Data Sheet AFBR-S4N44C013 NUV-HD Single Silicon Photo Multiplier Description Features The Broadcom AFBR-S4N44C013 is a silicon photo High PDE of more than 55% at 420 nm multiplier (SiPM) used for ultra-sensitive precision High fill factors measurement of single photons.The active area is 3.72 Excellent SPTR and CRT 2 3.72 mm . High packing density of the single chip is Excellent uniformity of breakdown voltage, 180 mV achieved using through-silicon-via (TSV) technology. Larger (3 sigma) areas can be covered by tiling multiple AFBR-S4N44C013 Excellent uniformity of gain almost without any edge losses. The passivation layer is With TSV technology (4-side tilable) made by a glass highly transparent down to UV 2 Size 3.88 3.88 mm wavelengths, resulting in a broad response in the visible 2 Cell pitch 30 30 m light spectrum with high sensitivity towards blue- and Highly transparent glass protection layer near-UV region of the light spectrum. The SiPM is best Operating temperature range from 20C to +50C suited for the detection of low-level pulsed light sources, RoHS and REACH compliant especially for detection of Cherenkov- or scintillation light from the most common organic (plastic) and inorganic Applications scintillator materials (for example, LSO, LYSO, BGO, NaI, CsI, BaF, LaBr). This product is lead free and compliant with X-ray and gamma ray detection RoHS and REACH. Gamma ray spectroscopy Safety and security Block Diagram Nuclear medicine Positron emission tomography Figure 1: AFBR-S4N44C013 Block Diagram Life sciences Flow cytometry Fluorescence luminescence measurements Time correlated single photon counting High energy physics Astrophysics Broadcom AFBR-S4N44C013-DS102 May 6, 2019AFBR-S4N44C013 Data Sheet NUV-HD Single Silicon Photo Multiplier Pad Layout and Soldering Ball Geometry Figure 2: Bottom View (Left) and Cross Sections (Right) 0.6 Back Side 0.3 Pin 1 0.49 0.97 0.97 0.97 D-D Sensorsurface D C A A C Glasssurface D NOTES: 1) Dimensions areinmillimeters. 2) Nominal values rounded to two decimal places - Suppression of following zeros. 3) A is anode, C is cathode. Reflow Soldering Diagram Figure 3: Recommended Reflow Soldering Profile 300 C max 245C 250 217C liquidus 200 150 pre-heat soak reflow 100 50 90...120s < 1 K/s 0 0 50 100 150 200 250 300 350 400 s Broadcom AFBR-S4N44C013-DS102 2 3.88 0.49 09. 7 0.97 0.97 0.36