CDMSP10-0504M Bourns

Features This series is currently available but RoHS compliant* not recommended for new designs. Protects four I/O lines See Product Obsolescence Memo for possible replacement part no. Ultra-low capacitance ~ 0.55 pF ESD protection >30 kV Surge protection CDMSP10-0504M Surface Mount TVS Diode Array General Information The CDMSP10-0504M device provides ESD, EFT and Surge protection Line 1 NC for high speed data ports meeting IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge) requirements. The Transient Voltage Line 2 NC Suppressor array, protecting up to 4 data lines, offers a Working Peak Reverse Voltage of 5 V and Minimum Breakdown Voltage of 6 V. VDD GND The MSOP-10L packaged device will mount directly onto the industry standard MSOP-10L footprint. Bourns Chip Diodes conform to JEDEC standards, are easy to handle with standard pick and place equipment Line 3 NC and their flat configuration minimizes roll away. Line 4 NC Absolute Maximum Ratings ( T = 25 C Unless Otherwise Noted) A Parameter Symbol Value Unit Operating Supply Voltage V 6 V DC DC Voltage at any I/O Pin V (Gnd - 0.5) to (Vdd + 0.5) V D ESD Performance per IEC 61000-4-2 (I/O Pins) Air Discharge V I/O 19 kV ESD Contact Discharge V I/O 12 kV ESD ESD Performance per IEC 61000-4-2 (VDD, GND Pins) Air Discharge V PW 30 kV ESD Contact Discharge V PW 30 kV ESD Storage Temperature T -55 C to +150 C C STG Operating Temperature T -55 C to +150 C C OPR How To Order Typical Part Marking CD MSP10 - 05 04M CDMSP10-0504M ....................................................................B0504 Common Code CD = Chip Diode Package MSP10 = MSOP-10 Package Schematic Working Peak Reverse Voltage RWM 05=5V (Volts) 3 Number of Lines 04M = 4 Data Lines 1 2 4 5 8 WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specications are subject to change without notice. Users should verify actual device performance in their specic applications. The products described herein and this document are subject to specic legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. *RoHS COMPLIANTApplications High Definition Multimedia Interface (HDMI) Digital Visual Interface (DVI) Ethernet 10/100/1000 Mb/s SATA interface Portable electronics CDMSP10-0504M Surface Mount TVS Diode Array Electrical Characteristics ( T = 25 C Unless Otherwise Noted) A Parameter Symbol Minimum Nominal Maximum Unit 1 Reverse Standoff Voltage V 5V RWM 1 Leakage Current V I 5 A RWM D Channel Leakage Current V I 1 A RWM CD Reverse Breakdown Voltage V V 6 9 V RWM BR 3 Forward Voltage I = 15 mA V 0.8 1 V F F 2 ESD Clamping Voltage V 12.5 V C IEC 61000-4-2 +6 kV, Contact Mode 1 ESD Clamping Voltage V 9.5 V C IEC 61000-4-2 +6 kV, Contact Mode 2 ESD Dynamic Turn-On Resistance - I/O R 0.33 Ohms dyn io 1 ESD Dynamic Turn-On Resistance - V R 0.16 Ohms DD dyn VDD 2 Channel Input Capacitance -1 C 0.55 0.65 pF IN-1 V =5 V, V =2.5 V,f=1 MHz PIN3 IN 2 Channel Input Capacitance -2 V 3=N/C, V =2.5 V, f = 1 MHz C 0.70 0.80 pF PIN IN IN-2 Channel to Channel Input Capacitance - 1 V 3=5 V, V =2.5 V, f = 1 MHz C 0.08 0.09 pF PIN IN CROSS-1 (Between channel pins) Channel to Channel Input Capacitance - 2 VPIN3=N/C, V =2.5 V, f = 1 MHz C 0.10 0.11 pF IN CROSS-2 (Between channel pins) Variation of Channel Input Capacitance - 1 V 3=5 V, V =2.5 V,f=1MHz C 0.04 0.06 pF PIN IN IN-1 (Channel x Pin to GND, Channel y Pin to GND) Variation of Channel Input Capacitance - 2 V 3=N/C, V =2.5 V, f = 1 MHz C 0.05 0.08 pF PIN IN IN-2 (Channel x Pin to GND, Channel y Pin to GND) Notes: 1. Test from V Pin 3 to Gnd Pin 8 dd 2. Test from Pin 1,2,4 or 5 to Gnd Pin 8 3. Test from Gnd Pin 8 to V Pin 3 dd Specications are subject to change without notice. Users should verify actual device performance in their specic applications. The products described herein and this document are subject to specic legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.