X-On Electronics has gained recognition as a prominent supplier of conga-BS57/i3-330E Computer-On-Modules - COM across the USA, India, Europe, Australia, and various other global locations. conga-BS57/i3-330E Computer-On-Modules - COM are a product manufactured by Congatec. We provide cost-effective solutions for Computer-On-Modules - COM, ensuring timely deliveries around the world.
We are delighted to provide the conga-BS57/i3-330E from our Computer-On-Modules - COM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the conga-BS57/i3-330E and other electronic components in the Computer-On-Modules - COM category and beyond.
MAXIMUM COMPUTING PERFORMANCE conga-BS57 - Power-Efficient Processors - up to Intel Core i7 Processor 2.0 GHZ - Intel Clear Video HD Technology Formfactor COM Express Basic (95 x 125 mm) Type II Connector Layout CPU Intel Core i7-620LE 2.0 GHz 32 nm process 4MB cache 1066 MHz TDP 25 W BGA package Intel Core i7-620UE 1.06 GHz 32 nm process 4MB cache 800 MHz TDP 18 W BGA package Intel Core i3-330E 2.13 GHz 32 nm process 3MB cache 1066 MHz TDP 35 W BGA package Intel Celeron U3405 1.07 GHz 32 nm process 2MB cache 1066 MHz TDP 18 W BGA package Integrated dual channel memory controller up to 17.1 GByte/sec. memory bandwidth Integrated Intel HD Graphics with dynamic frequency up to 667 MHz Intel Clear Video HD Technology DRAM 2 Sockets SO-DIMM DDR3 1333 MHz up to 8 GByte Chipset Intel 5 Series Chipset: Intel HM55 Ethernet Intel 82577LM Ethernet PHY I/O Interfaces 5x PCI Express lanes 3x Serial ATA (AHCI) no RAID support 1x EIDE (UDMA-66/100) optional 2x ExpressCard 8x USB 2.0 (EHCI) PCI bus 33 MHz Rev. 2.3 LPC bus IC bus (fast mode 400 kHz multi-master) Sound Digital High Definition Audio Interface with support for multiple audio codecs Graphics Processor integrated Mobile Intel 5 Series HD graphics OpenGL 2.1 and DirectX10 support Two independent pipelines for full dual view support High performance hardware MPEG-2 decoding WMV9 (VC-1) and H.264 (AVC) support Blu-ray support 40 MBit/s hardware motion compensation no PEG support LVDS Dual channel LVDS transmitter Supports flat panels 2x24 Bit interface VESA mappings resolutions up to 1920x1200 Automatic Panel Detection (eDP optional) via EDID/EPI DisplayPort 3x DisplayPorts 1.1 shared with HDMI HDMI 3x ports shared with DisplayPorts CRT Interface 350 MHz RAMDAC resolutions up to QXGA (2048x1536) AUX Output Supports one SDVO port shared with HDMI and DisplayPort capable of driving a 200MP pixel rate congatec Board Controller Multi Stage Watchdog non-volatile User Data Storage Manufacturing and Board Information Board Statistics BIOS Setup Data Backup IC bus (fast mode 400 kHz multi-master) Power Loss Control Embedded BIOS Features AMI Aptio UEFI 2.x firmware 4 MByte serial SPI firmware flash Security The conga-BS57 can be optionally equipped with a discrete Trusted Platform Module (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e-commerce will benefit also with improved authentication integrity and confidence levels. Power Management ACPI 3.0 with battery support Operating Systems Microsoft Windows 8 Microsoft Windows 7 Microsoft Windows XP Microsoft Windows embedded Standard Linux Power Consumption Typ. application: tbd. see manual for full details CMOS Battery Backup Temperature Operating: 0 .. +60C Storage: -20 .. +80C Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Size 95 x 125 mm (3.74 x 4.92) www.congatec.comconga-BS57 Block diagram A-B TPM Intel (optional) Gigabit Ethernet PHY 82577LM BIOS (Flash) RTC Processor Board Controller Atmel SPI CORE CORE ATmega168 Mobile Intel HM55 Intel Core i7 6x x1 PCIe Express Chipset Intel Core i5 Intel BD82HM55 PCH Intel Core i3 Intel Celeron BC SPI Graphics Memory CORE Controller Memory Bus Digital Display Hardware Monitoring (800 or 1066 or 1333MHz) Interface and Fan Control Circuitry Only SATA to IDE DDR3-SODIMM conga-BE57 Chip Socket (top) supports ECC ECC memory support for conga-BE57 memory Fan 8 GByte Max. Total Control DDR3-SODIMM Socket (bottom) ECC memory support for conga-BE57 C-D www.congatec.com DMI x4 (Direct Media Interface) Intel FDI (Flexible Display Interface) Watchdog I2C Power Management and Control Signals 1x x1 PCIe Lane Gbit Ethernet 5x x1 PCIe Lanes LPC Bus 1x SATA GPIs/GPOs 1x IDE 3x SATA PCI Bus 8x USB 2.0 1x SDVO High Definition Audio (HDA) I/F SM Bus 3x HDMI/DVI OR LCD I/F (LVDS) 3x DisplayPort (DP) CRT
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