X-On Electronics has gained recognition as a prominent supplier of conga-MA30/HSP-B Heat Sinks across the USA, India, Europe, Australia, and various other global locations. conga-MA30/HSP-B Heat Sinks are a product manufactured by Congatec. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

conga-MA30/HSP-B Congatec

conga-MA30/HSP-B electronic component of Congatec
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Part No.conga-MA30/HSP-B
Manufacturer: Congatec
Category: Heat Sinks
Description: Heat Sinks Standard heatspreader for COM Express Type 10 modules conga-MA3 and MA3E. All standoffs are 2.7mm bore hole.
Datasheet: conga-MA30/HSP-B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 24.8062 ea
Line Total: USD 24.81 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 24.8062
5 : USD 24.8062
10 : USD 24.4247
25 : USD 22.8981

   
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We are delighted to provide the conga-MA30/HSP-B from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the conga-MA30/HSP-B and other electronic components in the Heat Sinks category and beyond.

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POWERFUL AND SMALL conga-MA3 rd - 3 Gen. Intel Atom Intel Celeron processor family - COM Express Mini Type 10 module - High resolution Intel Gen. 7 graphics - Temperature range up to -40C .. +85C Formfactor Formfactor COM Express Mini (55 x 84 mm) Type 10 CPU Intel Atom E3845 1.91GHz Quad Core L2 cache 2MB 10W TDP Intel Atom E3827 1.75GHz Dual Core L2 cache 1MB 8W TDP Intel Atom E3826 1.46GHz Dual Core L2 cache 1MB 7W TDP Intel Atom E3815 1.46GHz Single Core L2 cache 512kB 5W TDP Intel Celeron N2807 1.58GHz Single Core L2 cache 1MB 4.3W TDP Intel Celeron N2930 1.86GHz Quad Core L2 cache 2MB 7.5W TDP DRAM Onboard DDR3L memory support for up to 8 GByte with 1333MT/s Chipset Integrated in SoC Onboard storage eMMC 4.51 interface up to 64GB of MLC NAND up to 4GB of SLC NAND Ethernet Intel I210 Gigabit Ethernet I/O Interfaces Up to 4x PCIe x1 lanes with 5 Gb/s PCI Express 2.0 2x SATA 2.0 3Gb/s ports 7x USB 2.0 1x USB 3.0 LPC SPI IC bus (fast mode 400 kHz, multi-master) SDIO Sound Digital High Definition Audio Interface Graphics Intel HD Graphics Gen 7 Full hardware acceleration for MPEG2 H.264 DirectX11 OCL 1.2 OGL 3.2 WMV9 and VC1 LVDS Single channel LVDS transmitter support for flat panels with 1x18 bit/1x24 bit data mapping up to a resolution of 1920x1200 60Hz. Digital Display Interface Displayport 1.1 up to 2560x1600 or DDI / DVI up to 1920x1200 congatec Board Controller Multi Stage Watchdog non-volatile User Data Storage Manufacturing and Board Information Board Statistics BIOS Setup Data Backup IC bus (fast mode, 400 kHz, multi-master) Power Loss Control Embedded BIOS Features OEM Logo OEM CMOS Defaults LCD Control Display Auto Detection Backlight Control Flash Update based on AMI Aptio UEFI Power Management ACPI 5.0 with battery support Operating Systems Microsoft Windows 10 Microsoft Windows 10 IoT Enterprise Microsoft Windows 10 IoT Core Microsoft Windows 8 Microsoft Windows 7 Linux Microsoft Windows Embedded Standard Microsoft Windows 7 Embedded Compact Android Yokto MoonIsland / WindRiver IDP Power Consumption Typ. application: see users guide for full details Temperature Commercial : Operating: 0 to +60C Storage: -20 to +80C Industrial : Operating: -40 to +85C Storage: -45 to +85C Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Size 55 x 84 mm (2.17 x 3.31) www.congatec.comconga-MA3 Block diagram COM Express 2.1 Type 10 Intel Bay Trail SoC A-B Connector VGA X COMPUTE UNIT DDIO DDIO conga-MA3 conga-MA3E eDP (Assembly Option) PROCESSOR CORE Tri-gate 3-D 22nm Quad core SoC CH0 4 On-module DDR3L 8 On-module DDR3L 1MB L2 cache shared by 2 cores (Up to 4GB) (Up to 8GB) 1x24bpp eDP1 MUX LVDS/eDP eDP to LVDS LVDS Core 1 Core 2 Core 3 Core 4 PCIe0 x1 PCIe Port 0 SSE4.2 AES AVX VT-x PCIe1 x1 PCIe Port 1 CH1 4 On-module DDR3L 1 On-module DDR3L PCIe2 x1 (Up to 4GB) (ECC module) PCIe Port 2 SoC TRANSACTION ROUTER PCIe3 x1 1333 MT/s, non-ECC 1333 MT/s, ECC PCIe Port 3 DISPLAY & GRAPHICS MUX Interfaces DisplayPort DDI VGA LVDS Ethernet PCIe to GBE Multimedia Features NOTE: MPEG-2 WMV9 SVC SAMU The conga-MA3 supports up to 4 GB single channel or H.264 DivX WMV MVC up to 8 GB dual channel non-ECC DDR3L-1333 MT/s. DirectX 11 OpenGL 3.0 OpenGLES 2.0 USB SuperSpeed 0 USB 3.0 Port 0 OpenCL 1.2 The conga-MA3E supports up to 8 GB single channel USB0 2.0 USB Port 0 ECC DDR3L-1333 MT/s . USB1 2.0 USB Port 1 IMAGE PROCESSING USB2 2.0 USB Port 5 MIPI-CSI 2.0 Up to 24MP ISP Full HD USB USB3 2.0 USB Port 2 3 4 6 4 Port Hub HDA I/F eMMC 4.5 eMMC Flash INTEGRATED I/O 2x SATA 3G (optional) Integrated I/O Interfaces SATA Port 0..1 BIOS Flash SATA USB 2.0 USB 3.0 SPI SPI Bus PCIe LPC Bus GPIOs UART1,2 HD Audio SPI PCU 2x UART SDIO SDIO/GPIOs MUX LPC LPC Bus GPI/GPO SM Bus SM Bus I2C congatec I2C Bus Board Controller LID /SLEEP LID /SLEEP FAN Fan Control conga-MA3 Order Information Article PN Description conga-MA3/E3845-4G 047400 Intel Atom E3845 quad core processor with 1.91GHz 2MB L2 cache 4GB 1333MT/s DDR3L onboard memory and 8GB eMMC eMMC8 onboard flash. conga-v MA3/E3827-2G 047401 Intel Atom E3827 dual core processor with 1.75GHz 1MB L2 cache 2GB 1333MT/s DDR3L onboard memory and 4GB eMMC eMMC4 onboard flash. conga-MA3/E3826-2G 047402 Intel Atom E3826 dual core processor with 1.46GHz 1MB L2 cache 2GB 1066MT/s DDR3L onboard memory and 4GB eMMC eMMC4 onboard flash. conga-MA3/E3815-2G 047404 Intel Atom E3815 single core processor with 1.46GHz 512kB L2 cache 2GB 1066MT/s DDR3L onboard memory. conga-MA3/N2930-2G 047406 Intel Celeron N2930 quad core processor with 1.83GHz up to 2.16GHz 2MB L2 cache and 2GB 1333MT/s DDR3L onboard memory. Low power consumption with 7.5W TDP conga-MA3/N2807-2G 047407 Intel Celeron N2807 single core processor with 1.58GHz up to 2.16GHz 1MB L2 cache and 2GB 1333MT/s DDR3L onboard memory. Low power consumption with 4.3W TDP conga-MA3/i-E3845-4G 047410 Intel Atom E3845 quad core processor with 1.91GHz 2MB L2 cache 4GB 1333MT/s DDR3L onboard memory and 8GB eMMC eMMC8 onboard flash. Industrial grade temperature range from -40C to 85C. conga-MA3/i-E3827-2G 047411 Intel Atom E3827 dual core processor with 1.75GHz 1MB L2 cache 2GB 1333MT/s DDR3L onboard memory and 4GB eMMC eMMC4 onboard flash. Industrial grade temperature range from -40C to 85C conga- MA3/i-E3845-2G 047413 Intel Atom E3845 quad core processor with 1.91GHz 2MB L2 cache 2GB 1333MT/s DDR3L onboard memory and 4GB eMMC eMMC4 onboard flash. Industrial grade temperature range from -40C to 85C. conga-MA3/i-E3815-2G 047414 Intel Atom E3815 single core processor with 1.46GHz 512kB L2 cache 2GB 1066MT/s DDR3L onboard memory. Industrial grade temperature range from -40C to 85C. conga-MA30/HSP-T 047450 Standard heatspreader for COM Express Type 10 module conga-MA3. All standoffs are M2.5 thread. conga-MA30/HSP-B 047451 Standard heatspreader for COM Express Type 10 module conga-MA3. All standoffs are 2.7mm bore hole. conga-MA30/CSP-T 047452 Standard passive cooling solution for COM Express Type 10 module conga-MA3 with fins. All standoffs are M2.5mm thread. conga-MA30/CSP-B 047453 Standard passive cooling solution for COM Express Type 10 module conga-MA3 with fins. All standoffs are 2.7mm bore hole. Accessories conga-MEVAL 065400 Evaluation carrier board for Type 10 COM-Express-modules conga-LDVI/EPI 011115 LVDS to DVI converter board for digital flat panels with onboard EEPROM 2021 congatec GmbH. All rights All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. April,14 2021, KF www.congatec.com MEMORY CONTROLLER (1066 or 1333 MT/s) high performance low power

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7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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