HCPL-520x, HCPL-523x, HCPL-623x, HCPL-625x, 5962-88768 and 5962-88769 Hermetically Sealed Low IF, Wide VCC, Logic Gate Optocouplers Data Sheet Description Features Dual Marked with Device Part Number and DLA These units are single, dual and quad channel, hermeti- Standard Microcircuit Drawing cally sealed optocouplers. The products are capable of operation and storage over the full military temperature Manufactured and Tested on a MIL-PRF-38534 Certi- range and can be purchased as either standard product fi ed Line or with full MIL-PRF-38534 Class Level H or K testing or QML-38534, Class H and K from the appropriate DLA Drawing. All devices are man- Four Hermetically Sealed Package Confi gurations ufactured and tested on a MIL-PRF-38534 certifi ed line Performance Guaranteed over -55C to +125C and are included in the DLA Qualifi ed Manufacturers List QML-38534 for Hybrid Microcircuits. Wide V Range (4.5 to 20 V) CC 350 ns Maximum Propagation Delay Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain CMR: > 10,000 V/s Typical photon detector. The detector has a threshold with hys- 1500 Vdc Withstand Test Voltage teresis which provides diff erential mode noise immunity Three State Output Available and eliminates the potential for output signal chatter. High Radiation Immunity The detector in the single channel units has a tri-state output stage which allows for direct connection to data HCPL-2200/31 Function Compatibility buses. The output is noninverting. The detector IC has Reliability Data Available an internal shield that provides a guaranteed common Compatible with LSTTL, TTL, and CMOS Logic mode transient immunity of up to 10,000 V/s. Improved power supply rejection eliminates the need for special Applications power supply bypass precautions. Military and Space High Reliability Systems Transportation and Life Critical Systems High Speed Line Receiver Isolated Bus Driver (Single Channel) Pulse Transformer Replacement Ground Loop Elimination Harsh Industrial Environments Computer-Peripheral Interfaces Note: A 0.1 F bypass capacitor must be connected between V and GND pins. CC CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.Functional Diagram Truth Tables Multiple Channel Devices Available (Positive Logic) Multichannel Devices V CC V O Input Output On (H) H V E Off (L) L GND Package styles for these parts are 8 pin DIP through hole Single Channel Devices (case outline P), 16 pin DIP fl at pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices Input Enable Output may be purchased with a variety of lead bend and plat- On (H) H Z ing options, see Selection Guide Table for details. Stan- dard Microcircuit Drawing (SMD) parts are available for Off (L) H Z each package and lead style. On (H) L H Because the same electrical die (emitters and detectors) Off (L) L L are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommend- ed operating conditions, electrical specifi cations, and performance characteristics shown in the fi gures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justifi cation for the use of data obtained from one part to represent other parts performance for die related reli- ability and certain limited radiation test results. Functional Diagrams 8 Pin DIP 8 Pin DIP 16 Pin Flat Pack 20 Pad LCCC Through Hole Through Hole Unformed Leads Surface Mount 1 Channel 2 Channels 4 Channels 2 Channels 15 V V 8 V 8 1 1 16 CC2 1 CC CC 19 V 13 V V 15 O2 2 CC V O1 O 2 7 2 7 20 12 3 V 14 O1 GND 2 V O2 13 4 V O2 3 6 3 6 V CC1 V E 2 10 V O1 V 12 5 O3 3 4 5 4 5 V GND 6 O4 11 GND GND 1 7 GND 10 7 8 9 8 Note: Multichannel DIP and fl at pack devices have common V and ground. Single channel DIP has an enable pin 6. LCCC (leadless ceramic chip CC carrier) package has isolated channels with separate V and ground connections. CC 2