TX-CM-DC- Common-Mode Delta, Between -100 +100 mV ACTIVE-IDLE- Active and Idle States DELTA DC Output Offset, During V Difference between DC average of TX-CM-DC- -25 +25 mV Active State V and V LINE-DELTA OUT P OUT M DC Output Offset, During V TX-IDLE-DIFF- ABS(V - V ) -10 +10 mV OUT P OUT M Electrical Idle DC AC PERFORMANCE 0.05GHz < f P 1.25GHz (Note 4) 10 dB Input Return Loss, Differential RL RX-DIFF 8 dB 1.25GHz < f P 2.5GHz (Note 4) 2 MAX4969