Features Applications n ESD protection to IEC 61000-4-2 Level 4 n USB 2.0 / 3.0 n <1 ns response time to ESD strike n IEEE 1394 more than one ESD-strike capability n HDMI 1.4 / 2.0 n Low leakage current n GPS n Extremely low capacitance (0.2 pF typ.) n Antennas n Bidirectional device n High-speed communications buses n RoHS* compliant n Wearables CG0201MLC-05H - ChipGuard ESD Protector General Information The Bourns ChipGuard Model CG0201MLC-05H has been specifically designed to protect sensitive electronics from electrostatic discharge damage. The Model CG0201MLC-05H has been manufactured to provide low 0.2 pF capacitance and 10 nA typical leakage currents with excellent clamp qualities, making the model almost transparent under normal working conditions. The MLC family has been designed to protect equipment to IEC 61000-4-2, Level 4 (8 kV Contact / 15 kV Air Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4/2.0, DVI or IEEE 1394 applications. Electrical Characteristics 25 C (unless otherwise noted) Parameter Symbol CG0201MLC-05H Unit Maximum DC Working Voltage V 5 V DC Typical Leakage Current Max. VDC I 0.01 A L Typical Trigger Voltage (Note 1) V 250 V T Typical Clamping Voltage (Note 1) V 30 V C Typical Capacitance 1 MHz, 1 Vrms C 0.2 pF O ResponseTime R < 1 ns T ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge 8 kV Min. Air Discharge 15 kV Min. ESD Withstand 500 Pulses Operating Temperature T -55 to +125 C OPR Storage Temperature T -55 to +125 C STG Note 1: V and V measured using TLP (Transmission Line Pulse) method. T C How to Order CG 0201 MLC - nn H ChipGuard Product Designator Package 0201 = 0201 Package Technology MLC = Thin Film Polymer Max. DC Working Voltage 05 = 5 V Asia-Pacific: Tel: +886-2 2562-4117 Email: asiacus bourns.com Tape & Reel Packaging H = 15,000 pcs. per 7-inch reel EMEA: Tel: +36 88 520 390 Email: eurocus bourns.com The Americas: Tel: +1-951 781-5500 Email: americus bourns.com www.bourns.com Environmental Characteristics Moisture Sensitivity Level .................... 1 ESD Classification (HBM) .................. 3B *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. *RoHS COMPLIANT VERSIONS AVAILABLE *RoHS COMPLIANT LEAD FREE *RoHS and **AEC-Q200 COMPLIANT LEAD FREE VERSIONS ARE RoHS COMPLIANT* *RoHS COMPLIANT & AEC APPROVED *RoHS COMPLIANT, **HALOGEN FREE & AEC COMPLIANT CG0201MLC-05H - ChipGuard ESD Protector Product Dimensions Recommended Pad Layout A W Dimension CG0201MLC-05H A W 0.63 0.05 L H L (0.025 0.002) C B MM DIMENSIONS: L H 0.3 0.03 (INCHES) W (0.012 0.001) C B B MM DIMENSIONS: (INCHES) Dim. CG0201MLC-05H 0.23 0.05 H B (0.009 0.002) A 0.35 0.05 0.165 0.05 B MM B (0.014 0.002) DIMENSIONS: (0.006 0.002) (INCHES) C This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling is recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um is recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Packaging Information 13.0 1.0 F (.512 .039) E C B 62.0 1.5 A 2.0 0.5 (2.441 .059) (.079 .020) L 13.0 0.5 TOP (.512 .020) TAPE W D Dim. CG0201MLC-05H Dim. CG0201MLC-05H 8.00 0.30 1.50 0.10 21.0 0.8 A F (0.315 0.012) (0.059 0.004) (.827 .031) 178 2.0 (7.008 .079) 3.50 0.05 0.71 0.02 B L (0.138 0.002) (0.028 0.001) 1.75 0.10 0.37 0.02 C W (0.069 0.004) (0.015 0.001) 9.0 0.5 2.00 0.05 0.42 0.03 (.354 .020) MM D T DIMENSIONS: (0.079 0.002) (0.017 0.001) (INCHES) 4.00 0.10 E (0.157 0.004) REV. A 02/18 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.