X-On Electronics has gained recognition as a prominent supplier of conga-BAF/CSP-B Heat Sinks across the USA, India, Europe, Australia, and various other global locations. conga-BAF/CSP-B Heat Sinks are a product manufactured by Congatec. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

conga-BAF/CSP-B Congatec

conga-BAF/CSP-B electronic component of Congatec
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Part No.conga-BAF/CSP-B
Manufacturer: Congatec
Category: Heat Sinks
Description: Heat Sinks PASSIVE COOLING SOL conga-BAF 2.7mm
Datasheet: conga-BAF/CSP-B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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1 : USD 51.597
10 : USD 51.597
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RoHS - XON
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We are delighted to provide the conga-BAF/CSP-B from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the conga-BAF/CSP-B and other electronic components in the Heat Sinks category and beyond.

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HIGH GRAPHICS PERFORMANCE WITH LOW POWER CONSUMPTION conga-BAF - Based on AMD Embedded G-Series Processors - Best price/performance ratio - High performance graphics Formfactor COM Express Basic (95 x 125 mm) Type II Connector Layout CPU AMD G-T56N 1.6 GHz Dual Core cache 512 kB x2 18W AMD G-T40N 1.0 GHz Dual Core cache 512 kB x2 9W AMD G-T44R 1.2 GHz Single Core cache 512 kB 9W AMD G-T40R 1.0 GHz Single Core L2 cache 512 kB 5.5W AMD G-T40E 1.0 GHz Dual Core L2 cache 512 kB x2 6.4W AMD Embedded G-Series Processors DRAM Single channel up to two 4 GB DDR3 SO-DIMM memory (up to 1066 MHz) Chipset AMD A55E Controller Hub Ethernet Gigabit Ethernet Realtek RTL8111E I/O Interfaces 6x PCI ExpressTM x1 lanes 4x Serial ATA 1x EIDE (up to UDMA 6) 8x USB 2.0 PCI Bus (Rev. 2.3 compliant 33 MHz) 2x Express Card Sound High Definition Audio Interface Graphics Integrated High Performance Video DirectX 11 graphics with UVD 3.0 Integrated VGA DAC Dual Simultaneous Display Support no PEG support LVDS 2x24 Bit 800x600 to 1920X1200 60Hz VESA standard or JEDIA data mapping Automatic Panel Detection via EDID/EPI DisplayPort 2x DisplayPort 1.1a shared with HDMI ports second port multiplexed with LVDS resolutions up to 2560x1600 - 18W APU 1920x1200 - 9W APU HDMI or DVI 2x HDMI 1.3 Ports shared with DisplayPort second port multiplexed with LVDS resolutions up to 1920x1080 / 1920x1200 for DVI mode CRT 400 MHz RAMDAC resolutions up to 2560x1600 - 18W APU 1920x1200 9W APU congatec Board Controller Multi Stage Watchdog non-volatile User Data Storage Manufacturing and Board Information Board Statistics BIOS Setup Data Backup IC bus (fast mode 400 kHz multi-master) Power Loss Controll Embedded BIOS Features AMI-Aptio UEFI BIOS with congatec Embedded BIOS features Security The conga-BAF can be optionally equipped with a discrete Trusted Platform Module (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e-commerce will benefit also with improved authentication integrity and confidence levels. Power Management ACPI 3.0 with battery support Operating Systems Microsoft Windows8 Microsoft Windows7 Microsoft Windows XP Microsoft Windows embedded Standard Microsoft Windows CE 6.0 Microsoft Windows Embedded Compact 7 Linux Power Consumption Typ. application: tbd. see manual for full details CMOS Battery Backup Temperature Operating: 0 .. +60C Storage: -20 .. +80C Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Size 95 x 125 mm (3.74 x 4.92) www.congatec.comconga-BAF Block diagram A-B PCIe Lanes 0,1,2,3 4 x1 or 1 x4 PCIe GBE RTL8111E Analogix TPM ANX3110 OR RTC PCIe x1 AMD APU Lanes 4, 5 congatec AMD G-T56N AMD Board Controller or AMD G-T48N STM32F100R8 BC SPI A55E FCH or AMD G-T40N or AMD G-T52R UMI x4 HWM or AMD G-T44R Memory Bus (800-1066MHz) SPI DDR3-SODIMM SATA to PATA JMD330 Flash Socket (top) DDR3-SODIMM Socket (bottom) C-D conga-BAF Order Information Article PN Description conga-BAF/T56N 041001 AMD G-Series Dual Core Processor T56N 1.6GHz 1MB L2 cache and 1333MT/s DDR3 SODIMM memory interface for up to 8GB conga-BAF/T40N 041003 AMD G-Series Dual Core Processor T40N 1.0GHz 1MB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 8GB conga-BAF/T44R 041005 AMD G-Series Single Core Processor T44R 1.2GHz 512kB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 8GB conga-BAF/T40R 041006 AMD G-Series Single Core Processor T40R 1.0GHz 5.5W 1MB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 8GB conga-BAF/T40E 041007 AMD G-Series Dual Core Processor T40E 1.0GHz 6.5W 1MB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 8GB conga-BAF/HSP-B 041020 Standard passive cooling solution for module conga-BAF. All standoffs are with 2.7mm bore hole conga-BAF/HSP-T 041021 Standard heatspreader for COM Express Basic module conga-BAF. All standoffs are M2.5mm thread conga-BAF/CSP-B 041025 Standard passive cooling solution for module conga-BAF. All standoffs are with 2.7mm bore hole conga-BAF/CSP-T 041026 Standard passive cooling solution for module conga-BAF. All standoffs are M2.5mm thread conga-BAF/CSA-B 041027 Standard active cooling solution for module conga-BAF. Integrated 12V fan. All standoffs are with 2.7mm bore hole conga-BAF/CSA-T 041028 Standard active cooling solution for module conga-BAF. Integrated 12V fan. All standoffs are M2.5mm thread DDR3-SODIMM-1066 (1GB) 068750 DDR3 SODIMM memory module with 1066MT/s and 1GB RAM DDR3L-SODIMM-1600 (2GB) 068755 DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 2GB RAM DDR3L-SODIMM-1600 (4GB) 068756 DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM Accessories conga-CEVAL 065749 Evaluation Carrier Board for COM Express Type 2 modules conga-Cdebug 047854 COM-Express debugging platform. Including cable for COM PS/2 and VGA. conga-LDVI/EPI 011115 LVDS to DVI converter board for digital flat panels with onboard EEPROM conga-HDMI/Display Port adapter 4k 500030 The conga-DP/HDMI adapter 4k is used for evlauation of the DP/HDMI graphics interface of x86 Qseven and COM Express modules in combination with the congatec evaluation carrier boards conga-QEVAL and conga-TEVAL. It supports full 4k display resolution. conga-FPA2 047250 Flatpanel prototype adapter to develop your own flatpanel adapter Including cables set. COM-Express-carrierboard-Socket-5 400007 Connector for COM-Express carrier boards height 5mm packing unit 4 pieces COM-Express-carrierboard-Socket-8 400004 Connector for COM-Express carrier boards height 8mm packing unit 4 pieces 2016 congatec AG. All rights reserved. All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. July 03, 2018 WME www.congatec.com Watchdog I2C Fan Control GPIs/GPOs SM Bus PATA SATA 4 HDA 4x SATA SPI 8x USB 2.0 PCIe x1 PCI Bus LPC Bus DP C or HDMI C (Only available if no LVDS option) DP B or HDMI B LVDS CRT

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