HFBR-1119TZ Transmitter HFBR-2119TZ Receiver Fiber Optic Transmitter and Receiver Data Links for 266 MBd Data Sheet Description Features The HFBR-1119TZ/-2119TZ series of data links are high- Full compliance with the optical performance require- performance, cost-effi cient, transmitter and receiver ments of the fi bre channel physical layer modules for serial optical data communication applica- Other versions available for: tions specifi ed at 266 MBd for Fibre Channel applications FDDI or for general-purpose fi ber optic data link transmission. ATM These modules are designed for 50 or 62.5 m core multi- Compact 16-pin DIP package with plastic ST* connector mode optical fi ber and operate at a nominal wavelength of Wave solder and aqueous wash process compatible 1300 nm. They incorporate our high-performance, reliable, package long-wavelength, optical devices and proven circuit tech- nology to give long life and consistent performance. Manufactured in an ISO 9001 certifi ed facility Transmitter Applications The transmitter utilizes a 1300 nm surface-emitting Fibre channel interfaces InGaAsP LED, packaged in an optical subassembly. The LED Multimode fi ber optic links up to 266 MBd at 1500 m is DC-coupled to a custom IC which converts diff erential- General purpose, point-to-point data communications input, PECL logic signals, ECL-referenced (shifted) to a +5 V power supply, into an analog LED drive current. Replaces DLT/R1040-ST2 model transmitters and receivers Receiver The receiver utilizes an InGaAs PIN photodiode coupled to a custom silicon transimpedance preamplifi er IC. The PIN-preamplifi er combination is AC-coupled to a custom quantizer IC which provides the fi nal pulse shaping for the logic output and the Signal Detect function. Both the Data and Signal Detect Outputs are diff erential. Also, both Data and Signal Detect Outputs are PECL compatible, ECL-refer- enced (shifted) to a +5 V power supply. Package The overall package concept for the Data Links consists of the following basic elements: two optical subassemblies, two electrical subassemblies, and the outer housings as illustrated in Figure 1. * ST is a registered trademark of AT&T Lightguide Cable Connectors.The package outline drawing and pinout are shown in Figures 2 and 3. The details of this package outline and pinout are compatible with other data-link modules from other vendors. The optical subassemblies consist of a transmitter subassembly in which the LED resides and a receiver subassembly housing the PIN-preamplifi er combination. The electrical subassemblies consist of a multi-layer printed circuit board on which the IC chips and various surface- mounted, passive circuit elements are attached. RECEIVER PIN PHOTODIODE DIFFERENTIAL DATA IN QUANTIZER IC DIFFERENTIAL SIGNAL DETECT OUT PREAMP IC ELECTRICAL OPTICAL SIMPLEX ST SUBASSEMBLIES SUBASSEMBLIES RECEPTACLE TRANSMITTER DIFFERENTIAL DATA IN DRIVER IC V BB LED TOP VIEW Figure 1. Transmitter and receiver block diagram. THREADS 3/8 32 UNEF-2A HFBR-111X/211XT DATE CODE (YYWW) SINGAPORE 12.19 8.31 MAX. 41 MAX. 5.05 0.9 7.01 9.8 MAX. 3 5.0 2.45 19.72 NOTES: 12 17.78 (7 x 2.54) 1. MATERIAL ALLOY 194 1/2H 0.38 THK FINISH MATTE TIN PLATE 7.6 m MIN. 2. MATERIAL PHOSPHOR BRONZE WITH 120 MICROINCHES TIN LEAD (90/10) 8 x 7.62 OVER 50 MICROINCHES NICKEL. 3. UNITS = mm HOUSING PINS 0.38 x 0.5 mm NOTE 1 PCB PINS DIA. 0.46 mm NOTE 2 Figure 2. Package outline drawing. 2