4420P-601-270/500L Bourns

Features Cost-effective R-C construction RoHS compliant version available (L part number suf x) Insulation resistance testing for reliability Molded surface mount or DIP packaging For information on EMI/RFI Filters, download Compatible with automatic assembly Bourns EMI/RFI Filters Application Note. equipment Custom value capability 601 Series - RC Network T-Filters General Description Product Dimensions Continual advances in digital IC technology are creating stringent demands on EMI/RFI 4420P levels in equipment. 7.493 .076 (.295 .003) EMI/RFI low pass lters are required in personal computers, data terminals, test equipment and process controllers for high frequency suppression into or out of electronic equipment432 .056 TYP. Electrical Speci cations - Resistors (.017 .002) 10.34 .25 Standard Resistance Range* ...........................................................10 ohms - 100 ohms (.407 .010) Series Resistance Tolerance ................................................................................. 10 % 12.95 .07 Temperature Coef cient of Resistance ....................................................... 300 ppm/C (.510 .003) Operating Voltage ................................................................................ 25 volts maximum Operating Temperatures ....................................................................... +10 C to +85 C 1.27 .076 TYP. (.050 .003*) *Other Resistance Values Available, 10 ohms - 1 megohm .127 + .127/ - .000 (.005 + .005/ - .000) Electrical Speci cations - Capacitors 2.65 MAX. Standard Capacitance Range ................................................................50 pF to 200 pF (.104) Capacitance Tolerance ........................................................................................... 30 % .305 + .000/ - .076 Temperature Characteristic .......................................................................................Z5U (.012 + .000/ - .003) Operating Temperatures ........................................................................ +10 C to +85 C 8 MAX. Voltage Rating ......................................................................................................25 volts .940 + .355 Dielectric Withstand Voltage ...............................................................2.5 x rated voltage (.037 .014) Insulation Resistance ...........................................................10,000 megohms minimum Environmental Speci cations - Resistors 4118R AND 4120R R MAXIMUM Thermal Shock ..................................................................................................... 0.5 % .635 (.025) Resistance to Solder Heat .................................................................................... 0.5 % PIN 1 REF. Terminal Strength ................................................................................................. 0.5 % 27.05 4.57 + .12/ - .28 (1.065) Mechanical Speci cations MAX89 .25 (.180 + .005/ - .011) 24.51 (.035 .010) MAX. Flammability ..................................................................................Conforms to UL94 V-0 (.965) TYP. Leadframe .................................................................................... Copper, solder coated Body Material............................................................................................ Epoxy/Novolac Lead Solderability .................................Meet requirements of MIL-STD-202 Method 208 8.40 MAX. (.331) 2.03 .12 (.080 .005) 3.43 + .38/ - .25 2.54 .25 (.135 + .015/ - .010) (.100 .010*) For Standard Values Used in Capacitors, Inductors, and Resistors, click here. 1.65 + .12/ - .07 TYP. (.065 + .005/ - .003) NON-ACCUM438 .050 TYP. (.019 .002) 7.87 .25 (.310 .010) 6.71 .10 TO OUTSIDE (.264 .004) WHEN PINS ARE PARALLEL .254 .050 .76 .25 (.030 .010) (.010 .002) 8.64 .50 (.340 .020) Governing dimensions are metric. Dimensions in parentheses are inches and are approximate. *Terminal centerline to centerline measurements made at point of emergence of the lead from the body. *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Speci cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their speci c applications. *RoHS COMPLIANT VERSIONS AVAILABLE 601 Series - RC Network T-Filters Attenuation Vs. Frequency - Typical Capacitor Values With R= 25 Ohms Attenuation vs. Frequency +5dB Model 4120R-601-250/500 Model 4420-601-250/500 0dB 50pF - 3dB 84 MHz 50pF -5dB Attenuation vs. Frequency -10dB 200pF Model 4120R-601-250/201 Model 4420P-601-250/201 -15dB 200pF - 3dB 21 MHz -20dB -25dB -30dB -35dB -40dB DC 100Hz 1kHz 10kHz .1MHz 1MHz 10MHz 100MHz 1GHz indicates - 3dB rolloff frequency (f ) c These low-pass lters are ideal for installation between I/O drivers and RS 232 Typical Circuit connectors. 4120R-601-RC/CC How To Order EMI/RFI Filter Networks 4420R-601-RC/CC 44 20 P - 601 - RC/CC 1 20 Model Terminations (44 = SMD SOIC Pkg) L = RoHS compliant (tin-plated) R R C (41 = Molded DIP) Blank = Tin-lead plated Number of Pins Resistance/Capacitance Code First 2 digits are signi cant Third digit represents the Physical Con guration number of zeros to follow P = Surface Mount Device (SMD) R = Molded DIP Electrical Con guration For tube packaging, use code R T06 Insert RC/CC Code from table below to form part number. Packages Available RCRCCC 250 25 500 50 pF 4420P-601-*RC/CC-SMD 270 27 101 100 pF 4120R-601-*RC/CC-DIP 470 47 181 180 pF 4118R-601-*RC/CC-DIP 10 11 820 82 201 200 pF 101 100 *First two digits are signi cant. Third digit Consult factory for values not listed. represents the number of zeros to follow. Seven circuits in an 18-pin package. Eight circuits in a 20-pin package. REV. 09/14 Speci cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their speci c applications.