ACPL-785E, HCPL-7850, HCPL-7851, 1 5962-97557 Hermetically Sealed Analog Isolation Amplifier Data Sheet Description Features The HCPL-7850, HCPL-7851, and ACPL-785E are isolation Performance guaranteed over full military temperature amplifiers that provide accurate, electrically isolated and range: 55C to +125C amplified representations of voltage and current. When used Manufactured and tested on a MIL-PRF-38534 certified line with a shunt resistor to monitor the motor phase current in a Hermetically sealed packages high-speed motor drive, the device offers superior reliability Dual marked with device part number and DLA Standard compared with the traditional solutions such as current Microcircuit Drawing (SMD) transformers and Hall-effect sensors. These devices consist of a QML-38534, Class H and Class E sigma-delta analog-to-digital converter optically coupled to a HCPL-7840 function compatibility digital-to-analog converter in a hermetically sealed package. The products are capable of operation and storage over the full High common-mode rejection (CMR): 8 kV/s at VCM = military temperature range and can be purchased as a 1000V commercial product (HCPL-7850), with full MIL-PRF-38534 5% gain tolerance Class H testing (HCPL-7851), with MIL-PRF-38534 Class E testing 0.1% nonlinearity (ACPL-785E) (Class K with exceptions) or from the DLA Standard Low offset voltage and offset temperature coefficient Microcircuit Drawing (SMD) 5962-97557. Details of the Class E 100 kHz bandwidth program exceptions are listed here: 1. Nondestructive Bond Pull, Test method 2023 of Applications MIL-STD-883 in screening is not required. 2. Particle Impact Noise Detection (PIND), Test method 2020 Industrial, military, and space systems of MIL-STD-883 in device screening and group C testing is High reliability systems not required. Harsh industrial environments 3. Die Shear Strength, Test method 2019 of MIL-STD-883 in Transportation, medical, and life critical systems group B testing is not required. General-purpose analog signal isolation 4. Internal Water Vapor Content, Test method 1018 of MIL-STD-883 in group C is not required. 5. Scanning Electron Microscope (SEM) inspection, Test method 2018 of MIL-STD-883 in element evaluation is not required. CAUTION It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or 1. See Selection Guide Lead Configuration Options for available degradation which may be induced by ESD. extensions. Broadcom - 1 -ACPL-785E, HCPL-7850, HCPL-7851, 5962-97557 Schematic Diagram Data Sheet Superior performance in design-critical specifications, such as Schematic Diagram common-mode rejection, offset voltage, nonlinearity, and operating temperature, makes the HCPL-7850, HCPL-7851 and I I DD1 DD2 ACPL-785E excellent choices for designing reliable products V 1 8 DD1 V DD2 such as motor controllers and inverters. V 2 + 7 IN+ V OUT+ + With common-mode rejection of 8 kV/s, these devices are V 3 IN 6 V suitable for noisy electrical environments such as those OUT generated by the high switching rates of power IGBTs. 4 5 GND1 GND2 SHIELD Low offset voltage together with a low offset voltage temperature coefficient permits accurate use of auto-calibration techniques. NOTE A 0.1-F bypass capacitor must be connected between pins 1 and 4 and between pins 5 and Gain tolerance of 5% with 0.1% nonlinearity further provide 8. the performance necessary for accurate feedback and control. Selection Guide Lead Configuration Options Part Number and Options Commercial HCPL-7850 MIL-PRF-38534, Class H HCPL-7851 MIL-PRF-38534, Class E ACPL-785E a a Standard Lead Finish Gold Plate Gold Plate b Option 200 Option -200 Solder Dipped a Option 100 Option -100 Butt Cut/Gold Plate b Option 300 Option -300 Gull Wing/Soldered SMD Part Number Prescript for all below 5962- 5962- a 9755701HPC 9755701EPC Gold Plate b 9755701HPA 9755701EPA Solder Dipped a 9755701HYC 9755701EYC Butt Cut/Gold Plate b 9755701HYA 9755701EYA Butt Cut/Soldered b 9755701HXA 9755701EXA Gull Wing/Soldered a. Gold Plate lead finish: Maximum gold thickness of leads is <100 micro inches. Typical is 60 to 90 micro inches. b. Solder lead finish: Sn63/Pb37. Device Marking 1 A QYYWWZ Avago DESIGNATOR COMPLIANCE INDICATOR, Avago P/N XXXXXXXX DATE CODE, SUFFIX (IF NEEDED) 1 DLA SMD XXXXXXXXX 1 DLA SMD COUNTRY OF MFR. XXX XXX 1 PIN ONE/ Avago CAGE CODE 50434 ESD IDENT 1 QML PARTS ONLY Broadcom - 2 -