4N55, 5962-87679, HCPL-553x, HCPL-653x,
HCPL-257K, HCPL-655x, 5962-90854,
1
HCPL-550x
Hermetically Sealed, Transistor Output Optocouplers
for Analog and Digital Applications
Data Sheet
1. See matrix for available extensions.
Description Features
These units are single, dual, and quad channel, hermetically Dual marked with device part number and DLA Standard
sealed optocouplers. The products are capable of operation Microcircuit Drawing (SMD)
and storage over the full military temperature range and can
Manufactured and tested on a MIL-PRF-38534 Certified
be purchased as either Commercial product or with full
Line
MIL-PRF-38534 Class Level H or K testing or from the
QML-38534, Class H and K
appropriate DLA Standard Microcircuit Drawing (SMD). All
Five hermetically sealed package configurations
devices are manufactured and tested on a MIL-PRF-38534
Performance guaranteed over full military temperature
certified line and Class H and K devices are included in the DLA
range: 55C to +125C
Qualified Manufacturers List QML-38534 for Hybrid
High speed: 400 kb/s typical
Microcircuits.
9 MHz Bandwidth
CAUTION It is advised that normal static precautions be
Open Collector Output
taken in handling and assembly of this
V Ranges from 2V to 18V
CC
component to prevent damage and/or
1500 VDC withstand test voltage
degradation which may be induced by ESD.
High radiation immunity
6N135, 6N136, HCPL-2530/2531 function compatibility
Reliability data
Applications
Military and aerospace
High reliability systems
Vehicle command, control, life critical systems
Line receiver
Switching power supply
Voltage level shifting
Analog signal ground isolation (see Figures 7, 8, and 13)
Isolated input line receiver
Isolated output line driver
Logic ground isolation
Harsh industrial environments
Isolation for test equipment systems
Broadcom
- 1 -4N55, 5962-87679, HCPL-553x, HCPL-653x, HCPL-257K, HCPL-655x, 5962-90854, HCPL-550x Functional Diagram
Data Sheet
Each channel contains a GaAsP light emitting diode that is
Functional Diagram
optically coupled to an integrated photon detector. Separate
connections for the photodiodes and output transistor
V
CC
collectors improve the speed up to one-hundred times that of
a conventional phototransistor optocoupler by reducing the
V
B
base-collector capacitance.
V
O
These devices are suitable for wide-bandwidth analog
applications, as well as for interfacing TTL to LSTTL or CMOS.
Current Transfer Ratio (CTR) is 9% minimum at IF = 16 mA. The
GND
18V VCC capability enables the designer to interface any TTL
family to CMOS. The availability of the base lead allows
optimized gain/bandwidth adjustment in analog applications.
Multiple channel devices available.
The shallow depth of the IC photodiode provides better
radiation immunity than conventional phototransistor
Truth Table (Positive Logic) couplers.
Package styles for these parts are 8- and 16-pin DIP
Input Output
through-hole (case outlines P and E, respectively), 16-pin DIP
flat pack (case outline F), and leadless ceramic chip carrier (case
On (H) L
outline 2). Devices may be purchased with a variety of lead
Off (L) H
bend and plating options, see the selection guide table for
details. Standard Microcircuit Drawing (SMD) parts are
NOTE The connection of a 0.1 F bypass capacitor
available for each package and lead style.
between V and GND is recommended.
CC
Because the same functional die (emitters and detectors) are
used for each channel of each device listed in this data sheet,
absolute maximum ratings, recommended operating
conditions, electrical specifications, and performance
characteristics shown in the figures are identical for all parts.
Occasional exceptions exist due to package variations and
limitations and are as noted. Additionally, the same package
assembly processes and materials are used in all devices. These
similarities give justification for the use of data obtained from
one part to represent other parts performance for die related
reliability and certain limited radiation test results.
Broadcom
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