CHEMTRONICS TDS SWick Technical Data Sheet Soder-Wick Desoldering Braid TYPICAL PRODUCT DATA AND PRODUCT DESCRIPTION PHYSICAL PROPERTIES Soder-Wick offers the state of the art in Flux Types: Rosin Grade WW, Type R desoldering technology. Soder-Wick is Patented No Clean designed for todays heat sensitive High Temperature No Clean electronic components using lighter mass, Specifications: ANSI/IPC J STD-004 pure copper braid construction that allows MIL-F-14256 F for better thermal conductivity, even at low No Clean Flux Spec: MIL-STD-883B temperatures. Soder-Wick responds faster Bellcore TR-NWT-000078 than conventional desoldering braids ANSI/IPC J SF818 thereby minimizing overheating and preventing PCB damage. A full range of Shelflife: 2 years sizes and flux types are available, including Rosin, No Clean, unfluxed and a high Width Width temperature Lead-Free version. Whatever Size Inches Color Metric the requirement, Soder-Wick has the 1 .030 White 0.8mm answer. 2 .060 Yellow 1.5mm Requires little or no post solder cleaning 3 .080 Green 2.0mm No corrosive residues 4 .110 Blue 2.8mm Optimized construction for faster wicking and heat transfer 5 .145 Brown 3.7mm Halide free 6 .210 Red 5.3mm Minimizes the risk of heat damage to BGA - Purple - components and circuit boards TYPICAL APPLICATIONS STATIC DISSIPATIVE PACKAGING Soder-Wick desoldering braid safely Soder-Wick SD is packaged on Static removes solder from: Dissipative bobbins in 5 and 10-foot lengths Thru-hole Components to minimize the risk of damage associated SMT Pads and BGA Pads with static electricity. The static dissipative Micro Circuits bobbins qualify as electrostatic discharge Terminals protective per MIL-STD-1686C and MIL- Lugs and Posts HDBK-263B, and meet the static delay rate Identification Script provision of MIL-B-81705C. USAGE INSTRUCTIONS AVAILABILITY Series: For industrial use only. 40 Soder-Wick Lead-Free, SD Bobbin Read MSDS carefully prior to use. 50 Soder-Wick Rosin 1) Choose a Soder-Wick desoldering braid width 80 Soder-Wick Rosin, SD Bobbin equal to or slightly larger than the pad or 60 Soder-Wick No Clean, SD Bobbin connection. 70 Soder-Wick Unfluxed 2) Choose a solder iron tip equal to or slightly 75 Soder-Wick Unfluxed, SD Bobbin larger than the pad or connection. 3) Set temperature of iron between 600-750F VacuPak Packaging 4) Place wick on solder joint and place tip of hot The VacuPak Can contains ten five-foot bobbins iron on top of wick in a vacuum sealed can. This package provides 5) As solder becomes molten, the color of the wick the highest level of cleanliness and freshness. will change from copper to silver. Great for tool kit storage. 6) Remove wick and iron from solder joint simultaneously once color change has stopped. HELPFUL HINTS: 7) The component lead / pad is now clean and free Water Soluble Users: Use Soder-Wick from solder. Unfluxed 70 or 75 Series to dip in water soluble 8) Clip and discard the used portion of the wick. flux and then desolder normally. 9) If needed, clean PCB with CircuitWorks Flux Ball Grid Array: Use Soder-Wick BGA with a Remover Pen and remove soils with a large tipped iron to remove solder from a number of ControlWipes absorbent wipe. BGA pads all at once. SODER-WICK IS DESIGNED TO MEET NOTE: This information is believed to be accurate. It OR EXCEED THE FOLLOWING: is intended for professional end users having the skills to MIL-F-14256F, Type R evaluate and use the data properly. CHEMTRONICS NASA-STD-8739.3 does not guarantee the accuracy of the data and assumes DOD-STD-883E, Method 2022 no liability in connection with damages incurred while ANSI/IPC J STD-004, Type ROL0 using it. BELLCORE TR-NWT-000078 ANSI/IPC J SF-818 Chemtronics, Soder-Wick and CircuitWorks are registered trademarks of Chemtronics. All rights reserved. VacuPak and ControlWipes are trademarks of SODER-WICK SD BOBBINS ARE Chemtronics. All rights reserved. DESIGNED TO MEET OR EXCEED: MIL-STD-2000A Chemtronics MIL-B-81705C 8125 Cobb Center Drive MIL-STD-1686C Kennesaw, GA 30152 MIL-HDBK-263B 1-770-424-4888 REV. F (08/13) TECHNICAL & APPLICATION DISTRIBUTED BY: ASSISTANCE Chemtronics provides a technical hotline to answer your technical and application related questions. The toll free number is: 1-800-TECH-401.