Data Sheet HFBR-5963LZ/ALZ Multimode Small Form Factor Transceivers for ATM, FDDI, Fast Ethernet, and SONET OC-3/SDH STM-1 with LC Connector Description Features The HFBR-5963xxZ transceiver provides the system RoHS compliant designer with a product to implement a range of solutions for Multisourced 2 x 5 package style multimode fiber Fast Ethernet and SONET OC-3 (SDH Operates with 62.5/125 mm and 50/125 mm multimode STM-1) physical layers for ATM and other services. fiber Single +3.3V power supply This transceiver is supplied in the industry-standard 2 x 5 Wave solder and aqueous wash process compatibility DIP style with an LC fiber connector interface with an Manufactured in an ISO 9001 certified facility external connector shield. Full compliance with ATM Forum Applications UNI SONET OC-3 multimode fiber physical layer specification SONET/SDH equipment interconnect, OC-3/SDH Full compliance with the optical performance STM-1 rate requirements of the FDDI PMD standard Fast Ethernet Full compliance with the optical performance Multimode fiber ATM backbone links requirements of 100Base-FX version of IEEE802.3u +3.3V TTL signal detect output Temperature range: HFBR-5963LZ: 0 C to +70 C HFBR-5963ALZ: 40 C to +85 C Broadcom AV02-1088EN December 14, 2018Multimode Small Form Factor Transceivers for ATM, FDDI, Fast Ethernet, and SONET HFBR-5963LZ/ALZ Data Sheet OC-3/SDH STM-1 with LC Connector Transmitter Section Package The overall package concept for the Broadcom transceiver The transmitter section of the HFBR-5963xxZ utilizes a consists of three basic elements: the two optical 1300 nm InGaAsP LED. This LED is packaged in the optical subassemblies, an electrical subassembly, and the housing subassembly portion of the transmitter section. It is driven as illustrated in the block diagram in Figure 1. by a custom silicon IC, which converts differential PECL logic signals, ECL referenced (shifted) to a +3.3V supply, The package outline drawing and pinout are shown in into an analog LED drive current. Figure 2 and Figure . The details of this package outline and pinout are compliant with the multisource definition of the 2 x 5 DIP. The low profile of the Broadcom transceiver design Receiver Section complies with the maximum height allowed for the LC connector over the entire length of the package. The receiver section of the HFBR-5963xxZ utilizes an The optical subassemblies utilize a high-volume assembly InGaAs PIN photodiode coupled to a custom silicon process together with low-cost lens elements that result in a transimpedance preamplifier IC. It is packaged in the optical cost-effective building block. subassembly portion of the receiver. The electrical subassembly consists of a high volume This PIN/preamplifier combination is coupled to a custom multilayer printed circuit board on which the ICs and various quantizer IC that provides the final pulse shaping for the surface-mounted passive circuit elements are attached. logic output and the signal detect function. The data output The receiver section includes an internal shield for the is differential. The data output is PECL compatible, ECL electrical and optical subassemblies to ensure high immunity referenced (shifted) to a +3.3V power supply. The receiver to external EMI fields. outputs, data output and data out bar, are squelched at signal detect deassert. The signal detect output is single The outer housing including the LC ports is molded of filled ended. The signal detect circuit works by sensing the level nonconductive plastic to provide mechanical strength. The solder posts of the Broadcom design are isolated from the of the received signal and comparing this level to a internal circuit of the transceiver. reference. The SD output is +3.3V TTL. The transceiver is attached to a printed circuit board with the ten signal pins and the two solder posts that exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with the LC connector fiber cables. Figure 1: Block Diagram R SUPPLY X DATA OUT QUANTIZER IC PIN PHOTODIODE DATA OUT PRE-AMPLIFIER SUBASSEMBLY SIGNAL R GROUND X LC DETECT RECEPTACLE T GROUND X LED DATA IN OPTICAL LED DRIVER IC SUBASSEMBLY DATA IN T SUPPLY X Broadcom AV02-1088EN 2