CG0402MLC-3.3LGA Bourns

Features Applications n RoHS compliant* n HDMI 1.4 n ESD protection >25 kV n Digital Visual Interface (DVI) n Low capacitance <0.5 pF n USB 3.0 / USB OTG n Low leakage current <50 nA n Memory protection n SIM card ports ChipGuard MLC Series - ESD Protectors Device Symbol General Information The ChipGuard MLC Series has been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLC family has been designed to protect equipment to IEC61000-4-2, Level 4 (8 kV Contact / 15 kV Air Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394 applications. V The ChipGuard MLC Series has been manufactured to provide low 0.5 pF capacitance and leakage currents less than 5 nA with excellent clamp qualities, making the family almost transparent under normal working conditions. Electrical Characteristics 25 C (unless otherwise noted) CG0402MLC- Parameter Symbol Unit 3.3LG 05LG 12LG 24LG 3.3LGA 05LGA 12LGA 24LGA Typical Continuous Operating Voltage V 3.3 5 12 24 3.3 5 12 24 V DC Typical Clamping Voltage (Note 1) V 25 V C Maximum Capacitance 1 VRMS 1 MHz C 0.5 pF O Maximum Leakage Current Max. VDC I 5 nA L Typical Trigger Voltage (Note 2) V 250 V T Maximum Response Time R 1 ns T ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge kV 8 Min. Air Discharge kV 15 (Note 3) Min. Air Discharge kV 25 Operating Temperature T -40 to +85 -40 to +125 C OPR Storage Temperature T -55 to +150 C STG CG0603MLC- Parameter Symbol Unit 3.3LE 05LE 12LE 24LE 3.3LEA 05LEA 12LEA 24LEA Typical Continuous Operating Voltage V 3.3 5 12 24 3.3 5 12 24 V DC Typical Clamping Voltage (Note 1) V 25 25 25 V C Maximum Capacitance 1 VRMS 1 MHz C 0.5 pF O Maximum Leakage Current Max. VDC I 5 5 5 nA L Typical Trigger Voltage (Note 2) V 250 250 250 V T Maximum Response Time R 1 ns T ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge kV 8 Min. Air Discharge kV 15 (Note 3) Min. Air Discharge kV 25 Operating Temperature T -40 to +85 -40 to +125 C OPR Storage Temperature T -55 to +150 C STG Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 3. IEC 61000-4-2 ESD Performance will meet minimum 1000 reps without degradation in performance. *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. *RoHS COMPLIANT VERSIONS AVAILABLE *RoHS COMPLIANT LEAD FREE LEAD FREE VERSIONS ARE RoHS COMPLIANT* *RoHS COMPLIANT & AEC APPROVED *RoHS COMPLIANT AEC APPROVED (Select Models)W A L ChipGuard MLC Series - ESD Protectors W Product Dimensions Recommended Pad Layout B C A A D L W A B L MM C B DIMENSIONS: (INCHES) A D CG0402 CG0603 CG0402 CG0603 B C Dimension Series Series Dim. Series Series A B D 1.00 0.15 1.60 0.20 0.51 0.76 L A (0.04 0.006) (0.064 0.008) (0.020) (0.030) 0.50 0.10 0.80 0.20 0.61 1.02 W B (0.02 0.004) (0.032 0.008) (0.024) (0.040) B 0.36 0.05 0.45 0.10 0.51 0.50 A C (0.014 0.002) (0.018 0.004) (0.020) (0.020) 0.25 0.15 0.30 0.20 1.70 2.54 B D (0.10 0.006) (0.012 0.008) (0.067) (0.100) Solder Reflow Recommendations Preheat Stages 1-3 Soldering Cooling 300 A Stage 1 Preheat Ambient to Preheating 30 s to 60 s 250 Temperature B Stage 2 Preheat 140 C to 160 C 60 s to 120 s 200 C Stage 3 Preheat Preheat to 200 C 20 s to 40 s 150 D Main Heating 200 C 60 s to 70 s 210 C 55 s to 65 s 100 220 C 50 s to 60 s 230 C 40 s to 50 s 50 240 C 30 s to 40 s 250 C to 255 C 5 s 0 E Cooling 200 C to 100 C 1 C/s to 4 C/s 110 sec. (min.) 120 sec. (min.) 30-70 sec. Time (seconds) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Temperature (C)