CCIC BGA heat sinks - Aluminium BGA and compact crosscut heat sinking for a variety of applications requiring simple extension of surface area for cooling. - Typically used with DSP, FPGAs, and other electronics packages. - Double sided adhesive provides simple and effective attachment Technical specifications: Width Height Thermal Thermal & resistance resistance Length (sink to (sink to ambient) K ambient) / W at 0.3 K / W at Part Number m/s 1.0 m/s 45 10 7.93 3.57 CCI02 28 9 9.51 5.29 CCI08 30 9 9.96 5.87 CCI09 38 6 9.12 4.65 CCI10 25 10 9.6 5.3 00C845401A 40 5 9.38 5.14 CCI11 CCI Heat Pipes - Copper heat pipes, pure water filled for operation between +5 degC and 110 degC. - Various wick structures offered, Screen mesh, Grooved, Sintered and composite (G+S) - Low thermal resistance for transportation of heat from hot source to exchanger. Heat pipe can be incorporate into a block and fix a finned structure (or heat sink) to allow effective heat removal. - Thermal resistance of pipe taken at 70degC working temperature (adiabatic), under horizontal orientation, evaporator section 15mm, and condensation section 60mm Structure Length Original Thickness Thermal Operating Diameter resistance of Max pipe Rpipe Power in (W) Part Number (K / W) Sintered 100 5 5 0.02 0.04 40 00C93390101 Sintered 150 6 6 0.02 0.03 65 00C93400101 SM 150 4 2 0.65 0.90 15 00C93410101 SM 200 6 2 0.35 0.60 30 00C93420101 Groove 100 5 2.5 0.03 0.06 30 00C93430101 Groove 150 6 6 0.02 0.03 65 00C93440101 Groove 150 8 2.5 0.003 0.05 15 00C93450101 G+S 200 6 3.0 0.003 0.008 40 00C93460101 G+S 150 8 4.5 0.003 0.015 70 00C93470101 G+S 300 8 8 0.002 0.007 65 00C93480101