CGA0603MLC-12E Bourns

Features Applications n AEC-Q200 compliant n Camera links n ESD protection to IEC 61000-4-2 Level 4 n Sensors n <1 ns response time to ESD strike n Touchscreen interfaces n Low leakage current n GPS n Extremely low capacitance (0.2 pF typ.) n Antennas n Bidirectional device n USB 3.0 n Multi-strike capability n High-speed communications buses ChipGuard MLC Series - ESD Protectors General Information Bourns ChipGuard Automotive MLC Series is a sub-1 pF protector designed specifically for use in circuits requiring ESD protection. The CGA-MLC series is available in industry standard 0402 and 0603 packages. In addition to its very low capacitance, these protectors exhibit extremely fast response times to ESD events making them ideal for protecting a wide array of high speed digitial electronic applications. V The ChipGuard MLC Series is fully AEC-Q200 compliant and supported. Electrical Characteristics 25 C (unless otherwise noted) CGA0402MLC- CGA0603MLC- Parameter Symbol Unit 05G 12G 24G 05E 12E 24E DC Working Voltage V (DC) 5 12 24 5 12 24 V W Maximum Leakage Current I <0.01 A L Max. V (DC) W Typical Clamping Voltage (Note 1) V 30 V C Typical Trigger Voltage (Note 1) V 300 V T Typical Peak Voltage (Note 2) V 300 V P Typical Capacitance 1 MHz, 1 Vrms C 0.2 pF O Response Time R <1 ns T ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge kV 8 Min. Air Discharge kV 15 (Note 3) Typical ESD Withstand Pulses 1000 Operating Temperature T -55 to +125 C OPR Storage Temperature T -55 to +125 C STG Notes: 1. V and V measured using TLP (Transmission Line Pulse) method. T C 2. Peak voltage measured under ESD Test Conditions: IEC61000-4-2, 8 kV contact discharge. 3. IEC 61000-4-2 ESD Performance for CGA0603MLC-05E and CGA0603MLC-12E devices will meet minimum 100 reps. Some shifting in characteristics may occur when tested over several hundred ESD pulses. All other part numbers listed will meet IEC 61000-4-2 ESD Performance with minimum 1000 reps without degradation in performance. Asia-Pacific: Tel: +886-2 2562-4117 Email: asiacus bourns.com EMEA: Tel: +36 88 885 877 Email: eurocus bourns.com The Americas: Tel: +1-951 781-5500 Email: americus bourns.com www.bourns.com WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. *RoHS and AEC-Q200 COMPLIANTW L H ChipGuard MLC Series - ESD Protectors W Product Dimensions Recommended Pad Layout B A L H W B A L C B H CGA0402MLC CGA0603MLC CGA0402MLC CGA0603MLC B Dim. Series Series Dim. Series Series A B C 1.00 0.10 1.60 0.10 0.50 0.1 0.75 0.1 L A (0.04 0.004) (0.064 0.004) (0.02 0.004) (0.03 0.004) 0.50 0.10 0.85 0.15 0.50 0.1 0.75 0.1 W B (0.02 0.004) (0.033 0.006) (0.02 0.004) (0.03 0.004) 0.34 0.10 0.51 0.05 0.50 0.1 0.75 0.1 H C (0.014 0.004) (0.020 0.002) (0.02 0.004) (0.03 0.004) B C 0.20 0.15 0.30 0.20 B MM DIMENSIONS: (0.008 0.006) (0.012 0.008) (INCHES) Solder Reflow Recommendations Preheat Stages 1-3 Soldering Cooling 300 A Stage 1 Preheat Ambient to Preheating 30 s to 60 s 250 Temperature 200 B Stage 2 Preheat 140 C to 160 C 60 s to 120 s C Stage 3 Preheat Preheat to 200 C 20 s to 40 s 150 D Main Heating 200 C 60 s to 70 s 100 210 C 55 s to 65 s 220 C 50 s to 60 s 50 230 C 40 s to 50 s 240 C 30 s to 40 s 0 250 C to 255 C 5 s 110 sec. (min.) 120 sec. (min.) 30-70 sec. E Cooling 200 C to 100 C 1 C/s to 4 C/s Time (seconds) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Temperature (C)