KTS500C106M55N0T00 Chemi-Con

MULTILAYER CERAMIC CHIP CAPACITORS Upgrade Surface Mount Device FEATURES 1. Large capacitance by small size. 2. Excellent noise absorption. 3. High permissible ripple current capability. 4. Pb-free design. 5. Tin plate terminations. APPLICATIONS 1. Smoothing circuit of DC-DC converters. 2. On-board power supplies. 3. Voltage regulators for computers. 3. Noise suppressor for various kinds of equipments. 4. High reliability equipments. CONSTRUCTION Ceramic Dielectric Termination (Tin Plating) Internal Electrode RATINGS 1. Category Temperature Range -55 to +125C 2. Rated Voltage Range 25, 50, 100, 250Vdc 3. Rated Capacitance Range 0.033 to 33MF 4. Rated Capacitance Tolerance K (P10%) , M (P20%) 5. Temperature Characteristics X5R, X7R 6. Rated Ripple Current See No.5 on the following table SPECIFICATIONS No. Items Specification Test Condition 1 Withstand Voltage No abnormality. 250% of rated voltage shall be applied for 5 seconds. 2 Insulation Resistance 100/CR(MO) or 4000(MO) Rated voltage shall be applied for 60P5 seconds at whichever is less. temperature 25P2C. 3 Rated Capacitance Within specified tolerance. CR 10MFCR>10MF Temperature 25P2C Frequency 1P0.1kHz 120P12Hz 4 Dissipation Factor 5.0% maximum. Voltage 1P0.2Vrms 0.5P0.2Vrms 10kHzK1MHz (sine curve) 5 Rated Ripple Current Size code 31 32 43 55 Ripple voltage Vp shall be less than Arms 0.3 0.5 1.0 2.0 the rated voltage. (1/3) CAT. No. E1002IMULTILAYER CERAMIC CHIP CAPACITORS Upgrade SPECIFICATIONS No. Items Specification Test Condition 6 Adhesion No visible damage. Substrate 5N (0.51kgf) for 10P1 seconds Capacitor 7 Bend strength of the face plating Appearance : No visible damage. The substrate shall be bend by 1mm at a rate of 1mm/s DC/C : P15% for 5 seconds. Press ber Press Capacitor Substrate 1.0mm 45P2mm 45P2mm Support 8 Solderability Min. 75% of surface of the termination Solder Temperature : 235P5C shall be covered with new solder Dipping Time : 2P0.5 sec. Solder : Eutectic solder containning Ag2.5 to 3wt% 9 Resistance to Soldering Heat Appearance : No visible damage. Solder Temperature : 260P5C DC/C : P15% Dipping Time : 2P0.5 seconds D.F. : To meet the initial specification. Solder : Eutectic solder containning I.R. : To meet the initial specification. Ag2.5 to 3wt% Withstand voltage : No abnormality. 10 Temperature Cycle Appearance : No visible damage. Step Temperature (C) (min.) DC/C : P15% 1 Min. Category temperature P3 30P3 D.F. : To meet the initial specification. 2 Room temperature 3 max. I.R. : To meet the initial specification. 3 Max. Category temperature P2 30P3 Withstand voltage : No abnormality. 4 Room temperature 3 max. For 5 cycles for above temperature cycle. 11 Humidity Load Life Appearance : No abnormality. Temperature : 40P2C DC/C : P15% Humidity : 90 to 95%RH D.F. : 10% maximum Voltage : Rated voltage 24 I.R. : 25/CR(MO) or 1000(MO) Time : 500P hours 0 whichever is less. Withstand voltage : No abnormality. 12 Endurance Appearance : No abnormality. Temperature : 85P2C DC/C : P15% Voltage : 200% of rated voltage. 48 D.F. : 10% maximum Time : 1000P hours 0 I.R. : 50/CR(MO) or 1000(MO) Temperature : 125P3C whichever is less. Voltage : Rated voltage Withstand voltage : No abnormality. 48 Time : 1000P hours 0 *CR : Rated Capacitance(MF) (2/3) CAT. No. E1002I