AFBR-5978Z Broadcom

AFBR-5978Z Digital Diagnostic 650nm Transceiver for Fast Ethernet (10/100 Mbps) with SC-RJ connector Data Sheet Description Features Compatible with electrical and optical performance The AFBR-5978Z transceiver provides the system de- of the POFAC recommendations for the Fast Ethernet signer with the ability to implement Fast Ethernet (100 over Plastic Optical Fiber (POF). Mbps) or Ethernet (10 Mbps) over 50 meter standard bandwidth 0.50.05 NA POF and 100 meter standard Compatible with the Electrical and Optical perfor- bandwidth 0.370.04 NA HCS fiber. The connectivity mance of the ProfiNet recommendations the Fast available for the transceiver is SC-RJ. This product is lead Ethernet over POF and Hard-Clad Silica Fiber (HCS). free and compliant with RoHS. Manufactured in an ISO 9001 certified facility DMI Digital Diagnostics Monitoring Interface, Transmitter SFF-8472 Rev 9.3 , provides real-time monitoring of: The transmitter contains a 650nm LED with an integrat- - Temperature ed driver. The LED driver operates at 3.3 V. It receives a - Supply voltage LVPECL compatible electrical input, and converts it into - Received Optical Power (Alarm/Warning flag) a modulated current driving the LED. The LED is pack- LVPECL Signal Detect Output aged in an optical subassembly, part of the transmitter Temperature range 25 to +85 C section. The optical subassembly couples the output optical power efficiently into POF or HCS fiber. Applications Receiver Factory automation at Fast Ethernet speeds Fast Ethernet networking over POF and HCS The receiver utilizes a Si PIN photodiode. The PIN pho- Link Distance up to 50 m POF or 100 m HCS todiode is packaged in an optical sub-assembly, part of (See application note 5290 for details) the receiver section. This optical subassembly couples the optical power efficiently from POF or HCS fiber to HCS is a trademark of OFS Corporation the receiving PIN. The integrated IC operates at 3.3 V and converts the photocurrent into LVPECL compatible elec- AFBR-5978Z is compatible with the SC-RJ Connecting System from trical output. Reichle & De-Massari AG, Switzerland Package The transceiver package consist of four basic elements two optical subassemblies, an electrical subassembly and the housing as illustrated in the block diagrams in Figure 1. The package outline drawing and pin out are shown in Figures 2 and 3. Patent - www.avagotech.com/patents Block diagram ELECTRICAL SUBASSEMBLY SC-RJ RECEPTACLE DIFFERENTIAL DATA OUT PIN PHOTODIODE SINGLE-ENDED SIGNAL QUANTIZER IC DETECT OUT PREAMP IC OPTICAL SUBASSEMBLIES DMI DIFFERENTIAL LED DATA IN DRIVER IC TOP VIEW Figure 1. Block diagram The optical subassemblies utilize a high volume assem- chanical strength and electrical isolation. The low profile bly process together with low cost lens elements which of the Avago Technologies transceiver design complies result in a cost effective building block. with the maximum height allowed for the duplex SC-RJ connector over the entire length of the package. The electrical subassembly consists of a high volume multilayer printed circuit board on which the IC chips The transceiver is attached to a printed circuit board and various surface mounted passive circuit elements with twelve signal pins and the two solder posts, which are attached. exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand The housing includes internal shields for the electri- the mechanical loads imposed on the transceiver by cal and optical subassemblies to insure low EMI emis- mating with the SC-RJ connectored fiber cables. The sions and high immunity to external EMI fields. The solder posts are isolated from the circuit design of the outer housing including the duplex SC-RJ connector is transceiver and do not require connection to a ground molded of filled non-conductive plastic to provide me - plane on the circuit board Figure 2. Package outline drawing. 2