Data Sheet ASMT-Rx45-xxxxx 0.45-mm Leadframe-Based Surface Mount ChipLED Description Features The ultra-thin ASMT-Rx45 ChipLEDs from Broadcom were Industrial 0603 platform 1.6 mm 0.8 mm 0.45 mm developed based on the industrial standard ChipLED 0603 Automotive qualified platform, which requires less board space. These ChipLEDs Super wide 145 viewing angle provide a wide viewing angle of 130 degrees to improve JEDEC MSL 2a. visibility in bright sunlight. Robust operating temperature from 40C to +100C Junction temperature T = 110C J In addition to the high-brightness and compact size, Available in 4000 parts per reel Broadcom s ASMT-Rx45 ChipLEDs provide two significant RoHS and IR reflow compatible advantages in the production environment: They can be easily soldered using the IR solder reflow process, and the Applications package is qualified to a Joint Electronic Device Interior automotive Engineering Council (JEDEC) moisture sensitive level Navigation backlighting (MSL) rating of 2a. For manufacturers, this rating means Audio panel backlighting that these ChipLEDs can be kept in the open air (30C, 60% relative humidity) for up to four weeks after being removed Push button backlighting from its sealed package without the need to remove Office automation, home appliances, and industrial absorbed moisture. equipment Front panel backlighting Broadcom s ultra-thin Leadframe ChipLED is available in Push button backlighting red, orange, yellow green, and amber colors. The LCD backlighting ASMT-Rx45 series is ideal for use by lighting designers Switch backlighting developing backlighting for dashboards and entertainment Navigation backlighting consoles in automobiles, backlighting of industrial switches and buttons, and small pixel indoor signs. CAUTION ASMT-Rx45 LEDs are Class 1C ESD sensitive per JESD22-A114C.01. Observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Broadcom AV02-0378EN April 3, 2019ASMT-Rx45-xxxxx Data Sheet 0.45-mm Leadframe-Based Surface Mount ChipLED Package Dimensions 0.45 Cathode Lead 0.8 Side Frame LED Die Resin NOTE: 1. All dimensions are in millimeters. 2. Tolerance is 0.1 mm unless otherwise specified. Device Selection Guide Min. Iv Typ. Iv Test Current Dice Part Number (mcd) (mcd) (mA) Colors Technology Package Description ASMT-RR45-AQ902 90.0 120.0 20 Red AlInGaP Untinted, Diffused ASMT-RJ45-AQ502 71.5 130.0 20 Orange AlInGaP Untinted, Diffused ASMT-RF45-AN002 28.0 60.0 20 Yellow Green AlInGaP Untinted, Diffused ASMT-RA45-AP932 57.0 90.0 20 Amber AlInGaP Untinted, Diffused ASMT-RH45-AQ502 71.5 110.0 20 Red Orange AlInGaP Untinted, Diffused NOTE: 1. The luminous intensity, lv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the LED package. 2. Tolerance: 15%. Part Numbering System A S M T - R X 45 - X X X X X 1 2 3 4 5 6 Packaging Option Color Bin Selection Max. Intensity Bin Min. Intensity Bin LED Chip Color Broadcom AV02-0378EN 2 0.6 1.6 1.1 0.4