EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX6070/MAX6071 Low-Noise, High-Precision Series Voltage References General Description Benefits and Features The MAX6070/MAX6071 offer a very low noise and 6-Pin SOT23 Package Reduces System Board Space low-drift voltage reference in a small 6-pin SOT23 package. Stable Performance over Temperature and Time These devices provide a 1/f noise voltage of only Improves System Accuracy 4.8V at an output voltage of 2.5V, with a temperature P-P High 0.04% Initial Accuracy drift of 6ppm/C (max, A grade). The devices consume Low 1.5ppm/C (typ), 6ppm/C (max, A grade) 150A of supply current and can sink and source up to Temperature Drift 10mA of load current. The low-drift and low-noise specifi- Low 4.8V Noise (0.1Hz to 10Hz) at 2.5V P-P cations enable enhanced system accuracy, making these Low 200mV Dropout Voltage devices ideal for high-precision industrial applications. High 85dB Ripple Rejection The MAX6070 offers a noise filter option for wideband Low 150A Supply Current Reduces Power applications. Consumption The devices are available in a 6-pin SOT23 package and Filter Option Lowers High-Frequency Noise are specified over the extended industrial temperature range of -40C to +125C. The 2.5V options are also Output Options: 1.25V, 1.8V, 2.048V, 2.5V, 3.0V, 3.3V, 4.096V, and 5.0V Cover Common Voltage available in a 6-bump 0.78mm x 1.41mm wafer-level package (WLP). Levels for a Wide Variety of Applications 0.78mm x 1.41mm WLP with 0.35mm Bump Spacing Applications AEC-Q100 Qualified (Refer to Ordering Information) High-Accuracy Industrial and Process Control Precision Instrumentation Ordering Information and Selector Guide appear at end of High-Resolution ADCs and DACs data sheet. Precision Current Sources Automotive Typical Operating Circuits MAX6070 MAX6071 IN IN V V IN IN OUTS OUTS 0.1F 0.1F OUTF V OUTF V OUT OUT BANDGAP BANDGAP FILTER 0.1F 0.1F VOLTAGE VOLTAGE REFERENCE REFERENCE R R 0.1F L L EN EN SHUTDOWN SHUTDOWN CONTROL CONTROL GND GNDS GNDF 19-6355 Rev 18 12/20MAX6070/MAX6071 Low-Noise, High-Precision Series Voltage References Absolute Maximum Ratings OUTF to GNDS, GNDF, GND .................... -0.3V to the lower of Continuous Power Dissipation (T = +70C) A (V + 0.3V), +6V SOT23 (derate 4.3mW/NC above +70C) ............... 347.8mW IN OUTS to GNDS, GNDF, GND .................................-0.3V to +6V WLP (derate 10.2mW/NC above 70C ........................816mW IN to GNDS, GNDF, GND .......................................-0.3V to +6V Operating Temperature Range ......................... -40C to +125C EN to GNDS, GNDF, GND ......................................-0.3V to +6V Junction Temperature ......................................................+150C FILTER to GND .......................................... -0.3V to the lower of Storage Temperature Range ............................ -65C to +150C (V + 0.3V), +6V IN Soldering Temperature (reflow) .......................................+260C GNDS to GNDF ....................................................-0.3V to +0.3V Lead Temperature (soldering, 10s) .................................+300C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 6 SOT23 PACKAGE CODE U6+5/U6+5A Outline Number 21-0058 Land Pattern Number 90-0175 Thermal Resistance, Multi-Layer Board: Junction to Ambient ( ) 230C/W JA Junction to Case ( ) 76C/W JC 6 Thin WLP PACKAGE CODE N60B1+1 Outline Number 21-0744 Land Pattern Number Refer to Application Note 1891 Thermal Resistance, Multi-Layer Board: Junction to Ambient ( ) 98C/W JA For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com