TC3-3.5G Chip Quik

TC3-3.5G TC3-3.5G Datasheet revision 1.0 www.chipquik.com Heat Sink Compound - Grey Ultra Max Conductive 3.5g Syringe 3cc Product Highlights Lead-Free / RoHS 3 Compliant / REACH Compliant Ultra Max High-Density Thermal Paste. Grey, non-curing, flowable, thermally conductive heat sink compound. Heavily filled with heat-conductive metal oxide. Provides extremely high thermal conductivity, low bleed and high temperature stability. 13 Electrically insulating (4 x 10 ohm-cm) Specifications Viscosity: 87,000 cP (87,000 mPas) Density: 2.5g/cc Thermal Conductivity: 8.5 W/mK 2 Thermal Resistance: 0.03 C*cm /W 13 Electrical Volume Resistivity: 4 x 10 ohm-cm Operating Temperature (Continuous): -40 to 150C (-40 to 302F) Operating Temperature (Peak): 200C (392F) Size: 3.5g Syringe (3cc) Storage and Handling Store refrigerated or at room temperature 3-25C (37-77F). Allow 4 hours for thermal paste to reach an application temperature of 20-25C (68-77F) before use. Shelf Life >24 months Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this products stated shelf life. 1 1994-2021 Chip Quik Inc. Chip Quik Thermal Paste Orderable Part Numbers Thermal Thermal Density Orderable Part Conductivity Resistance Color Package Size (g) (g/cc) Number (W/mK) (C*cm 2/W) 0.67 0.16 2.1 White Syringe 10 TC1-10G 0.67 0.16 2.1 White Syringe 20 TC1-20G 0.67 0.16 2.1 White Jar 200 TC1-200G 4.3 0.06 2.5 Grey Syringe 10 TC2-10G 4.3 0.06 2.5 Grey Syringe 20 TC2-20G 4.3 0.06 2.5 Grey Jar 50 TC2-50G 8.5 0.03 2.5 Grey Syringe 1 TC3-1G 8.5 0.03 2.5 Grey Syringe 3.5 TC3-3.5G 8.5 0.03 2.5 Grey Syringe 10 TC3-10G 2 1994-2021 Chip Quik Inc.