HSMF-C16x Miniature Bi-Color Surface Mount ChipLEDs Data Sheet Description Features Small size This series of bi-color ChipLEDs is designed with the small- est footprint to achieve high density of components on 0603 industry standard footprint board. They have the industry standard footprint of 1.6 Diffused optics mm x 0.8 mm and a height of only 0.5 mm. This makes Operating temperature range of 40 C to +85 C them very suitable for cellular phone and mobile equip- ment backlighting and indication. They are available in Compatible with reflow soldering a wide range of color combinations. In order to facilitate Available in various color combination automated pick and place operation, these ChipLEDs are Available in 8 mm tape on 7 (178 mm) diameter shipped in tape and reel, with 4000 units per reel. These reels parts are compatible with reflow soldering. Applications Keypad backlighting Symbol indicator LCD backlighting Pushbutton backlighting Front panel indicator Device Selection Guide Part Number Color Package Description HSMF-C162 AlInGaP Red / AlInGaP Amber Untinted, Diffused HSMF-C163 AlInGaP Red / InGaN Green Untinted, Diffused HSMF-C164 AlInGaP Red / InGaN Blue Untinted, Diffused HSMF-C165 High Efficiency Red / GaP Green Untinted, Diffused HSMF-C166 GaP Yellow / GaP Green Untinted, Diffused HSMF-C167 GaP Orange / GaP Green Untinted, Diffused HSMF-C168 InGaN Green / InGaN Blue Untinted, Diffused HSMF-C169 AlInGaP Amber / InGaN Blue Untinted, Diffused CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate pre- cautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.Package Dimensions CATHODE LINE LED DIES 1 3 0.8 (0.031) 2 4 1.6 (0.063) DIFFUSED EPOXY 0.5 (0.020) PC BOARD 0.16 (0.006) 0.4 CATHODE LINE (0.016) 0.3 (0.012) SOLDERING TERMINALS POLARITY HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169 1 3 AMBER GREEN BLUE GREEN GREEN GREEN BLUE BLUE YELLOW 2 4 RED RED RED RED ORANGE GREEN AMBER NoTES: 1. All DIMENSIoNS IN MIllIMETERS (INCHES). 2. TolERANCE IS 0.1 MM ( 0.004 IN.) UNlESS oTHERwISE SPECIFIED. Absolute Maximum Ratings for Each Die at T = 25 C A Parameter AlInGaP InGaN GaP Units 1 DC Forward Current 20 10 20 mA Power Dissipation 48 38 52 mW Reverse Voltage 5 5 5 V LED Junction Temperature 95 95 95 C Operating Temperature Range 40 to +85 C Storage Temperature Range 40 to +85 C Soldering Temperature See reflow soldering profile (Figure 6 & 7) Note: 1. Derate linearly as shown in Figure 4. 2