HSMQ-C170-T0000 Broadcom

HSMQ-C170-T0000 Top View InGaN Green ChipLED Data Sheet Description Features The HSMQ-C170-T0000 ChipLED is a surface-mount LED that LED with InGaN die comes in an industrial standard 2.0 mm 1.25 mm footprint. It Surface-mount device with 0805 footprint offers industry-leading performance by using efficient and Compatible with reflow soldering high brightness InGaN material. Its small form-factor allows Tape in 8-mm carrier tape on a 7 inch diameter reel flexible board or custom design, and the LED can be closely mounted, thus offering a cost-effective solution. Applications This LED has a wide viewing angle. Coupled with high performance and a small package size, these features make this Backlighting device an ideal candidate for applications that require uniform Indicator light distribution, high brightness, and less board space. This device is ideal for use in applications, such as industrial equipment, consumer electronics, gaming, home appliances, and black and white goods markets. CAUTION: LEDs are Class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Broadcom - 1 -HSMQ-C170-T0000 Data Sheet Package Dimensions NOTE 1. All dimensions are in millimeters (in.). 2. Tolerance 0.1 mm (0.004 in.) unless otherwise specified. Device Selection Guide Part Number Dimension L W H (mm) Color Die Technology Parts per Reel Package Description HSMQ-C170-T0000 2.0 1.25 0.80 Green InGaN 4000 Untinted, Diffused Broadcom - 2 -