SBB830 Chip Quik

SBB830 SBB830 Datasheet revision 1.4 www.Proto-Advantage.com 830 pts solder-in breadboard (Exact Solderless Match) Top View Bottom View Product Highlights Immersion Gold Finish All holes are gold plated and are on a 0.1 grid 1/16 (1.6mm) thick FR-4 UL94V-0 Accepts a variety of wire sizes (20-32 AWG) 4 mounting holes Usage This board exactly copies the routing of an 830 pts full size solderless breadboard. Allows direct transfer of circuits prototyped in a solderless breadboard to a solder-in breadboard to facilitate functional in- system testing or field testing. Specifications Wiring Pattern: 2 Distribution Strips 1 Terminal Strip 200 Distribution Holes 630 Terminal Holes Dimensions: 6.6 x 2.3 x 0.0625 (167.64mm x 58.42mm x 1.6mm) PCB construction: FR-4 UL94V-0 PCB operating temperature range: -40C to +130C (-40F to +266F) PCB reflow maximum temperature: +260C (500F) PCB trace width: 0.059 (1.5mm) 2 PCB trace thickness: 1 oz copper / ft (1.4 mils) (0.03556 mm) PCB trace current capacity*: 10A continuous 40C rise, 13A continuous 80C rise* Hole size: 1.0mm (40 mils) diameter Recommended pin size: 25 mil square wire wrap posts or smaller Diameter of 4 corner mounting holes: 3.2mm (125 mils) * Derived from IPC-2221 current capacity graphs at 25C ambient temperature. Actual current capacity will vary based on air flow, component density, and other factors. 1 2007-2018 Proto Advantage Top View of SBB830 Topside silkscreen lines between holes show where bottom traces electrically connect holes. (Representative drawing only - not to scale) 2 2007-2018 Proto Advantage