SMTboard-3U - surface mount prototype PCB Prototyping circuit board for 0805, 1206, SOIC, SOT and other SMT parts. Features Standard single height (3U) Eurocard/VME size. SMT rectangle pads are spaced for 0805 and Twelve SOT23 footprints. SOT223 and 1206 components. additional SOT23 parts can fit on the SMT SMTboard has three SOIC-32 footprints rectangle pads. each routed to 32 pads. SMT rectangle pads have 0.1 spacing to Solid ground plane on back side for low allow DIP ICs and headers to be attached. noise in RF and high speed logic circuits. Through hole prototyping area for headers, Every second SMT rectangle pad has an power connections, and DIP ICs. unplated hole for easy connection to the The BusBoard zig-zag circuit pattern on the ground plane on the back side. Just insert a through hole area allows easy access to both wire and solder. A plated hole option is sides of headers and DIP ICs. available. Two power rails. Four mounting holes. Board Layout (component side) SOIC-32 footprints SOT-23 footprints SMT pads are spaced Through-hole area for routed to 32 pads. routed to four pads. for 0805 and 1206 SMT DIP ICs and headers. components. Every second SMT pad has Two power rails. Four mounting an unplated hole for easy SMT pads have 0.1 spacing. holes. connection to the ground plane. DIP ICs can be soldered to pads. Just insert a wire and solder. BusBoard Prototype Systems - Built for designers www.BusBoard.com sales busboard.com BPS-MAR-(SMT3U)-001 Rev 4.00 SMTboard-3U Data Sheet, Continued Specifications Etched FR4 glass-epoxy circuit board. 2 1oz/ft copper, with an anti-tarnish coating for for easy soldering. Lead free. SMTboard-3U 3.9 wide, 6.3 long, 1/16 thick (100 x 160 x 1.6mm). SMTboard-3U-PTH 3.9 wide, 6.3 long, 1/16 thick (100 x 160 x 1.6mm), plated holes. SMTboard-3U-THIN 3.9 wide, 6.3 long, 1/32 thick (100 x 160 x 0.8mm). Holes are drilled on 0.1 (2.54mm) centers in through hole area. All holes are unplated. 0.037 (0.94mm) holes for ICs or square post headers in through hole area. 0.031 (0.79mm) holes for connections to ground plane in SMT area. Order Part SMT3U (1/16 thick, unplated holes) or SMT3UT (thin version, 1/32 thick, unplated holes) or SMT3-PTH (plated holes version, 1/16 thick) Board Layout (ground plane side) Solid ground plane for Zig-zag pattern allows easy access high-speed logic and RF circuits. to both sodes of DIP ICs and headers. Two power rails. BusBoard Prototype Systems - Built for designers www.BusBoard.com sales busboard.com BPS-MAR-(SMT3U)-001 Rev 4.00