X-On Electronics has gained recognition as a prominent supplier of CG0603MLC-05E ESD Suppressors / TVS Diodes across the USA, India, Europe, Australia, and various other global locations. CG0603MLC-05E ESD Suppressors / TVS Diodes are a product manufactured by Bourns. We provide cost-effective solutions for ESD Suppressors / TVS Diodes, ensuring timely deliveries around the world.

CG0603MLC-05E Bourns

CG0603MLC-05E electronic component of Bourns
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Part No.CG0603MLC-05E
Manufacturer: Bourns
Category: ESD Suppressors / TVS Diodes
Description: ESD Suppressors / TVS Diodes Chip Guard 0603 5 Volts
Datasheet: CG0603MLC-05E Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.3157 ea
Line Total: USD 0.32 
Availability - 60120
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
20370
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 5000
Multiples : 5000
5000 : USD 0.1005
10000 : USD 0.0942
25000 : USD 0.0878
50000 : USD 0.0828
100000 : USD 0.0816
150000 : USD 0.0804
250000 : USD 0.0793

4850
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 5000
Multiples : 5000
5000 : USD 0.1209
10000 : USD 0.1041
25000 : USD 0.0917
50000 : USD 0.0866

19405
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 752
Multiples : 1
752 : USD 0.1414
5000 : USD 0.1206
10000 : USD 0.1109

4749
Ship by Fri. 06 Dec to Wed. 11 Dec
MOQ : 5
Multiples : 5
5 : USD 0.189
50 : USD 0.1504
150 : USD 0.1338
500 : USD 0.1131
2500 : USD 0.104
5000 : USD 0.0984

60120
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 0.3157
10 : USD 0.2057
100 : USD 0.1309
1000 : USD 0.1067
5000 : USD 0.0891
10000 : USD 0.0803
25000 : USD 0.0781
50000 : USD 0.0781
100000 : USD 0.0748

29100
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 5000
Multiples : 5000
5000 : USD 0.1731

19400
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 5000
Multiples : 5000
5000 : USD 0.1358
10000 : USD 0.1274
25000 : USD 0.1187
50000 : USD 0.1121
100000 : USD 0.1104

2764
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 330
Multiples : 1
330 : USD 0.1234
500 : USD 0.1206
1000 : USD 0.1204
2000 : USD 0.1175

4850
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 5000
Multiples : 5000
5000 : USD 0.1209
10000 : USD 0.1041
25000 : USD 0.0917
50000 : USD 0.0866

   
Manufacturer
Product Category
Series
Product Type
Vesd - Voltage ESD Contact
Vesd - Voltage ESD Air Gap
Polarity
Number of Channels
Termination Style
Breakdown Voltage
Working Voltage
Clamping Voltage
Ipp - Peak Pulse Current
Cd - Diode Capacitance
Package / Case
Qualification
Pppm - Peak Pulse Power Dissipation
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the CG0603MLC-05E from our ESD Suppressors / TVS Diodes category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the CG0603MLC-05E and other electronic components in the ESD Suppressors / TVS Diodes category and beyond.

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Model CG0603MLC-05E and Features CG0603MLC-12E are currently n AEC-Q200 compliant available, but not recommended for new designs. Substitute Model n ESD protection to IEC 61000-4-2 Level 4 CGA0603MLC-05E and CGA0603MLC-12E. n <1 ns response time to ESD strike n Low leakage current n Extremely low capacitance (0.2 pF typ.) n Bidirectional device n Multi-strike capability CG0603MLC-05E & -12E - ChipGuard ESD Protectors General Information The Bourns ChipGuard Automotive MLC Series is a sub-1 pF protector designed specifically for use in automotive circuits requiring ESD protection. In addition to its very low capacitance, this protector exhibits extremely fast response times to ESD events, making it ideal for protecting a wide array of high speed digitial electronic applications. V The ChipGuard Automotive MLC Series is fully AEC-Q200 compliant and supported. Electrical Characteristics 25 C (unless otherwise noted) Parameter Symbol CG0603MLC-05E CG0603MLC-12E Unit DC Working Voltage V (DC) 5 12 V W Maximum Leakage Current I <0.01 A L Max. V (DC) W Typical Clamping Voltage (Note 1) V 30 V C Typical Trigger Voltage (Note 1) V 300 V T Typical Peak Voltage (Note 2) V 300 V P Typical Capacitance 1 MHz, 1 Vrms C 0.2 pF O Response Time R <1 ns T ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge kV 8 Min. Air Discharge kV 15 (Note 3) Typical ESD Withstand Pulses 1000 Operating Temperature T -55 to +125 C OPR Storage Temperature T -55 to +125 C STG Notes: 1. V and V measured using TLP (Transmission Line Pulse) method. T C 2. Peak voltage measured under ESD Test Conditions: IEC61000-4-2, 8 kV contact discharge. 3. IEC 61000-4-2 ESD Performance will meet minimum 1000 reps without degradation in performance. Asia-Pacific: Tel: +886-2 2562-4117 Email: asiacus bourns.com EMEA: Tel: +36 88 885 877 Email: eurocus bourns.com The Americas: Tel: +1-951 781-5500 Email: americus bourns.com www.bourns.com WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. *RoHS COMPLIANT VERSIONS AVAILABLE *RoHS COMPLIANT LEAD FREE LEAD FREE VERSIONS ARE RoHS COMPLIANT* *RoHS & AEC COMPLIANT *RoHS COMPLIANT AEC APPROVED (Select Models)Applications n Camera links n Antennas n Sensors n USB 3.0 n Touchscreen interfaces n High-speed communications buses W n GPS L H CG0603MLC-05E & -12E - ChipGuard ESD Protectors W Product Dimensions Recommended Pad Layout B A L H W B A L C B H CG0603MLC CG0603MLC Dim. Series Dim. Series B 0.75 0.1 1.60 0.10 A L A (0.03 0.004) (0.064 0.004) B C 0.75 0.1 0.85 0.15 B W (0.03 0.004) (0.033 0.006) 0.75 0.1 0.51 0.05 C H (0.03 0.004) (0.020 0.002) 0.30 0.20 B C B MM DIMENSIONS: (0.012 0.008) (INCHES) Solder Reflow Recommendations Preheat Stages 1-3 Soldering Cooling 300 A Stage 1 Preheat Ambient to Preheating 30 s to 60 s 250 Temperature 200 B Stage 2 Preheat 140 C to 160 C 60 s to 120 s C Stage 3 Preheat Preheat to 200 C 20 s to 40 s 150 D Main Heating 200 C 60 s to 70 s 100 210 C 55 s to 65 s 220 C 50 s to 60 s 50 230 C 40 s to 50 s 240 C 30 s to 40 s 0 250 C to 255 C 5 s 110 sec. (min.) 120 sec. (min.) 30-70 sec. E Cooling 200 C to 100 C 1 C/s to 4 C/s Time (seconds) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Temperature (C)

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS
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