HCPL-2400 / 2411, HCPL-2430 20 MBd High CMR Logic Gate Optocouplers Reliability Data Sheet Description Operating Life Test The reliability data shown includes Avago Technologies For valid system reliability calculations it is necessary to reliability test data from the past two years on this adjust for the time when the system is not in operation. product family. All of these products use the same Note that if you are using MIL-HDBK-217 for predicting LEDs, similar IC, and the same packaging materials, component reliability, the results may not be compara- processes, stress conditions and testing. The data in ble to those given in Table 2 due to different conditions Table 1 and Table 2 reflect actual test data for devices and factors that have been accounted for in MIL-HDBK- on a per channel basis. Before stress, all devices are 217. For example, it is unlikely that your application will preconditioned using a solder reflow process (260C, exercise all available channels at full rated power with 5 sec. 2X) and 20 temperature cycles (-55C to +125C, the LED(s) always ON as Avago Technologies testing 15 minutes dwell, 5 minutes transfer). These data are does. Thus, your application total power and duty cycle taken from testing on Avago Technologies devices must be carefully considered when comparing Table 2 using internal Avago Technologies process, material to predictions using MIL-HDBK-217. specifications, design standards, and statistical process controls. THEY ARE NOT TRANSFERABLE TO OTHER MANUFACTURERS SIMILAR PART TYPES. Table 1. Demonstrated Operating Life Test Performance Demonstrated Demonstrated Stress Test Total Devices TotalDe vice Number of MTTF(hr) FITs Condition Tested Hours Failed Units T = +85C T = +85C A A T = +85C 400 720,000 0 > 720,000 < 1,389 A V = 5.5 V CC I = 10 mA in I = 25 mA out Definition of Failure Application Information Inability to switch, i.e., functional failure, is the defini - The data of Tables 1 and 2 were obtained on devices tion of failure in this data sheet. Specifically, failure oc - with high temperature operating life duration up to curs when the device fails to switch ON with 2 times the 1000 hours. An exponential (random) failure distribu- minimum recommended drive current (but not exceed- tion is assumed, expressed in units of FIT (failures per ing the max. rating) or fails to switch OFF when there is billion device hours) are only defined in the random no input current. failure portion of the reliability curve. Failure Rate Projections The demonstrated point mean time to failure (MTTF) is measured at the absolute maximum stress condition. The failure rate projections in Table 2 use the Arrhenius acceleration relationship, where a 0.43eV activation en- ergy is used as in the hybrid section of MIL-HDBK-217.Table2. Reliability Projections (per channel) for Devices Listed in Title Typical (60%C onfidence) 90% Confidence Ambient Junction MTTF FITs MTTF FITs 9 9 Temperature (C) Temperature (C) (hr/fail) (fail/10 hr) (hr/fail) (fail/10 hr)) 85 100 785,777 1,273 312,692 3,198 70 85 1,375,229 727 547,258 1,827 60 75 2,051,479 487 816,364 1,225 50 65 3,133,550 319 1,246,962 802 40 55 4,911,610 204 1,954,522 512 30 45 7,919,305 126 3,151,402 317 25 40 10,171,613 98 4,047,683 247 Table 3. Mechanical Tests (Testing done on a constructional basis) Test Name MIL-STD-883 TestC onditions Units Tested Units Failed Temperature Cycle 1010 Cond. B -55 to 125C 160 0 Transfer = 5 mins Dwell = 15 mins 1000 cycles Mechanical Shock 2002 Cond. B 2 blows each axis, 139 0 1500 G, 0.5 ms pulse Mechanical 2007 Cond. A 20 G, 20 - 2000 Hz 139 0 Vibration 4 mins/cycle, 4 times/axis Terminal Strength 2004 2 lb tension 150 0 8 oz lead bend stress Solderability 2003 Sn60 Pb40 Solder 397 0 Temp. = 260C (5 sec, 2X) Physical Dimension 2009 Dev. profile 10X 220 0 Table 4.B asic Material Properties MaterialP roperty Test Result Mold Compound Flammability Classification UL 94V-0 Mold Compound Oxygen Index 32% Mold Compound Glass Transition Temperature Tg = 160C Mold Compound Hydrolizable Chlorine < 30 ppm For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5988-4129EN AV01-0497EN - October 9, 2006