60-2-10 Chemtronics

CHEMTRONICS TDS SWNoClean Technical Data Sheet Soder-Wick No Clean Desoldering Braid PRODUCT DESCRIPTION TYPICAL PRODUCT DATA AND PHYSICAL PROPERTIES Soder-Wick No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Surface Insulation Resistance Soder-Wick No Clean uses pure, oxygen Bellcore TR-NWT-000078 : PASS free copper braid and a patented flux 4 After 96 Hours (megohms) 2 x 10 Limit technology to make an efficient and effective desoldering braid. Soder-Wick Group A Group B Group C 6 6 6 4.8 x 10 3.8 x 10 4.1 x 10 No Clean SD is available on ESD safe : PASS bobbins for protection against damage due ANSI/IPC J SF-818 8 After 168 Hours (ohms) 1.8 x 10 Limit to static electricity. 1-2 2-3 3-4 4-5 Requires little or no post solder cleaning No corrosive residues 10 10 10 10 2.3 x 10 2.6 x 10 2.8 x 10 2.8 x 10 Halide free Electromigration : PASS ESD Safe bobbins meet specs: Average Insulation Resistance MIL-STD-1686C (megohms)-One Decade Limit MIL-HDBK-263B Initial Final 3 4 Static decay provision of Group E 3.93 x 10 1.24 x 10 3 4 Group F 3.87 x 10 2.84 x 10 MIL-B-81705C At 10x magnification no evidence of Minimal risk of heat and static electromigration or heavy corrosion. component damage Silver Chromate Test Paper PASS TYPICAL APPLICATIONS Soder-Wick No Clean safely removes Copper Mirror Test PASS solder from: Lugs and Posts Shelflife 2 years Micro Circuits Surface Mount Device Pads SODER-WICK NO CLEAN MEETS OR Ball Grid Array Pads EXCEEDS: MIL-F-14256F, Type R DOD-STD-883E, Method 2022 Bellcore TR-NWT-000078 ANSI/IPC J SF-818 AVAILABILITY Part Size Inches Color Size Metric 1 .030 White .76mm Part Size Length Part Size Length 2 .060 Yellow 1.52mm 60-1-5 1 5 60-1-10 1 10 3 .080 Green 2.03mm 60-2-5 2 5 60-2-10 2 10 60-3-5 3 5 60-3-10 3 10 4 .110 Blue 2.79mm 60-4-5 4 5 60-4-10 4 10 5 .145 Brown 3.68mm 60-5-5 5 5 60-5-10 5 10 6 .210 Red 5.33mm 60-6-5 6 5 BGA - Purple - Part Size VacuPak Packaging USAGE INSTRUCTIONS The VacuPak Can contains SW16015 1 For industrial use only. ten five-foot bobbins in a SW16025 2 Read MSDS carefully prior to use. vacuum sealed can. This SW16035 3 1) Choose a Soder-Wick No Clean width equal to package provides the highest SW16045 4 or slightly larger than the pad or connection. level of cleanliness and SW16055 5 2) Choose a solder iron tip equal to or slightly freshness. Great for tool kit SW160BGA BGA larger than the pad or connection. storage. 3) Set temperature of iron between 600-750F. 4) Place wick on solder joint and place tip of hot NOTE: iron on top of wick. This information is believed to be accurate. It is 5) As solder becomes molten, the color of the wick intended for professional end users having the skills will change from copper to silver. to evaluate and use the data properly. Chemtronics 6) Remove wick and iron from joint does not guarantee the accuracy of the data and simultaneously once color change has stopped. assumes no liability in connection with damages 7) The component lead / pad is now clean and free incurred while using it. from solder. 8) Clip and discard used portion of the wick. CHEMTRONICS TECHNICAL & APPLICATION 8125 COBB CENTER DRIVE ASSISTANCE KENNESAW, GA 30152 Chemtronics provides a technical hotline to 1-770-424-4888 REV. F (08/13) answer your technical and application related questions. The toll free number is: DISTRIBUTED BY: 1-800-TECH-401. Chemtronics, Soder-Wick and CircuitWorks are registered trademarks of Chemtronics. All rights reserved. VacuPak is a trademark of Chemtronics. All rights reserved.