Chem-Wik Desoldering Braid Chem-Wik Desoldering Braid Desoldering Applications As the standard desoldering braid for service and repair, Chem-Wik Desoldering Braid ensures fast and safe desoldering. The ultra-pure, oxygen free copper braid quickly and completely removes solder from circuit boards and components. Its fast wicking action protects components from harmful heat damage. PermaPak Barrier Packaging ensures ultimate braid freshness and speed by sealing out harmful effects of the environment and protecting against oxidation. Chem-Wik Desoldering Braid: Meets or exceeds the greatest range of perfomance standards: MIL-F-14256F Type R NASA STD-8739.3 Soldered Electrical Connections ANSI/IPC J STD-004, Type ROL0 Wire Wrap Pins Lugs/Posts Components Static Dissipative Packaging: Desolder pins for easy removal. Removes solder buildup. Eliminates Wicks solder completely, Easily removes solder from potential intermittent problems. eliminating solder splash or components with straight or DOD Standard 1686C and MIL-HDBK-263B drip. Leaves terminal fluxed clinched leads. Minimum Mil-Std-2000A and ready for resoldering. heat required. No damage Mil-B-81705C Static Decay Rate Provision to board or components. Cleaning Applications Chem-Wik Rosin SD Chem-Wik Rosin The fast, safe rosin flux desoldering braid The fast, safe rosin flux desoldering braid for packaged in static dissipative bobbins removing solder from leads and components Reduces the risk of damage associated with Coated with ultra high purity rosin static electricity Quickly and thoroughly removes solder Coated with noncorrosive ultra high purity Type Noncorrosive Type R rosin flux PermaPak Barrier Packaging R rosin flux contains 25 bobbins per package Quickly and thoroughly removes solder Chem-Wik Product Selection Guide SMT Pads BGA Pads Solder Bridges Clean Script Quickly and safely desolders Safely removes solder from Completely removes solder Selectively retouches etched 5 25 50 100 500 PRODUCT COLOR SIZE 1.5m 7.5m 15.0m 30.5m 152.5m APPLICATION entire rows of SMT pads. BGA pads and chips in three bridges. Eliminates potential script. Improves aesthetic Applications-specific sizes to four passes. Completely shorts. No damage to appearance. Eliminates Chem-Wik Rosin Gray .030 /0.8mm 2-25L 2-50L 2-100L 2-500L Micro-Circuits desolder individual fine-pitch removes all residual solder boards or circuitry. secondary identification. Yellow .050 /1.3mm 5-25L 5-50L 5-100L 5-500L Small Pads SMT pads. and facilitates chip Easy to use. repositioning. Green .075 /1.9mm 7-25L 7-50L 7-100L 7-500L Medium Pads Blue .100 /2.5mm 10-25L 10-50L 10-100L 10-500L Large Pads The Leader in Braid Sizes Chem-Wik Rosin SD Gray .030 /0.8mm 2-5L Micro-Circuits Yellow .050 /1.3mm 5-5L Small Pads BGA Purple DDeessoollddeerriinngg TTeecchhnnoollooggyy Green .075 /1.9mm 7-5L Medium Pads Blue .100 /2.5mm 10-5L Large Pads .030/0.8mm White Distributed by: .060/1.5mm Yellow .080/2.0mm Green Blobs Finger Connectors ITW Chemtronics Eliminates and removes Cleans finger connectors blobs as well as shorts and and surface mount pads110/2.8mm Blue 8125 Cobb Center Drive icicles. Leaves circuitry Kennesaw, GA 30152-4386 smooth. Cleans potential 770-424-4888 1-800-645-5244 .145/3.7mm Brown problem areas. Fax: 770-423-0748 1-800-243-6003 www.chemtronics.com .210/5.3mm Red Soder-Wick , Chem-Wik and Chemtronics are registered trademarks of ITW Chemtronics . VacuPak ,Performance Pak and PermaPak are trademarks of ITW Chemtronics . 2005 ITW Chemtronics all rights reserved SW CAT 0010.02 Rev. 5026 5M Soder-Wick Product Selection Guide 5 10 25 100 500 PRODUCT SIZE COLOR 1.5m 3.0m 7.5m 30.5m 152.5m VACUPAK APPLICATION Soder-Wick Worlds Leading Brand of Desoldering Braid Soder-Wick 2 .060 /1.5mm Yellow 40-2-5 40-2-10 SW14025 Small Pads, SMDs Lead-Free SD Soder-Wick , the world s leading brand of Soder-Wick Desoldering Braid meets or exceeds 3 .080 /2.0mm Green 40-3-5 40-3-10 SW14035 Medium Pads desoldering braid, is the fastest, cleanest and the greatest range of qualitative and performance 4 .110 /2.8mm Blue 40-4-5 40-4-10 SW14045 Large Pads safest braid in the industry. standards: Soder-Wick BGA Purple 80-BGA-5 SW180BGA BGA Pads and Chips It significantly reduces rework/repair time and minimizes BGA Rosin MIL-F-14256 F type R flux the risk of heat damage to the board. Its geometrically Soder-Wick BGA Purple 60-BGA-5 SW160BGA BGA Pads and Chips NASA-STD-8739.3 Soldered Electrical Connections BGA No Clean precise weave design allows for maximum capillary action DOD-STD-883E, Method 2022 Soder-Wick Rosin 1 .030 /0.8mm White 50-1-25 SMD, Micro-Circuits and solder capacity. Soder-Wick Desoldering Braid ANSI/IPC J STD-004, Type ROL0 optimizes heat transfer through the braid and into the 2 .060 /1.5mm Yellow 50-2-25 50-2-100 50-2-500 Small Pads, SMDs solder joint, resulting in faster wicking action than any other 3 .080 /2.0mm Green 50-3-25 50-3-100 50-3-500 Medium Pads Static Dissipative Packaging: competitive brand. Minimal flux residue on the board 4 .110 /2.8mm Blue 50-4-25 50-4-100 50-4-500 Large Pads Qualifies under MIL-STD-1686C and MIL-HDBK-263B speeds up the cleaning process, or eliminates it entirely. 5 .145 /3.7mm Brown 50-5-25 Terminals as a non-ESD generator 6 .210 /5.3mm Red 50-6-25 Large Lugs Meets the Static Decay Rate Provision of MIL-B-81705C Soder-Wick Desoldering Braid is available in the Soder-Wick 1 .030 /0.8mm White 80-1-5 80-1-10 SW18015 SMD, Micro-Circuits and MIL-STD-2000A most comprehensive variety of widths, lengths and Rosin SD flux types. 2 .060 /1.5mm Yellow 80-2-5 80-2-10 SW18025 Small Pads, SMDs Soder-Wick No Clean SD: Application-specific sizes allow for precision solder removal 3 .080 /2.0mm Green 80-3-5 80-3-10 SW18035 Medium Pads in a flash. Sealed in Performance Pak Barrier Packaging Meets MIL-STD-883B, Bellcore TR-NWT-000078, 4 .110 /2.8mm Blue 80-4-5 80-4-10 SW18045 Large Pads Soder-Wick Lead-Free SD Soder-Wick Rosin Soder-Wick Unfluxed and VacuPak Vacuum Sealed Packaging, Soder-Wick ANSI/IPC J SF-818 The fastest, safest desoldering braid The fastest, safest rosin flux desoldering braid The unfluxed desoldering braid which can be 5 .145 /3.7mm Brown 80-5-5 80-5-10 SW18055 Terminals Desoldering Braid is completely protected from the harmful Meets parameters tested by the Singapore Institute of formulated specifically for use with lead-free for removing solder from printed circuit boards coated with any flux type 6 .210 /5.3mm Red 80-6-5 Large Lugs effects of the environment. The VacuPak vacuum-sealed applications Standards and Industrial Research (SISIR) for Soder-Wick 1 .030 /0.8mm White 60-1-5 60-1-10 SW16015 SMD, Micro-Circuits Noncorrosive ultra high purity Type R rosin flux Can be coated with any flux type can guarantees the braid to be as fast and fresh as the day Solderability No Clean SD Engineered specifically for high temperature, Minimizes the risk of heat damage to the board Allows for a constant flux type throughout the it was made. The can serves as a protective storage ANSI/IPC J STD-004, Type ROL0 2 .060 /1.5mm Yellow 60-2-5 60-2-10 SW16025 Small Pads, SMDs lead-free solders Will not leave ionic contamination on the boards production process container once the pack has been opened and is also easily Transfers heat to the solder joint more quickly and Provides quick and safe desoldering 3 .080 /2.0mm Green 60-3-5 60-3-10 SW16035 Medium Pads stacked on the shelf. Its superior packaging provides efficiently than conventional desoldering braids 4 .110 /2.8mm Blue 60-4-5 60-4-10 SW16045 Large Pads Specifically designed for all lead-free solders predictable quality and performance, time and time again. All 5 and 10 bobbins are offered on static dissipative Soder-Wick Rosin SD 5 .145 /3.7mm Brown 60-5-5 60-5-10 SW16055 Terminals Can also be used with Tin/Lead solders bobbins, and only Soder-Wick static dissipative bobbins The fastest, safest rosin flux desoldering braid Soder-Wick Unfluxed SD Packaged in ESD-safe static dissipative bobbins 6 .210 /5.3mm Red 60-6-5 Large Lugs packaged in static dissipative bobbins The unfluxed desoldering braid packaged in are labeled by heat stamping. This eliminates paper Minimizes the risk of damage associated with Soder-Wick 2 .060 /1.5mm Yellow 70-2-25 Small Pads, SMDs static dissipative bobbins labels that increase the risk of ESD damage. Competitive static electricity Unfluxed Soder-Wick Rosin packaged in ESD-safe static Noncorrosive ultra high purity no-clean flux desoldering braid does not offer this increased level dissipative bobbins Soder-Wick Unfluxed packaged in ESD-safe 3 .080 /2.0mm Green 70-3-25 Medium Pads Will not leave ionic contamination on the boards of protection. Minimizes the risk of damage associated with static dissipative bobbins Soder-Wick 2 .060 /1.5mm Yellow 75-2-10 Small Pads, SMDs Especially effective at removing residual solder static electricity Minimizes the risk of damage associated with Unfluxed SD from SMT pads Noncorrosive ultra high purity Type R rosin flux static electricity RoHS compliant 3 .080 /2.0mm Green 75-3-10 Medium Pads Minimizes the risk of heat damage to the board Can be coated with any flux type Will not leave ionic contamination on the boards Allows for a constant flux type throughout the 4 .110 /2.8mm Blue 75-4-10 Large Pads production process Soder-Wick BGA Provides quick and safe desoldering All 5 and 10 Soder-Wick Desoldering Braid is offered on static dissipative bobbins. Performance Pak Barrier Packaging contains 25 bobbins per package. The most effective, economical way to safely Soder-Wick No Clean SD and completely remove solder from BGA pads The fastest, cleanest no-clean flux desoldering VacuPak Vacuum Sealed Packaging and chips braid packaged in static dissipative bobbins Guarantees Soder-Wick Desoldering Braid to be as fast Sized and designed specifically for BGA pad and Soder-Wick No Clean packaged in ESD-safe and fresh as the day it was made. The VacuPak can chip rework/repair static dissipative bobbins contains 10 bobbins with 5 feet of braid on each bobbin. Entire BGA pads cleaned in three to four passes Minimizes the risk of damage associated with Available in rosin and no-clean fluxes static electricity Packaged in ESD-safe static dissipative bobbins Patented noncorrosive, halide free, organic no-clean flux Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner Meets Bellcore TR-NWT-000078 and ANSI IPC Fastest, Cleanest and Safest Braid in the Industry SF-818 for Surface Insulation Resistance www.chemtronics.com Pb